JPS6427293A - Method of mount chip component - Google Patents

Method of mount chip component

Info

Publication number
JPS6427293A
JPS6427293A JP18431887A JP18431887A JPS6427293A JP S6427293 A JPS6427293 A JP S6427293A JP 18431887 A JP18431887 A JP 18431887A JP 18431887 A JP18431887 A JP 18431887A JP S6427293 A JPS6427293 A JP S6427293A
Authority
JP
Japan
Prior art keywords
chip component
fittings
soldering
module
subboard
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18431887A
Other languages
Japanese (ja)
Inventor
Hajime Sumitani
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP18431887A priority Critical patent/JPS6427293A/en
Publication of JPS6427293A publication Critical patent/JPS6427293A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

PURPOSE:To decrease various effects due to soldering operation such as thermal stress to a chip component or the like and to improve the reliability, by previously soldering a chip component on a subboard having a smaller heat capacity for forming a module and soldering this module on projected parts of fittings. CONSTITUTION:A pair of fittings 5 having profile of 'U' laid down on the side when viewed from the side have upper legs folded upwards at the ends thereof to provide projections 51, while lower legs thereof are soldered on electrode patterns 2 provided on a circuit board 1 on which a chip component 4 is to be mounted. A module 7 in which the chip component 4 is mounted on a subboard 6 having conductor patterns 63 at the both ends is mounted over the upper legs of the fittings 5, and the projections 51 are removably soldered to the conductor patterns 63. Since the moduled component is solder mounted on the fittings, the soldering can be carried out with a reduced amount of heat and hence the chip component is subjected to reduced thermal stress. Accordingly, the reliability of the product as well as working efficiency of exchanging components for readjustment can be improved.
JP18431887A 1987-07-22 1987-07-22 Method of mount chip component Pending JPS6427293A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18431887A JPS6427293A (en) 1987-07-22 1987-07-22 Method of mount chip component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18431887A JPS6427293A (en) 1987-07-22 1987-07-22 Method of mount chip component

Publications (1)

Publication Number Publication Date
JPS6427293A true JPS6427293A (en) 1989-01-30

Family

ID=16151235

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18431887A Pending JPS6427293A (en) 1987-07-22 1987-07-22 Method of mount chip component

Country Status (1)

Country Link
JP (1) JPS6427293A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0701298A3 (en) * 1994-09-08 1997-05-02 At & T Corp Low inductance surface-mount connectors for interconnecting circuit devices and method for using same
JP2014120739A (en) * 2012-12-19 2014-06-30 Shindengen Electric Mfg Co Ltd Surface mounted type electric device, mother board equipped with the same, and manufacturing method of mother board equipped with the same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0701298A3 (en) * 1994-09-08 1997-05-02 At & T Corp Low inductance surface-mount connectors for interconnecting circuit devices and method for using same
JP2014120739A (en) * 2012-12-19 2014-06-30 Shindengen Electric Mfg Co Ltd Surface mounted type electric device, mother board equipped with the same, and manufacturing method of mother board equipped with the same

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