JPS6473795A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS6473795A
JPS6473795A JP62231530A JP23153087A JPS6473795A JP S6473795 A JPS6473795 A JP S6473795A JP 62231530 A JP62231530 A JP 62231530A JP 23153087 A JP23153087 A JP 23153087A JP S6473795 A JPS6473795 A JP S6473795A
Authority
JP
Japan
Prior art keywords
connector
adjacent
length
pattern
patterns
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62231530A
Other languages
Japanese (ja)
Inventor
Seiichi Mimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP62231530A priority Critical patent/JPS6473795A/en
Publication of JPS6473795A publication Critical patent/JPS6473795A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Multi-Conductor Connections (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

PURPOSE:To perform heat compression bonding by a heater stably and effectively, by alternately offsetting positions for the formation of adjacent connector junction patterns and differentiating the length of connector leads. CONSTITUTION:A connector junction pattern 3a is formed so as to have a specified length from the end face of a semiconductor packaging substrate 1 and a connector junction pattern 3b is formed at a position spaced apart from the end face of the semiconductor packaging substrate by a length longer than the length of the pattern 3a and disposed in a zigzag manner at the intermediate position between the patterns 3a. Since in the thus formed semiconductor device, adjacent patterns 3a and 3b are formed with their positions offset each other, it is possible to secure a wide space between solders interposing between the adjacent connector leads. As a result, in performing heat compression bonding by a heater from the above, it is possible to prevent the adjacent leads from being connected with each other even when the solder overflows considerably outside the connector connetcting pattern due to too much amount of the solder being used.
JP62231530A 1987-09-16 1987-09-16 Semiconductor device Pending JPS6473795A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62231530A JPS6473795A (en) 1987-09-16 1987-09-16 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62231530A JPS6473795A (en) 1987-09-16 1987-09-16 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS6473795A true JPS6473795A (en) 1989-03-20

Family

ID=16924934

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62231530A Pending JPS6473795A (en) 1987-09-16 1987-09-16 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS6473795A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0415872U (en) * 1990-05-30 1992-02-07
JP2009199827A (en) * 2008-02-20 2009-09-03 Japan Aviation Electronics Industry Ltd Connector
JPWO2009093362A1 (en) * 2008-01-22 2011-05-26 シャープ株式会社 Lighting device, display device, and television receiver

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0415872U (en) * 1990-05-30 1992-02-07
JPWO2009093362A1 (en) * 2008-01-22 2011-05-26 シャープ株式会社 Lighting device, display device, and television receiver
JP2009199827A (en) * 2008-02-20 2009-09-03 Japan Aviation Electronics Industry Ltd Connector

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