JPS55125637A - Production of semiconductor device - Google Patents

Production of semiconductor device

Info

Publication number
JPS55125637A
JPS55125637A JP3311479A JP3311479A JPS55125637A JP S55125637 A JPS55125637 A JP S55125637A JP 3311479 A JP3311479 A JP 3311479A JP 3311479 A JP3311479 A JP 3311479A JP S55125637 A JPS55125637 A JP S55125637A
Authority
JP
Japan
Prior art keywords
lead
film
hole
deformation
given
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3311479A
Other languages
Japanese (ja)
Other versions
JPS5854499B2 (en
Inventor
Haruo Kojima
Takashi Haraguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP54033114A priority Critical patent/JPS5854499B2/en
Publication of JPS55125637A publication Critical patent/JPS55125637A/en
Publication of JPS5854499B2 publication Critical patent/JPS5854499B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To prevent the deformation and contact of the lead by connecting it to a package or the wiring pattern of the circuit board maintaining a given with the outside end of the lead fixed on the fine piece of the insulated film. CONSTITUTION:A rectangular element housing hole 14 is provided on the polyimide film 1 while notchs 11 are provided at four corners. A copper foil provided on the surface thereof undergoes a photoetching in a specified shape and given a non-electrolyte plating to make a lead 6. A metal bump of a semiconducor elememt 7 is connected to the tip of the lead 6 projected toward a hole 14 under pressure and heat. Then, the lead 6 is cut together with the film 1 outside each side of the hole 14 as well as inward from the extreme end of the notch, bent with the section attached by a strip 12 of the film, and connected to the wire pattern 10 such as seramic substrate by pressing under heat. In this method, the deformation of the lead and the deviation of the pitch can be eliminated thereby facilitating the positioning and improving the working efficiency.
JP54033114A 1979-03-20 1979-03-20 Manufacturing method of semiconductor device Expired JPS5854499B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP54033114A JPS5854499B2 (en) 1979-03-20 1979-03-20 Manufacturing method of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP54033114A JPS5854499B2 (en) 1979-03-20 1979-03-20 Manufacturing method of semiconductor device

Publications (2)

Publication Number Publication Date
JPS55125637A true JPS55125637A (en) 1980-09-27
JPS5854499B2 JPS5854499B2 (en) 1983-12-05

Family

ID=12377611

Family Applications (1)

Application Number Title Priority Date Filing Date
JP54033114A Expired JPS5854499B2 (en) 1979-03-20 1979-03-20 Manufacturing method of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5854499B2 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5874352U (en) * 1981-11-13 1983-05-19 リコーエレメックス株式会社 circuit board
JPS59175132A (en) * 1983-03-23 1984-10-03 Nec Corp Manufacture of semiconductor device according to tape carrier system
JPS62238684A (en) * 1986-04-10 1987-10-19 松下電器産業株式会社 Lead connection
US4903113A (en) * 1988-01-15 1990-02-20 International Business Machines Corporation Enhanced tab package

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5874352U (en) * 1981-11-13 1983-05-19 リコーエレメックス株式会社 circuit board
JPS59175132A (en) * 1983-03-23 1984-10-03 Nec Corp Manufacture of semiconductor device according to tape carrier system
JPH0212025B2 (en) * 1983-03-23 1990-03-16 Nippon Electric Co
JPS62238684A (en) * 1986-04-10 1987-10-19 松下電器産業株式会社 Lead connection
JPH0773154B2 (en) * 1986-04-10 1995-08-02 松下電器産業株式会社 Lead connection method
US4903113A (en) * 1988-01-15 1990-02-20 International Business Machines Corporation Enhanced tab package

Also Published As

Publication number Publication date
JPS5854499B2 (en) 1983-12-05

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