JPS55125637A - Production of semiconductor device - Google Patents
Production of semiconductor deviceInfo
- Publication number
- JPS55125637A JPS55125637A JP3311479A JP3311479A JPS55125637A JP S55125637 A JPS55125637 A JP S55125637A JP 3311479 A JP3311479 A JP 3311479A JP 3311479 A JP3311479 A JP 3311479A JP S55125637 A JPS55125637 A JP S55125637A
- Authority
- JP
- Japan
- Prior art keywords
- lead
- film
- hole
- deformation
- given
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
PURPOSE:To prevent the deformation and contact of the lead by connecting it to a package or the wiring pattern of the circuit board maintaining a given with the outside end of the lead fixed on the fine piece of the insulated film. CONSTITUTION:A rectangular element housing hole 14 is provided on the polyimide film 1 while notchs 11 are provided at four corners. A copper foil provided on the surface thereof undergoes a photoetching in a specified shape and given a non-electrolyte plating to make a lead 6. A metal bump of a semiconducor elememt 7 is connected to the tip of the lead 6 projected toward a hole 14 under pressure and heat. Then, the lead 6 is cut together with the film 1 outside each side of the hole 14 as well as inward from the extreme end of the notch, bent with the section attached by a strip 12 of the film, and connected to the wire pattern 10 such as seramic substrate by pressing under heat. In this method, the deformation of the lead and the deviation of the pitch can be eliminated thereby facilitating the positioning and improving the working efficiency.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP54033114A JPS5854499B2 (en) | 1979-03-20 | 1979-03-20 | Manufacturing method of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP54033114A JPS5854499B2 (en) | 1979-03-20 | 1979-03-20 | Manufacturing method of semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS55125637A true JPS55125637A (en) | 1980-09-27 |
JPS5854499B2 JPS5854499B2 (en) | 1983-12-05 |
Family
ID=12377611
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP54033114A Expired JPS5854499B2 (en) | 1979-03-20 | 1979-03-20 | Manufacturing method of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5854499B2 (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5874352U (en) * | 1981-11-13 | 1983-05-19 | リコーエレメックス株式会社 | circuit board |
JPS59175132A (en) * | 1983-03-23 | 1984-10-03 | Nec Corp | Manufacture of semiconductor device according to tape carrier system |
JPS62238684A (en) * | 1986-04-10 | 1987-10-19 | 松下電器産業株式会社 | Lead connection |
US4903113A (en) * | 1988-01-15 | 1990-02-20 | International Business Machines Corporation | Enhanced tab package |
-
1979
- 1979-03-20 JP JP54033114A patent/JPS5854499B2/en not_active Expired
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5874352U (en) * | 1981-11-13 | 1983-05-19 | リコーエレメックス株式会社 | circuit board |
JPS59175132A (en) * | 1983-03-23 | 1984-10-03 | Nec Corp | Manufacture of semiconductor device according to tape carrier system |
JPH0212025B2 (en) * | 1983-03-23 | 1990-03-16 | Nippon Electric Co | |
JPS62238684A (en) * | 1986-04-10 | 1987-10-19 | 松下電器産業株式会社 | Lead connection |
JPH0773154B2 (en) * | 1986-04-10 | 1995-08-02 | 松下電器産業株式会社 | Lead connection method |
US4903113A (en) * | 1988-01-15 | 1990-02-20 | International Business Machines Corporation | Enhanced tab package |
Also Published As
Publication number | Publication date |
---|---|
JPS5854499B2 (en) | 1983-12-05 |
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