JPS5638848A - Method for attaching transistor - Google Patents

Method for attaching transistor

Info

Publication number
JPS5638848A
JPS5638848A JP10215780A JP10215780A JPS5638848A JP S5638848 A JPS5638848 A JP S5638848A JP 10215780 A JP10215780 A JP 10215780A JP 10215780 A JP10215780 A JP 10215780A JP S5638848 A JPS5638848 A JP S5638848A
Authority
JP
Japan
Prior art keywords
main body
soldering
transistor
tips
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10215780A
Other languages
Japanese (ja)
Other versions
JPS5757876B2 (en
Inventor
Masuo Tokumaru
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP10215780A priority Critical patent/JPS5638848A/en
Publication of JPS5638848A publication Critical patent/JPS5638848A/en
Publication of JPS5757876B2 publication Critical patent/JPS5757876B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/818—Bonding techniques
    • H01L2224/81801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components

Abstract

PURPOSE:To facilitate the soldering process to a substrate and to facilitate the fixing work of a transistor main body to a heat radiator by bending the tips of the lead wire of a transistor at the two points of said tips at an angle less than 90 deg. so as to form an S shape. CONSTITUTION:Tip portions 9 of a plurality of lead wires 8 of a transistor main body are bent at an angle less than 90 , and the tips of said tip portions 9 are further bent in the opposite direction at the similar angle. In the case such lead wires 8 are inserted in a hole 11 of a circuit substrate 10, since the main body 7 is positioned above the circit substrate 10, the main body 7 does not contact the soldering liquid when the soldering is performed by an immersion soldering method. In order to fix the main body 7 to a heat radiator 12, the main body is compressed in the arrow direction. In this case, the soldering portion is not subjected to adverse effects.
JP10215780A 1980-07-24 1980-07-24 Method for attaching transistor Granted JPS5638848A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10215780A JPS5638848A (en) 1980-07-24 1980-07-24 Method for attaching transistor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10215780A JPS5638848A (en) 1980-07-24 1980-07-24 Method for attaching transistor

Publications (2)

Publication Number Publication Date
JPS5638848A true JPS5638848A (en) 1981-04-14
JPS5757876B2 JPS5757876B2 (en) 1982-12-07

Family

ID=14319885

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10215780A Granted JPS5638848A (en) 1980-07-24 1980-07-24 Method for attaching transistor

Country Status (1)

Country Link
JP (1) JPS5638848A (en)

Also Published As

Publication number Publication date
JPS5757876B2 (en) 1982-12-07

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