JPS5465441A - Magnetic bubble memory package - Google Patents

Magnetic bubble memory package

Info

Publication number
JPS5465441A
JPS5465441A JP13228977A JP13228977A JPS5465441A JP S5465441 A JPS5465441 A JP S5465441A JP 13228977 A JP13228977 A JP 13228977A JP 13228977 A JP13228977 A JP 13228977A JP S5465441 A JPS5465441 A JP S5465441A
Authority
JP
Japan
Prior art keywords
wire
chip
pattern
substrate
memory package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13228977A
Other languages
Japanese (ja)
Inventor
Itaru Otake
Yuichi Enomoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP13228977A priority Critical patent/JPS5465441A/en
Publication of JPS5465441A publication Critical patent/JPS5465441A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To avoid the disconnection of the wire by placing the bubble chip obliquely to the substrate and along the dip of the lead wire, giving a bonding with a small angle between a terminal of the lead and the terminal of the bubble chip and thus decreasing the bending at the neck part.
CONSTITUTION: Bubble chip 3 is placed obliquely on bottom 2a of concavity 2 of substrate 1, and this slope is made to go along the curve caused by the dip of lead wire 6 of chip 3. Then one end 6a of lead wire 6 is bonded via the ultrasonic solution to pattern 5 of chip 3. At the same time, one end of wire 6 is bonded to pattern 4 provided to substrate 1. The angle between wire 6 and pattern 5 is decreased and thus the bend is reduced at neck part 6b, thus preventing the disconnection of wire 6.
COPYRIGHT: (C)1979,JPO&Japio
JP13228977A 1977-11-04 1977-11-04 Magnetic bubble memory package Pending JPS5465441A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13228977A JPS5465441A (en) 1977-11-04 1977-11-04 Magnetic bubble memory package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13228977A JPS5465441A (en) 1977-11-04 1977-11-04 Magnetic bubble memory package

Publications (1)

Publication Number Publication Date
JPS5465441A true JPS5465441A (en) 1979-05-26

Family

ID=15077795

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13228977A Pending JPS5465441A (en) 1977-11-04 1977-11-04 Magnetic bubble memory package

Country Status (1)

Country Link
JP (1) JPS5465441A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5814298U (en) * 1981-07-16 1983-01-28 日本電気株式会社 magnetic bubble memory module
JPS5883379A (en) * 1981-11-09 1983-05-19 Hitachi Ltd Bubble memory device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5814298U (en) * 1981-07-16 1983-01-28 日本電気株式会社 magnetic bubble memory module
JPS5883379A (en) * 1981-11-09 1983-05-19 Hitachi Ltd Bubble memory device

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