JPS52152165A - Formation of solder bump electrode - Google Patents

Formation of solder bump electrode

Info

Publication number
JPS52152165A
JPS52152165A JP6880776A JP6880776A JPS52152165A JP S52152165 A JPS52152165 A JP S52152165A JP 6880776 A JP6880776 A JP 6880776A JP 6880776 A JP6880776 A JP 6880776A JP S52152165 A JPS52152165 A JP S52152165A
Authority
JP
Japan
Prior art keywords
formation
solder bump
bump electrode
bump electrodes
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6880776A
Other languages
Japanese (ja)
Inventor
Kiyotake Naraoka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP6880776A priority Critical patent/JPS52152165A/en
Publication of JPS52152165A publication Critical patent/JPS52152165A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/268—Pb as the principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE:To reduce spreading and form bump electrodes by forming a copper layer of poor wetting characteristics on the surface of electrode terminals to be formed with bump electrodes and formin electrode of lead-tin solder thereon.
JP6880776A 1976-06-14 1976-06-14 Formation of solder bump electrode Pending JPS52152165A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6880776A JPS52152165A (en) 1976-06-14 1976-06-14 Formation of solder bump electrode

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6880776A JPS52152165A (en) 1976-06-14 1976-06-14 Formation of solder bump electrode

Publications (1)

Publication Number Publication Date
JPS52152165A true JPS52152165A (en) 1977-12-17

Family

ID=13384343

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6880776A Pending JPS52152165A (en) 1976-06-14 1976-06-14 Formation of solder bump electrode

Country Status (1)

Country Link
JP (1) JPS52152165A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56108245A (en) * 1980-01-31 1981-08-27 Fujitsu Ltd Semiconductor device
JPS56114358A (en) * 1980-02-15 1981-09-08 Hitachi Ltd Semiconductor device and manufacture
JPS56144560A (en) * 1980-04-10 1981-11-10 Mitsubishi Electric Corp Flip chip type transistor and manufacture thereof
JPS5948941A (en) * 1982-09-14 1984-03-21 Seiko Instr & Electronics Ltd Forming method for solder bump
JP2012049207A (en) * 2010-08-25 2012-03-08 Ulvac Seimaku Kk Method of forming bump

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56108245A (en) * 1980-01-31 1981-08-27 Fujitsu Ltd Semiconductor device
JPS56114358A (en) * 1980-02-15 1981-09-08 Hitachi Ltd Semiconductor device and manufacture
JPS56144560A (en) * 1980-04-10 1981-11-10 Mitsubishi Electric Corp Flip chip type transistor and manufacture thereof
JPS5948941A (en) * 1982-09-14 1984-03-21 Seiko Instr & Electronics Ltd Forming method for solder bump
JP2012049207A (en) * 2010-08-25 2012-03-08 Ulvac Seimaku Kk Method of forming bump

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