JPS56108245A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS56108245A
JPS56108245A JP1037180A JP1037180A JPS56108245A JP S56108245 A JPS56108245 A JP S56108245A JP 1037180 A JP1037180 A JP 1037180A JP 1037180 A JP1037180 A JP 1037180A JP S56108245 A JPS56108245 A JP S56108245A
Authority
JP
Japan
Prior art keywords
bump electrode
layer
wiring
metal layer
foundation metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1037180A
Other languages
Japanese (ja)
Inventor
Yuichi Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP1037180A priority Critical patent/JPS56108245A/en
Publication of JPS56108245A publication Critical patent/JPS56108245A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H01L2224/13001—Core members of the bump connector
    • H01L2224/13099—Material

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Abstract

PURPOSE:To improve wiring efficiency by making the foundation metal layer whose one end is brought into contact with one given wiring layer extend over the insulating layer and providing a bump electrode on the other end. CONSTITUTION:One end of the foundation metal layer 4 is brought into contact with a given wiring layer 3a in an electrode window 6 and the other end is made to extend over to the position of a bump electrode 5. By said constitution, another wiring layer 3b insulated from the foundation metal layer 4 by an insulating layer 2' can be provided under the bump electrode 5. Accordingly, wiring efficiency can be improved without restrictions on design due to the bump electrode 5.
JP1037180A 1980-01-31 1980-01-31 Semiconductor device Pending JPS56108245A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1037180A JPS56108245A (en) 1980-01-31 1980-01-31 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1037180A JPS56108245A (en) 1980-01-31 1980-01-31 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS56108245A true JPS56108245A (en) 1981-08-27

Family

ID=11748287

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1037180A Pending JPS56108245A (en) 1980-01-31 1980-01-31 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS56108245A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56114358A (en) * 1980-02-15 1981-09-08 Hitachi Ltd Semiconductor device and manufacture

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52152165A (en) * 1976-06-14 1977-12-17 Hitachi Ltd Formation of solder bump electrode

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52152165A (en) * 1976-06-14 1977-12-17 Hitachi Ltd Formation of solder bump electrode

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56114358A (en) * 1980-02-15 1981-09-08 Hitachi Ltd Semiconductor device and manufacture

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