JPS5232670A - Flip chip solder bump - Google Patents

Flip chip solder bump

Info

Publication number
JPS5232670A
JPS5232670A JP50108788A JP10878875A JPS5232670A JP S5232670 A JPS5232670 A JP S5232670A JP 50108788 A JP50108788 A JP 50108788A JP 10878875 A JP10878875 A JP 10878875A JP S5232670 A JPS5232670 A JP S5232670A
Authority
JP
Japan
Prior art keywords
flip chip
solder bump
chip solder
piling
consecutively
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP50108788A
Other languages
Japanese (ja)
Inventor
Masayuki Kataoka
Takayoshi Kawakami
Shiro Yokota
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP50108788A priority Critical patent/JPS5232670A/en
Publication of JPS5232670A publication Critical patent/JPS5232670A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE:To secure a high-strength bump with easy manufacturing process by piling solder layers in such a way that the fusing point of each layer lowers consecutively.
JP50108788A 1975-09-08 1975-09-08 Flip chip solder bump Pending JPS5232670A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50108788A JPS5232670A (en) 1975-09-08 1975-09-08 Flip chip solder bump

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50108788A JPS5232670A (en) 1975-09-08 1975-09-08 Flip chip solder bump

Publications (1)

Publication Number Publication Date
JPS5232670A true JPS5232670A (en) 1977-03-12

Family

ID=14493484

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50108788A Pending JPS5232670A (en) 1975-09-08 1975-09-08 Flip chip solder bump

Country Status (1)

Country Link
JP (1) JPS5232670A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57190020A (en) * 1981-05-20 1982-11-22 Dainippon Ink & Chem Inc Preparation of polyester
JPS58197751A (en) * 1982-05-13 1983-11-17 Mitsubishi Electric Corp Formation of salient electrode
JPS5930854A (en) * 1982-08-11 1984-02-18 Teijin Ltd Polyester composition
JPH07226400A (en) * 1993-06-18 1995-08-22 Kawasaki Steel Corp Semiconductor device and its manufacture

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4878874A (en) * 1972-01-20 1973-10-23
JPS4962306A (en) * 1972-10-19 1974-06-17
JPS504666B1 (en) * 1970-12-25 1975-02-22

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS504666B1 (en) * 1970-12-25 1975-02-22
JPS4878874A (en) * 1972-01-20 1973-10-23
JPS4962306A (en) * 1972-10-19 1974-06-17

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57190020A (en) * 1981-05-20 1982-11-22 Dainippon Ink & Chem Inc Preparation of polyester
JPS58197751A (en) * 1982-05-13 1983-11-17 Mitsubishi Electric Corp Formation of salient electrode
JPS5930854A (en) * 1982-08-11 1984-02-18 Teijin Ltd Polyester composition
JPH0563506B2 (en) * 1982-08-11 1993-09-10 Teijin Ltd
JPH07226400A (en) * 1993-06-18 1995-08-22 Kawasaki Steel Corp Semiconductor device and its manufacture

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