JPS5457958A - Production of semiconductor device - Google Patents

Production of semiconductor device

Info

Publication number
JPS5457958A
JPS5457958A JP12548977A JP12548977A JPS5457958A JP S5457958 A JPS5457958 A JP S5457958A JP 12548977 A JP12548977 A JP 12548977A JP 12548977 A JP12548977 A JP 12548977A JP S5457958 A JPS5457958 A JP S5457958A
Authority
JP
Japan
Prior art keywords
solder
jig
cathode
gate
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12548977A
Other languages
Japanese (ja)
Inventor
Toshiaki Matoba
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP12548977A priority Critical patent/JPS5457958A/en
Publication of JPS5457958A publication Critical patent/JPS5457958A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Thyristors (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE: To prevent soldering defectives with a simple jig by using a solder plate which is obtained by uniting a gate solder and a cathode solder into one.
CONSTITUTION: Anode solder 9 is put at the bottom of a jig, and a pellet is so put in the jig that anode electrode 6 may be facedown. Next, solder plate 20 is prepared which has a shape of the pattern formed by gate 7 and cathode 8 of the pellet and the mutual positional relation and has gate solder part 12 and cathode solder part 13 having a thickness of 0.2mm and solder band 14 which links parts 12 and 13 and is the same metal as them and is 0.1 to 0.2 mm wide and 0.2 mm thick. Solder plate 20 is put in the jig; and when the plate is put on electrodes of gate 7 and cathode 8 and is soldered, the solder of band 14 is attracted to both sides by the surface tension of parts 12 and 13 and does not remain on oxide film 5. Thus, soldering defectives can be prevented with the simple jig
COPYRIGHT: (C)1979,JPO&Japio
JP12548977A 1977-10-18 1977-10-18 Production of semiconductor device Pending JPS5457958A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12548977A JPS5457958A (en) 1977-10-18 1977-10-18 Production of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12548977A JPS5457958A (en) 1977-10-18 1977-10-18 Production of semiconductor device

Publications (1)

Publication Number Publication Date
JPS5457958A true JPS5457958A (en) 1979-05-10

Family

ID=14911349

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12548977A Pending JPS5457958A (en) 1977-10-18 1977-10-18 Production of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5457958A (en)

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