JPS57196554A - Manufacture of lead frame - Google Patents

Manufacture of lead frame

Info

Publication number
JPS57196554A
JPS57196554A JP8002781A JP8002781A JPS57196554A JP S57196554 A JPS57196554 A JP S57196554A JP 8002781 A JP8002781 A JP 8002781A JP 8002781 A JP8002781 A JP 8002781A JP S57196554 A JPS57196554 A JP S57196554A
Authority
JP
Japan
Prior art keywords
lead frame
punching
manufacture
bending
step part
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8002781A
Other languages
Japanese (ja)
Inventor
Shuji Yoshizawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KIYOUSHIN KOGYO KK
Kyoshin Kogyo KK
Original Assignee
KIYOUSHIN KOGYO KK
Kyoshin Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KIYOUSHIN KOGYO KK, Kyoshin Kogyo KK filed Critical KIYOUSHIN KOGYO KK
Priority to JP8002781A priority Critical patent/JPS57196554A/en
Publication of JPS57196554A publication Critical patent/JPS57196554A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49548—Cross section geometry
    • H01L23/49551—Cross section geometry characterised by bent parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To form a lead frame of good quality by a method wherein after the step part of lead frame is formed by punching, a protruding piece of the supporting band is formed by punching and bending, and then the other part is formed by punching. CONSTITUTION:After the part 22 to constitute the step part of the lead frame 10 is formed by punching, the step part is formed. Then the protruding piece 24 is formed in the C-shaped clip type 16 by punching and bending at the supporting band 12 on one side. Finally, the remaining part 20 of the lead terminal part 14 between a pair of supporting bands 12, 12' is formed by punching to form the lead frame. Accordingly the lead frame having the nearly C-shaped clip can be formed having good quality.
JP8002781A 1981-05-28 1981-05-28 Manufacture of lead frame Pending JPS57196554A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8002781A JPS57196554A (en) 1981-05-28 1981-05-28 Manufacture of lead frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8002781A JPS57196554A (en) 1981-05-28 1981-05-28 Manufacture of lead frame

Publications (1)

Publication Number Publication Date
JPS57196554A true JPS57196554A (en) 1982-12-02

Family

ID=13706790

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8002781A Pending JPS57196554A (en) 1981-05-28 1981-05-28 Manufacture of lead frame

Country Status (1)

Country Link
JP (1) JPS57196554A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4785533A (en) * 1986-02-21 1988-11-22 Hitachi, Ltd. Hybrid integrated circuit device, and method of and lead frame for use in manufacturing same
JP2003124423A (en) * 2001-10-10 2003-04-25 Shinko Electric Ind Co Ltd Lead frame and manufacturing method therefor

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4785533A (en) * 1986-02-21 1988-11-22 Hitachi, Ltd. Hybrid integrated circuit device, and method of and lead frame for use in manufacturing same
JP2003124423A (en) * 2001-10-10 2003-04-25 Shinko Electric Ind Co Ltd Lead frame and manufacturing method therefor

Similar Documents

Publication Publication Date Title
ZA824357B (en) Polyvinylmethylphosphinic acid, process for its manufacture and use
IE45727L (en) Aralkenylaminomethylnaphthalenes
ES8202706A1 (en) Contoured stamping die and method of manufacture thereof.
JPS5317265A (en) Tight adhesion method between metallic part and insulating material
JPS57196554A (en) Manufacture of lead frame
JPS534880A (en) Hooking and soldering wire to terminal member
AU5887480A (en) Palladium electrode in production sulfuric acid
JPS52123731A (en) Packet frame and fabricating method of
JPS54124677A (en) Semiconductor device
JPS5593245A (en) Lead frame
ES8702441A1 (en) Highly solubilized protein and production thereof.
JPS5433247A (en) Metal bonding method
JPS5419652A (en) Lead bonding method
JPS5521118A (en) Lead frame
JPS6450454A (en) Manufacture of lead frame and semiconductor device
JPS57155760A (en) Lead frame used for semiconductor and assembly and manufacture thereof
JPS56158462A (en) Lead frame for single inline semiconductor device
JPS5596663A (en) Method of fabricating semiconductor device
JPS5439343A (en) Bonding method
ES479512A1 (en) A method of making a connection between a metal member and a metal braid.
JPS5710954A (en) Semiconductor device
JPS5355740A (en) Connecting method of transformer
JPS55133826A (en) Chain type terminal post and its manufacture
JPS52103692A (en) Jack terminal
JPS5351969A (en) Manufacture for electronic component