JPS6059761A - Preliminarily soldering device - Google Patents

Preliminarily soldering device

Info

Publication number
JPS6059761A
JPS6059761A JP16958183A JP16958183A JPS6059761A JP S6059761 A JPS6059761 A JP S6059761A JP 16958183 A JP16958183 A JP 16958183A JP 16958183 A JP16958183 A JP 16958183A JP S6059761 A JPS6059761 A JP S6059761A
Authority
JP
Japan
Prior art keywords
frame
external lead
rollers
lead
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16958183A
Other languages
Japanese (ja)
Inventor
Junichi Yoshioka
吉岡　順一
Kunio Kobayashi
邦夫 小林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP16958183A priority Critical patent/JPS6059761A/en
Publication of JPS6059761A publication Critical patent/JPS6059761A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H05K13/0465—Surface mounting by soldering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Molten Solder (AREA)

Abstract

PURPOSE:To facilitate the automation preliminarily soldering work of external lead conductors by inverting upside down a leadframe of long length formed with a plurality of resin sealed portions at the end of an external lead conductor which is extended toward the middle portion from parallel two frame strips. CONSTITUTION:Rollers 6a, 6b are adjusted in height to be submerged in molten solder ejected from a solder tank 8a at the portion externally extended from a resin sealed portion 5 of external lead conductor 4b provided at a frame strip 2b at the downside of a leadframe 1 interposed between the rollers 6a and 6b. Further, rollers 7a, 7b are adjusted in height to be submerged in molten solder of a solder tank 8b at the portion externally extended from a resin sealed portion 6 of external lead conductor 4a of the side interposed between the rollers 7a and 7b. Then, when the rollers 6a, 6b and 7a, 7b are rolled in a direction R to convey the frame 1 in a direction T, the conductors 4a, 4b are respectively and sequentially soldered preliminarily in the tanks 8a, 8b continuously.

Description

【発明の詳細な説明】 〔発明の技術分野〕 この発明は、Ｄ工Ｌ　（Ｄｕａ工Ｉｎ　Ｌｉｎｅ）形樹
脂封止半導体装置用リードフレームの半導体チップ樹脂
封止部から両側に出る外部リードに予備半田付けする装
置に関するものである。[Detailed Description of the Invention] [Technical Field of the Invention] The present invention provides a lead frame for a D-type resin-sealed semiconductor device with spare external leads extending from the semiconductor chip resin-sealed portion on both sides. This invention relates to a soldering device.

〔従来技術〕[Prior art]

以下−ＤＩＬ形樹脂封止トランジスタの場合を例にとり
説明する。The following will explain the case of a -DIL type resin-sealed transistor as an example.

第１図（Ａ）はＤＩＬ形樹脂封止トランジスタ用リード
フレームの一例にトランジスタチップを封止した樹脂封
止部が設けらｔ′１．た状態を示す平面図、第１図（Ｂ
）は第１図（Ａ）のより一より線での断面図である。FIG. 1(A) shows an example of a lead frame for a DIL-type resin-sealed transistor in which a resin-sealed portion for sealing a transistor chip is provided at t'1. A plan view showing the state shown in Fig. 1 (B
) is a sectional view taken along the first strand of FIG. 1(A).

図において、（１）はＤ　工ＴＪ形樹脂封止トランジス
タ用リードフレーム％（２ａ）および（２１））は互い
の間に間隔をおいて平行に設けられリードフレーム（１
）を構成する第１および第２のフレーム条帯、（３）Ｖ
ｉフレーム条帯（２ａ　）　、　（２ｂ　）を連結する
ように所定のピッチで配設されリードフレーム、（１）
を構成する複数個の連結条帯、（４ａ）はｇ　１のフレ
ーム条帯（２ａ）の互いに隣り合う連結条帯（３）の間
の部分に第１のフレーム条帯（２ａ）からフレーム条帯
（２，ａ）、（２ｂ）の間の中間部へ伸びるように設け
られリードフレーム（１）を構成する第１の外部リード
導体、（４ｂ）はＦｘ２のフレーム条帯（２ｂ）の互い
に隣り合う連結条帯（３）の間の部分に互の間に間隔を
おいて第２のフレーム条帯（２″ｏ）からフレーム条帯
（２ａ）、（２ｂ’）の間の中間部へ伸びるように設け
られリードフレーム（１）全構成する２個の簗２の外部
リード導体、（５）は第１の外部リード導体（４ａ　）
の先端部にコレクタ電極が装着され２個の第２の外部リ
ード導体（４ｂ）の先端部にそれぞれエミッタ電極およ
びべ・−スミ極がボンディングワイヤを介して接続され
たトランジスタチップ（図示せず）と外部リード導体（
４ａ　）　、　（４，ｂ）の所要部分とを封止した樹脂
封止部である。In the figure, (1) is a lead frame (2a) and (21)) are provided in parallel with a space between them.
), (3) V
A lead frame (1) arranged at a predetermined pitch so as to connect the i-frame strips (2a) and (2b).
A plurality of connecting strips (4a) are connected from the first frame strip (2a) to the portion between the adjacent connecting strips (3) of the frame strip (2a) of g1. The first external lead conductor (4b) is provided to extend to the intermediate part between the strips (2, a) and (2b) and constitutes the lead frame (1), and (4b) is connected to each other of the frame strips (2b) of Fx2. From the second frame strip (2''o) to the middle part between the frame strips (2a), (2b') at intervals between adjacent connecting strips (3) Two external lead conductors are provided to extend and make up the entire lead frame (1), and (5) is the first external lead conductor (4a).
A transistor chip (not shown) in which a collector electrode is attached to the tip of the transistor chip, and an emitter electrode and a base electrode are connected to the tips of the two second external lead conductors (4b) via bonding wires. and external lead conductor (
4a) and the required portions of (4, b) are sealed with resin.

従来、外部リード導体（４ａ）、（４ｂ）の（釘脂封止
部（５）から外部へ出る部分の表面上に予４Ｊｉｉｉ半
田ｆ」けを行う場合には、まず、第１の外部リード導体
（４ａ）の樹脂封止部（５）から外部へ出る部分、第１
のフレーム条帯（２ａ）および連結条帯（３）の所要部
分を半田槽（図示せず）内にだくわえられた浴１独半田
にひたして第１の外部リード導体（４ａ）の予備半田付
けを行い、次いで、第２の外部リード（４ｂ）の圓脂封
上部（５）から外部へ出る部分、第２のフレーム条帯（
２ｂ）および連結条帯（３）の所貧部分を半日３槽内に
だくわえられた溶融半田にひたして第２の外部リード導
体（４ｂ）の予備半田付けを行っていた。従って、半田
槽内に挿入できるようにするために、１０〜２０個のト
ランジスタチップを順次装着し個々に樹脂封止して樹脂
封止部（５）を形成した短尺のリードフレーム（１）を
使用せねばならないので、外部リード導体（４ａ）、（
４ｂ）の予備半田付は作業の自動化が容易ではなく、予
備半田付は作業の作業時間が長いという欠点があった。Conventionally, when pre-soldering is performed on the surfaces of the external lead conductors (4a) and (4b) at the portions (exiting from the nail grease sealing part (5) to the outside), the first external lead conductors (4a) and (4b) are The first part of the conductor (4a) that exits from the resin sealing part (5)
Pre-solder the first external lead conductor (4a) by immersing the required portions of the frame strip (2a) and the connecting strip (3) in solder bath 1 contained in a solder tank (not shown). Then, the part of the second external lead (4b) that exits from the resin-sealed upper part (5) and the second frame strip (
Preliminary soldering of the second external lead conductor (4b) was carried out by soaking the poor portions of the conductor 2b) and the connecting strip (3) in molten solder held in three tanks for half a day. Therefore, in order to be able to insert it into a solder bath, a short lead frame (1) on which 10 to 20 transistor chips are successively mounted and individually sealed with resin to form a resin sealing part (5) is used. Since it is necessary to use the external lead conductor (4a), (
Preliminary soldering in 4b) cannot be easily automated, and preliminary soldering has the disadvantage that it takes a long time.

〔発明の概要〕[Summary of the invention]

この発明は、かかる欠点を解消する目的でなされたもの
で、長尺のリードフレームを第１のフレーム条帯が上側
に第２のフレーム条帯が下側になるようにして搬送する
第１の搬送機構とこの第１の搬送機構が搬送するリード
フレームを第２のフレーム条帯が上側に第１のフレーム
条帯が下側になるように上下反転させて搬送する第２の
搬送機構とを設け、さらに第１の搬送戦構によって搬送
されるリードフレームの第２のフレーム条帯の下方に第
２のフレーム条帯に設けらｔした第２の外部リード導体
が予備半田付けされるように第１の噴流形半田槽を設置
するとともに第２の搬送機構によって上下反転させられ
て搬送されるリードフレームの第１のフレーム条帯の下
方に第１のフレーム条帯に設けられた第１の外部リード
導体が予備半田付けされるように羊２の噴流形半田槽を
設置することによって、第１および第２の外部リード導
体の予備半田付は作業の自動化が容易にでき、予備半田
付は作業の作業時間の短い予備半田付は装置を提供する
ものである。The present invention was made with the aim of eliminating such drawbacks, and is a first method for transporting a long lead frame with the first frame strip on the upper side and the second frame strip on the lower side. a conveying mechanism; and a second conveying mechanism that conveys the lead frame conveyed by the first conveying mechanism by inverting it upside down so that the second frame strip is on the upper side and the first frame strip is on the lower side. furthermore, a second external lead conductor provided on the second frame strip is pre-soldered below the second frame strip of the lead frame transported by the first transport mechanism. A first jet-type solder tank is installed, and a first solder tank provided on the first frame strip is placed below the first frame strip of the lead frame, which is transported while being turned upside down by the second transport mechanism. By installing the jet-type soldering bath of Sheep 2 so that the external lead conductors are pre-soldered, the preliminary soldering of the first and second external lead conductors can be easily automated, and the pre-soldering can be easily automated. The present invention provides a preliminary soldering device with a short working time.

〔発明の実施例〕[Embodiments of the invention]

第２図（Ａ）および（Ｂ）はこの発明の一実施例の予備
半田付は装置の主要構成要素を示す正面図および平面図
である。FIGS. 2A and 2B are a front view and a plan view showing the main components of a preliminary soldering apparatus according to an embodiment of the present invention.

図において、第１図に示した符号と同一符号は同等部分
を示す。なお、リードフレーム（１）のフレーム条帯（
２ａ）、（２ｂ）以外の連結条帯（３）および外部リー
ド（４ａ）、（４ｂ）の全数の図示は省略した。In the figure, the same symbols as those shown in FIG. 1 indicate equivalent parts. In addition, the frame stripes (
The illustration of all the connecting stripes (3) and external leads (4a) and (4b) other than 2a) and (2b) is omitted.

（６ａ）および（６ｂ）は数千ないし数万個のトランジ
スタチップ（図示せず）を順次装着し個々に１對脂封止
して樹脂封止部（５）を形成した長尺のリードフレーム
（１）を、第１のフレーム条帯（２ａ）が上側になるよ
うにしてフレーム条帯（２ａ）、（２ｂ）を挾持し図示
矢印Ｒ方向に回転して図示矢印Ｔ方向に搬送する第１の
搬送機構であるローラ、（’７ａ）および（Ｉ７ｂ）は
ローラ（６ａ）、（６ｂ）が搬送するリードフレーム（
１）を第２のフレーム条帯（２ｂ）が上側になるように
上下反転させてフレーム条帯（２ａ）、（２ｂ）を挾持
し図示矢印Ｒ方向に回転してＭ示矢印Ｔ方向に搬送する
第２の搬送機構であるローラ、（８ａ）はローラ（６ａ
）。(6a) and (6b) are long lead frames in which several thousand or tens of thousands of transistor chips (not shown) are sequentially mounted and each one is sealed with resin to form a resin sealing part (5). (1) is held between the frame strips (2a) and (2b) with the first frame strip (2a) facing upward, rotated in the direction of arrow R in the figure, and transported in the direction of arrow T in the figure. The rollers ('7a) and (I7b), which are the conveyance mechanism of No. 1, are the lead frame ('7a) and (I7b) conveyed by the rollers (6a) and (6b).
1) is turned over upside down so that the second frame strip (2b) is on the upper side, sandwiching the frame strips (2a) and (2b), rotated in the direction of arrow R shown in the figure, and transported in the direction of arrow T shown M The roller (8a), which is the second conveyance mechanism, is the roller (6a)
).

（６ｂ）によって搬送されるリードフレーム（１）の第
２のフレーム条帯（２ｂ）の下方に設置され溶融半田を
上方に噴流さぜる噴流形半田槽、（８ｂ）はローラ（’
ｉ’ａ）。(6b) is a jet-type solder tank installed below the second frame strip (2b) of the lead frame (1) conveyed by the roller (8b), which jets the molten solder upward;
i'a).

（７ｂ）によって上下反転させられて搬送さね、るＩＪ
−ドフレーム（１）の第１のフレーム条帯（２ａ）の下
方に設置された噴流形半田槽である。なお、ローラ（６
ａ）。(7b), the IJ is turned upside down and transported.
- This is a jet type solder bath installed below the first frame strip (2a) of the hard frame (1). In addition, the roller (6
a).

（６ｂ）およびローラ（７ａ）、（７’ｂ）は自由に高
さが調整できるようになっている。(6b) and rollers (7a) and (7'b) can be freely adjusted in height.

次に、この実施例の作用について説明する。Next, the operation of this embodiment will be explained.

まず、ローラ（６ａ）、（６ｂ）が挾持するリードフレ
ーム（１）の下側の第２のフレーム条帯（２ｂ）に設け
られた第２の外部リード導体（４ｂ）の樹脂封止部（５
）から外部へ出る部分が噴流形半田槽（８ａ）の噴流す
る溶融半田にひたるようにローラ（６ａ）、（６ｂ）の
高さを調整するとともに、ローラ（’７ａ）、（’７ｂ
）が挾持するリードフレーム（１）の下側の第１のフレ
ーム条帯（２ａ）に設けられた第１の外部リード導体（
４ａ）の樹脂封止部（５）から外部へ出る部分が噴流形
半田槽（８ｂ）の噴流する溶融半田にひたるようにロー
ラ（７ａ）。First, the resin-sealed portion ( 5
) The heights of the rollers (6a) and (6b) are adjusted so that the parts coming out from the rollers ('7a) and ('7b) are immersed in the molten solder jetting from the jet type solder tank (8a).
) The first external lead conductor (
Roller (7a) so that the part coming out from the resin sealing part (5) of 4a) is immersed in the molten solder jetting from the jetting type solder tank (8b).

（７ｂ）の高さを調整する。しかるのち、ローラ（６ａ
）＋（６ｂ）およびローラ（’７ａ）、（’７ｂ）を図
示矢印Ｒ方向に回転させて、リードフレーム（１）を図
示矢印Ｔ方向に搬送すると、＠２の外部リード導体（４
ｂ）および第１の外部リード導体（４ａ）がそれぞれ噴
流形半田槽（８ａ）および噴流形半田槽（８ｂ）の噴流
する溶融半田によって順次連続的に予備半田付けさね２
る。Adjust the height of (7b). Afterwards, Laura (6a
) + (6b) and rollers ('7a) and ('7b) are rotated in the direction of arrow R in the figure and the lead frame (1) is conveyed in the direction of arrow T in the figure, the external lead conductor (4
b) and the first external lead conductor (4a) are sequentially and continuously pre-soldered by the molten solder flowing from the jet solder tank (8a) and the jet solder tank (8b), respectively.
Ru.

よって、この実施例では、長尺のリードフレーム（１）
を使用するので、短尺のリードフレーム（１）を用いる
従来の場合に比べて、外部リード導体（４ａ）。Therefore, in this embodiment, a long lead frame (1)
Since the external lead conductor (4a) is used, compared to the conventional case where a short lead frame (1) is used.

（４ｂ）の予備半田付は作業の自動化が容易にでき、予
備半田付は作業の作業時間が短かくなる。The pre-soldering process (4b) can be easily automated, and the pre-soldering process can be performed in a short time.

この実施例では、ローラ（ａａ）、（６ｂ）とローラ（
）ａ）。In this example, rollers (aa), (6b) and roller (
)a).

（７ｂ）とを用いこれらのローラ（６ａ）、（６ｂ）と
ローラ（７ａ）、（７ｂ）の間で長尺のリードフレーム
（１）のフレーム条帯（２ａ）、（２ｂ）を上下反転さ
せるように第７たが、必ずしもこれらはローラである必
要がなく、スプロケットなどからなるその他の搬送機構
であってもよい。(7b) and turn the frame strips (2a), (2b) of the long lead frame (1) upside down between these rollers (6a), (6b) and rollers (7a), (7b). However, these do not necessarily have to be rollers, and may be other conveyance mechanisms such as sprockets.

なお、これ壕で、ＤＩＬ形樹脂封止トランジスタの場合
を例にとり説明したが、この発明はこれに限らず、ＤＩ
Ｌ形樹脂Ｊｉ止半導体装置一般に適用することができる
。In this section, the case of a DIL type resin-sealed transistor was explained as an example, but the present invention is not limited to this.
It can be applied to L-shaped resin Ji-stopped semiconductor devices in general.

〔発明の効果〕〔Effect of the invention〕

以上、説明したように、この発明の予備半田付は装置で
は、互いの間に間隔をおいて平行に設けられた第１およ
び第２のフレーム条帯とこれらの第１および第２のフレ
ーム条帯に設けられた第１および第２の外部リード導体
とを有しこれらの第１および第２の外部リード導体の先
端部に半導体チップを封止した複数個の樹脂封止部が形
成された長尺のリードフレームを上記第１のフレーム条
帯が上側になるようにして搬送する第１の搬送機構とこ
の第１の搬送機構が搬送する上記リードフレームを、上
記第２のフレーム条帯が上側になるように上下反転させ
て搬送する第２の搬送機構とを設け、さらに上記第１の
搬送機構によって搬送される上記リードフレームの上記
第２のフレーム条帯の下方に上記第２の外部リード導体
の上記樹脂封止部から外部へ出る部分が予備半田付けさ
れるように第１の噴流形半田槽を設置するとともに上記
第２の搬送機溝によって上下反転させられて搬送される
上記リードフレームの上記第１のフレーム条帯の下方に
上記第１の外部リード導体の上記樹脂封止部から外部へ
出る部分が予備半田付けされるように第２の噴流形半田
槽を設置したので、上記第１および第２の外部リード導
体の予備半田付けを連続的に行うことができる。よって
、短尺のリードフレームを用いる従来の」場合に比べて
、上記第１および第２の外部リード導体の予備半田付は
作業の自動化が容易にでき、予備半田付は作業の作業時
間が短かくなる。As described above, the pre-soldering apparatus of the present invention includes first and second frame strips that are provided in parallel with a space between them, and these first and second frame strips. first and second external lead conductors provided in the band, and a plurality of resin-sealed parts in which semiconductor chips are sealed are formed at the tips of the first and second external lead conductors. a first transport mechanism that transports a long lead frame with the first frame strip facing upward; and a second frame strip that transports the lead frame carried by the first transport mechanism. a second transport mechanism for transporting the lead frame upside down so that it is on the upper side; A first jet-type solder bath is installed so that the portion of the lead conductor that exits from the resin sealing portion to the outside is pre-soldered, and the lead is conveyed upside down by the second conveyor groove. A second jet type solder tank was installed below the first frame strip of the frame so that the portion of the first external lead conductor that exited from the resin sealing portion was pre-soldered. Preliminary soldering of the first and second external lead conductors can be performed continuously. Therefore, compared to the conventional case of using a short lead frame, the preliminary soldering of the first and second external lead conductors can be easily automated, and the preliminary soldering can be done in a short time. Become.

【図面の簡単な説明】[Brief explanation of the drawing]

２（＜　１１３　（Ａ）はＤＩＬ形１１１脂封止）・ラ
ンジスタ用り一ドフ１／−ノ・の−例にトランジスタチ
ップを封止した（）（脂封止部乃く設（−１−ら１主た
状態を示す平面図、第主便イ１４成委素を示す正面図お
よび平面図である。 図におい１、（１）はリードフレーム、（２ａ）および
封止部、（６ａ）および（６ｂ）はローラ（第１の搬送
け（１り）、（′７ａ）および（７ｂ）はローラ（第２
の搬送１９　Ｉｆｆ）、（８ａ）お・よび（ｓ’ｂ）（
□ま第１および第２の噴ｂＩＣ形半田槽であるっ なお、図中同一符号はそれぞれ同一またけ相当部分を示
す。 代理人　大岩増雄 第１′：Ａ 第２図 （，４）2 (< 113 (A) is DIL type 111 fat sealing) A transistor chip is sealed in an example of transistor 1/-no. Fig. 1 is a plan view showing the main state, and a front view and a plan view showing the main components. and (6b) are rollers (first conveyor (1), ('7a) and (7b) are rollers (second
Transport of 19 If), (8a) and (s'b) (
□They are the first and second jet bIC type solder tanks. In the drawings, the same reference numerals indicate the same straddle-corresponding parts, respectively. Agent Masuo Oiwa 1': A Figure 2 (,4)

Claims (2)

【特許請求の範囲】[Claims] （１）互いの間に間隔をおいて平行に設けられた第１お
よび第２のフレーム条帯とこれらの第１および第２のフ
レーム条帯にこれらの間の中間部へ伸びるようにそれぞ
れ設６られた第１および第２の外部リード導体とを有し
上記第１および第２の外部リード導体の先端部に電極が
接続された半導体チップと上記第１およびｇ！！２の外
部リード導体の所要部分とを封止した複数個の樹脂封止
部が形成され元長尺のリードフレームを上記第１のフレ
ーム条帯が上側になるようにして搬送する第１の搬送機
構、この＠１の搬送機構が搬送する上記リードフレーム
を上記第２のフレーム条帯が上側になるように上下反転
させて上記第１の搬送機構の搬送方向と同一方向に搬送
する第２の搬送機構、上記第１の搬送機構によって搬送
される上記リードフレームの上記第２のフレーム条帯の
下方に上記第２の外部リード導体の上記樹脂封止部から
外部へ出る部分が予備半田付けされるように設置され溶
融半田を上方に噴流させる第１の噴流形半田槽、および
上記第２の搬送機構によって上下反転させられて搬送さ
れる上記リードフレームの上記第１のフレーム条帯の下
方に上記第１の外部リード導体の上記樹脂封止部から外
部へ出る部分が予備半田付けされるように設置された第
２の噴流形半田槽を備えた予備半田付は装置。(1) first and second frame strips provided parallel to each other with an interval between them; a semiconductor chip having first and second external lead conductors which are connected to each other and having electrodes connected to the tips of the first and second external lead conductors, and the first and second external lead conductors; ! a first conveyance in which a plurality of resin sealing portions are formed to seal required portions of the second external lead conductor, and the long lead frame is conveyed with the first frame strip facing upward; mechanism, a second transport mechanism that transports the lead frame transported by the @1 transport mechanism in the same direction as the transport direction of the first transport mechanism by vertically inverting the lead frame so that the second frame strip is on the upper side; a conveying mechanism, a portion of the second external lead conductor protruding from the resin sealing portion to the outside is pre-soldered below the second frame strip of the lead frame conveyed by the first conveying mechanism; a first jet-type solder bath that is installed so as to jet molten solder upward; and a first frame strip of the lead frame that is conveyed upside down by the second conveyance mechanism. A pre-soldering device comprising a second jet-type solder tank installed so that a portion of the first external lead conductor that exits from the resin sealing portion to the outside is pre-soldered. （２）　第１および第２の搬送機構がリードフレームの
第１および第２のフレーム条帯を挾持するローラである
ことを特徴とする特許請求の範囲第１項記載の予備半田
付は装置。(2) The preliminary soldering apparatus according to claim 1, wherein the first and second conveying mechanisms are rollers that clamp the first and second frame strips of the lead frame.
JP16958183A 1983-09-12 1983-09-12 Preliminarily soldering device Pending JPS6059761A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16958183A JPS6059761A (en) 1983-09-12 1983-09-12 Preliminarily soldering device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16958183A JPS6059761A (en) 1983-09-12 1983-09-12 Preliminarily soldering device

Publications (1)

Publication Number Publication Date
JPS6059761A true JPS6059761A (en) 1985-04-06

Family

ID=15889128

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16958183A Pending JPS6059761A (en) 1983-09-12 1983-09-12 Preliminarily soldering device

Country Status (1)

Country Link
JP (1) JPS6059761A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02246107A (en) * 1989-03-18 1990-10-01 Zeniya Sangyo Kk Solder dip treatment of electronic part

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56100455A (en) * 1980-01-16 1981-08-12 Toshiba Corp Manufacture of semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56100455A (en) * 1980-01-16 1981-08-12 Toshiba Corp Manufacture of semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02246107A (en) * 1989-03-18 1990-10-01 Zeniya Sangyo Kk Solder dip treatment of electronic part

Similar Documents

Publication Publication Date Title
US20170162489A1 (en) Flat No-Lead Packages with Electroplated Edges
JPS6059761A (en) Preliminarily soldering device
US4573430A (en) Automatic lead wire tinning of tape-packaged components
CN204315566U (en) Based on the Novel lead frame that TO-220CE lead frame improves
US20230420340A1 (en) Semiconductor package having wettable lead flanks and tie bars and method of making the same
JPS62240156A (en) Soldering device
JPH04199721A (en) Wire-bonded semiconductor device
JP2526790B2 (en) Semiconductor manufacturing equipment
JPH0444417B2 (en)
EP0226650B1 (en) Lead wire soldering apparatus
JPS59113652A (en) Flat package ic
JPS5718330A (en) Method of and apparatus for soldering semiconductor device
JPS62206840A (en) Production unit for semiconductor device
KR950008235B1 (en) Semiconductor package product device
KR100216798B1 (en) Structure of feed pin and die pin for semiconductor packgage manufacture apparatus
JPS6344998Y2 (en)
JPH0330345A (en) Manufacture of semiconductor device
JPS5922933Y2 (en) soldering equipment
KR100259874B1 (en) Strips transporting apparatus for a semiconductor package
JPS60149142A (en) Wire bonding device
JPS6381935A (en) Assembling device
JP2678663B2 (en) Bonding equipment
JP2751922B2 (en) Wire bonding method and apparatus
US20170250137A1 (en) Semiconductor device
JPH03285337A (en) Wire bonding device and wire bonding