JPS62206840A - Production unit for semiconductor device - Google Patents
Production unit for semiconductor deviceInfo
- Publication number
- JPS62206840A JPS62206840A JP4926486A JP4926486A JPS62206840A JP S62206840 A JPS62206840 A JP S62206840A JP 4926486 A JP4926486 A JP 4926486A JP 4926486 A JP4926486 A JP 4926486A JP S62206840 A JPS62206840 A JP S62206840A
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- solder
- rail
- contact
- chips
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 18
- 238000004519 manufacturing process Methods 0.000 title claims description 8
- 229910000679 solder Inorganic materials 0.000 abstract description 17
- 238000007747 plating Methods 0.000 abstract description 5
- 239000011265 semifinished product Substances 0.000 abstract description 4
- 230000006866 deterioration Effects 0.000 abstract description 2
- 230000032258 transport Effects 0.000 description 8
- 230000000694 effects Effects 0.000 description 2
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は半導体装置の製造装置に関するものである。[Detailed description of the invention] [Industrial application field] The present invention relates to a semiconductor device manufacturing apparatus.
従来、この種の半導体装置の製造装置には、第３図に示
す、ように半導体素子１が搭載されたリードフレーム４
の両側縁を搬送レール２により支え、リードフレーム４
を搬送レール２上に滑走させて搬送するものがある。３
はリードフレーｉｓ ４のン％き上がりを防止するレー
ルガイドである。従来、搬送レール２の支持面２ａは平
坦であり、リードフレーム４に面接触させていた。Conventionally, this type of semiconductor device manufacturing equipment includes a lead frame 4 on which a semiconductor element 1 is mounted, as shown in FIG.
Both sides of the lead frame 4 are supported by conveyor rails 2.
There is one that transports by sliding it on the transport rail 2. 3
is a rail guide that prevents the lead frame IS4 from rising. Conventionally, the support surface 2a of the transport rail 2 has been flat and brought into surface contact with the lead frame 4.
ところで、半製品の半導体素子を搭載しているリードフ
レーム４にはハンダメッキが施されている。By the way, the lead frame 4 on which the semi-finished semiconductor element is mounted is solder plated.
しかしながら、従来のようにリードフレーム４は搬送レ
ール２に面接触しているから、リード、フレーム４の滑
走時の摩擦力が大きいため、リードフレー１ｚ４のハン
ダメッキが剥がれ、これが半製品の半導体素子に付着し
５次工程でハンダくずが付着したまま半導体素子が樹脂
月止されてしまい、品質を低下させる慮れがあった、ま
たハンダくずが搬送レールに付着し、円滑な搬送の妨げ
になるという問題があった。However, since the lead frame 4 is in surface contact with the conveyor rail 2 as in the conventional case, the frictional force when the leads and the frame 4 slide is large, and the solder plating on the lead frame 1z4 peels off, causing the semi-finished semiconductor element to peel off. In the 5th step, the semiconductor elements were held in place with the solder chips still attached to the resin, which could lead to a decrease in quality.In addition, the solder chips adhered to the conveyor rails, impeding smooth transportation. There was a problem.
本発明の［１的はリードフレーｔ１と搬送レールとの摩
擦力を減少させることにより、リードフレームからのハ
ンダの剥がれを防止する半導体装置の製造装置である。One object of the present invention is a semiconductor device manufacturing apparatus that prevents peeling of solder from a lead frame by reducing the frictional force between the lead frame t1 and the transport rail.
本発明は半導体素子が搭載されたリードフレームの両側
縁を搬送レールにより支え、リードフレームを搬送レー
ル上に滑走させて搬送する半導体装置の製造装置におい
て、搬送レールの支持面を中高状に形成し、該搬送レー
ルの中高状支持面でリードフレームの両側縁を支えたこ
とを特徴とする半導体装置の製造装置である。The present invention relates to a semiconductor device manufacturing apparatus in which both edges of a lead frame on which a semiconductor element is mounted are supported by transport rails, and the lead frame is transported by sliding on the transport rails. , is a semiconductor device manufacturing apparatus characterized in that both side edges of a lead frame are supported by a medium-height support surface of the transport rail.
以下、本発明の一実施例を図により説明する。 Hereinafter, one embodiment of the present invention will be described with reference to the drawings.
第１図、第２Ｉｊ！ｉにおいて、搬送レール２の長さ方
向にリードフレーム４」−の半導体索子１との接触を避
ける溝ｚｂを設け、１梓２ｂの両側壁の断面を滑らかな
曲面をなす中高状に形状し、該中高状支持面２ａ、２ａ
の頂部にリードフレーム４の両側縁を支える。３はリー
ドフレーム４の浮き上がりを防止するレールガイドであ
る。Figure 1, 2Ij! At i, a groove zb is provided in the length direction of the conveyor rail 2 to avoid contact with the semiconductor cord 1 of the lead frame 4'', and the cross section of both side walls of the rail 2b is shaped into a medium-height shape with a smooth curved surface. , the medium-high support surfaces 2a, 2a
Both side edges of the lead frame 4 are supported on the top of the lead frame 4. 3 is a rail guide that prevents the lead frame 4 from floating up.
したがっ；、本発明によれば、搬送レール２の中、（″
６状支持而２ａ、２ａによりリードフレーム４の両側縁
を支えるため、！ＪＱ送レール２はリードフレーム４に
対して線接触することとなり、面接触による摩擦抵抗が
小さく、したがってハンダメッキ剥がれによるハンダく
ずの発生が少なくなり、たとえ、くずが発生してもレー
ルの中高状曲縁より落下するため、搬送レール内部への
ハンダくず詰り。Therefore, according to the present invention, in the conveyor rail 2, (''
In order to support both side edges of the lead frame 4 by the hexagonal supports 2a, 2a,! The JQ feed rail 2 is in line contact with the lead frame 4, and the frictional resistance due to surface contact is small, so the generation of solder chips due to peeling of solder plating is reduced, and even if scraps are generated, the mid-height shape of the rail As solder crumbs fall from the curved edge, the inside of the conveyor rail becomes clogged.
又半製品への付着等の問題はなくなる。Also, problems such as adhesion to semi-finished products are eliminated.
以上説明したように本発明は半導体装置が搭載されたリ
ードフレームを線接触にてガイドするようにしたので、
リードフレームのハンダメッキ剥がれを防止し、半製品
へのハンダくず付着による品質低下の問題を解消でき、
かつｍ送し−ル内部へのハンダくず詰りによる搬送１〜
ラブル発生を防止できるという効果がある。As explained above, in the present invention, the lead frame on which the semiconductor device is mounted is guided by line contact.
It prevents peeling of solder plating on lead frames and eliminates the problem of quality deterioration due to solder debris adhering to semi-finished products.
And transport due to solder waste clogging inside the m feeder 1~
This has the effect of preventing trouble from occurring.
第１図は本発明の一実施例を示す断面図、第２図は同斜
視図、第３図は従来例を示す断面図である。FIG. 1 is a sectional view showing one embodiment of the present invention, FIG. 2 is a perspective view thereof, and FIG. 3 is a sectional view showing a conventional example.
Claims (1)
を搬送レールにより支え、リードフレームを搬送レール
上に滑走させて搬送する半導体装置の製造装置において
、搬送レールの支持面を中高状に形成し、該搬送レール
の中高状支持面でリードフレームの両側縁を支えたこと
を特徴とする半導体装置の製造装置。(1) In semiconductor device manufacturing equipment in which both edges of a lead frame on which a semiconductor element is mounted are supported by transport rails, and the lead frame is transported by sliding on the transport rails, the supporting surface of the transport rail is formed in a mid-height shape. A semiconductor device manufacturing apparatus, characterized in that both edges of a lead frame are supported by a medium-height support surface of the transport rail.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4926486A JPS62206840A (en) | 1986-03-06 | 1986-03-06 | Production unit for semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4926486A JPS62206840A (en) | 1986-03-06 | 1986-03-06 | Production unit for semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62206840A true JPS62206840A (en) | 1987-09-11 |
Family
ID=12825967
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4926486A Pending JPS62206840A (en) | 1986-03-06 | 1986-03-06 | Production unit for semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62206840A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6367791B1 (en) * | 2000-07-07 | 2002-04-09 | Stratasys, Inc. | Substrate mounting system for a three-dimensional modeling machine |
| KR100383514B1 (en) * | 2001-05-15 | 2003-05-12 | 한미반도체 주식회사 | Device For Transfering Small Semiconductor Package |
| US7127309B2 (en) | 2004-02-10 | 2006-10-24 | Stratasys, Inc. | Modeling apparatus with tray substrate |
-
1986
- 1986-03-06 JP JP4926486A patent/JPS62206840A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6367791B1 (en) * | 2000-07-07 | 2002-04-09 | Stratasys, Inc. | Substrate mounting system for a three-dimensional modeling machine |
| KR100383514B1 (en) * | 2001-05-15 | 2003-05-12 | 한미반도체 주식회사 | Device For Transfering Small Semiconductor Package |
| US7127309B2 (en) | 2004-02-10 | 2006-10-24 | Stratasys, Inc. | Modeling apparatus with tray substrate |
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