KR930001374Y1 - Guard rail apparatus of lead frame deflash - Google Patents
Guard rail apparatus of lead frame deflash Download PDFInfo
- Publication number
- KR930001374Y1 KR930001374Y1 KR2019900010181U KR900010181U KR930001374Y1 KR 930001374 Y1 KR930001374 Y1 KR 930001374Y1 KR 2019900010181 U KR2019900010181 U KR 2019900010181U KR 900010181 U KR900010181 U KR 900010181U KR 930001374 Y1 KR930001374 Y1 KR 930001374Y1
- Authority
- KR
- South Korea
- Prior art keywords
- lead frame
- guide
- deflash
- conveyor
- guard rail
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
Abstract
내용 없음.No content.
Description
제1도는 본 고안의 사시도.1 is a perspective view of the present invention.
제2도는 제1도의 A-A선에 따른 단면도.2 is a cross-sectional view taken along the line A-A of FIG.
제3도는 종래구조의 사시도.3 is a perspective view of a conventional structure.
* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings
1 : 컨베이어 2 : 리드프레임1: conveyor 2: lead frame
3 : 가이드판 3a : 절곡편3: guide plate 3a: bending piece
본 고안은 몰딩된 리드프레임이 컨베이어를 타고 플레시(Flash)가 제거되어 나오는 리드프레임을 가이드해주는 역할을 수행하는 가이드레일의 구조에 관한 것이다.The present invention relates to a structure of a guide rail in which a molded lead frame serves to guide the lead frame from which flash is removed on a conveyor.
종래에는 제3도와 같이 플레시가 제거되면서 컨베이어(1)를 따라 배출되는 리드프레임(2)을 가이드해주기위하여 컨베이어(1)의 선단부측으로 양변에 가이드홈(10a)이 형성된 가이드레일(10)을 설치하고, 가이드레일(10)의 상, 하부측으로는 도시가 생략된 모터를 통해 O링 벨트(11)로서 풀리(12)를 이동시킴에 따라 컨베이어(1)로부터 배출되는 리드프레임(2)을 가이드레일(10)의 가이드홈(10a)을 통하여 이를 가이드하면서 이송시키도록 하였다.Conventionally, as shown in FIG. 3, the guide rails 10 having guide grooves 10a formed on both sides are provided at both ends of the conveyor 1 to guide the lead frames 2 discharged along the conveyor 1 while the flash is removed. The guide frame 10 guides the lead frame 2 discharged from the conveyor 1 by moving the pulley 12 as the O-ring belt 11 through the motor (not shown) on the upper and lower sides of the guide rail 10. The guide groove (10a) of the rail 10 to be transported while guiding it.
그러나 상기와 같은 종래의 가이드레일은 리드프레임의 디플레시(Deflash)공정에서 발생하는 제품의 휘어짐과 컨베이어 패드의 마모, 그리고 컨베이어와 가이드레일 사이로 유지되는 일정간격에 의하여 컨베이어로부터 배출되는 리드프레임이 원활하게 가이드레일의 양 가이드홈내로 유입되지 못하고 잦은 리드프레임의 이송 에러가 발생하며 이때마가 작업자가 이를 처리해 주어야만 되었기 때문에 생산성이 향상되지 못하고 제품의 품질에도 영향을 미치게 되는 원인으로 작용하였다.However, in the conventional guide rail as described above, the lead frame discharged from the conveyor is smooth due to the warpage of the product generated in the deflash process of the lead frame, the wear of the conveyor pad, and a predetermined interval maintained between the conveyor and the guide rail. In this case, the guide rail does not flow into both guide grooves and frequent feeding errors occur in the lead frame. At this time, the worker has to deal with it, which does not improve the productivity and affects the quality of the product.
본 고안은 이와같은 종래의 단점을 개선하기 위하여 리드프레임의 구조를 개선하여 컨베이어 측으로 부터의 리드프레임을 원활하게 가이드해줄 수 있도록 한 것이다.The present invention is intended to smoothly guide the lead frame from the conveyor side by improving the structure of the lead frame in order to improve such a disadvantage.
이와같은 목적을 수행하기 위한 본 고안에 따르면, 컨베이어(1)를 통해 플레시가 제거되면서 배출되는 리드프레임(2)을 가이드해주는 가이드레일을 양측으로 절곡편(3a)을 갖는 가이드판(3)으로 형성하여서 된것이다.According to the present invention for carrying out such a purpose, the guide rail for guiding the lead frame (2) discharged while the flash is removed through the conveyor (1) as a guide plate (3) having a bending piece (3a) on both sides It was formed.
이와같이 된 본 고안은 첨부도면과 함께 설명하면, 종래와같이 양 가이드레일에 형성된 홈을 통해 리드프레임을 가이드하지 않고 제1도와 같이 판형상의 가이드판(3)을 통해 리드프레임(2)이 얹혀진 상태로 가이드되도록 하였다.When the present invention has been described with reference to the accompanying drawings, the lead frame 2 is placed on the plate-like guide plate 3 as shown in FIG. 1 without guiding the lead frame through grooves formed in both guide rails as in the related art. Guided by.
이때, 제2도와 같이 가이드판(3)의 양측부로 절곡 형성된 절곡편(3a)은 가이드판(3)의 폭이 대략 리드프레임(2) 폭과 거의 일치하기 때문에 리드플레임(2)이 유동없이 이송될 수 있도록 하는 가이드 역할을 수행하게된다.At this time, the bent piece 3a bent to both sides of the guide plate 3 as shown in FIG. 2 has the lead frame 2 without flow because the width of the guide plate 3 is approximately equal to the width of the lead frame 2. It will act as a guide to be transported.
또한, 가이드판(3)을 따라 이송되는 리드프레임(2)의 이송력은 종래와 동일한 형태로서 가이드판(3)의 상, 하측부로 설치된 풀리(12)를 통하여 이루어지게 되는데, 하측풀리(12)의 구동력을 부여해주기 위하여 하측풀리(12)가 위치하는 가이드판(3)으로는 장홈(4)을 형성하여 하측풀리(12)가 장홈(4)을 통해 가이드판(3)의 상면부보다 돌출되도록 해줌에 따라 상측과 하측의 풀리(12)가 이를 지나는 리드프레임(2)과 접속하면서 회전구동력으로 리드프레임(2)을 이송시켜 주게된다.In addition, the feed force of the lead frame 2 conveyed along the guide plate 3 is made through the pulley 12 installed on the upper side and the lower side of the guide plate 3 in the same form as the prior art, the lower pulley 12 In order to impart the driving force of the lower guide pulley 12 is located in the guide plate (3) is formed a long groove (4) so that the lower pulley 12 through the long groove (4) than the upper surface of the guide plate (3) As it allows to protrude, the upper and lower pulleys 12 are connected to the lead frame 2 passing therethrough, thereby transferring the lead frame 2 with rotational driving force.
따라서 본 고안에 따른 판형상의 가이드판을 통해 리드프레임의 가이드가 이루어지게 되므로 종래의 구조인 가이드홈에 의하여 발생하는 여러가지의 문제점들이 해소되어 리드프레임의 원활한 이송과 함께 생산성을 높여주게 되는 효과를 갖는다.Therefore, since the guide of the lead frame is made through the plate-shaped guide plate according to the present invention, various problems caused by the guide groove, which is a conventional structure, are solved, thereby increasing productivity with smooth transfer of the lead frame. .
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019900010181U KR930001374Y1 (en) | 1990-07-11 | 1990-07-11 | Guard rail apparatus of lead frame deflash |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019900010181U KR930001374Y1 (en) | 1990-07-11 | 1990-07-11 | Guard rail apparatus of lead frame deflash |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR920003413U KR920003413U (en) | 1992-02-25 |
| KR930001374Y1 true KR930001374Y1 (en) | 1993-03-27 |
Family
ID=19300941
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR2019900010181U KR930001374Y1 (en) | 1990-07-11 | 1990-07-11 | Guard rail apparatus of lead frame deflash |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR930001374Y1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101994413B1 (en) | 2018-08-14 | 2019-06-28 | 김현옥 | Variable Free Multipurpose Carrierl Bag |
-
1990
- 1990-07-11 KR KR2019900010181U patent/KR930001374Y1/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| KR920003413U (en) | 1992-02-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US3722665A (en) | Vacuum elevating conveyor | |
| AU4593189A (en) | An apparatus for automatically producing confectionery cakes or the like | |
| SE8401718D0 (en) | FORDEREINRIGHTING FOR WERKSTUCKE BZW WERKSTUCKTREGER, SPECIFIC FOR A MOUNTING MACHINE | |
| ATE2662T1 (en) | DEVICE FOR FEED BOTTLES FROM A WIDE FEED LINE INTO A NARROW FEED LINE. | |
| ATE48116T1 (en) | DEVICE FOR LATERAL ALIGNMENT OF A SHED STREAM. | |
| AU713563B2 (en) | Contour cutting machine | |
| KR930001374Y1 (en) | Guard rail apparatus of lead frame deflash | |
| CN1853855A (en) | Workpiece transport device | |
| US5264002A (en) | Method for conveying semiconductor lead frame strip with an apparatus having vertically movable guide rails | |
| US4124113A (en) | Case indexer | |
| GB1329973A (en) | Conveyors | |
| KR910004449A (en) | Paper sheet feeder | |
| US20030047421A1 (en) | Device for conveying printed boards | |
| US4954066A (en) | Thermoforming and conveyor chain guide apparatus | |
| CN220474606U (en) | Feeding device of chip board | |
| SU442126A1 (en) | Belt conveyor loading device | |
| GB1456566A (en) | Book block processing machine | |
| US1601812A (en) | Tile-fettling machine | |
| CN217226762U (en) | Edge sealing device for felt conveyer belt | |
| KR910005486Y1 (en) | Operating productions transport device for tape case | |
| JP2680170B2 (en) | Heating device for die bonding of semiconductor chips | |
| JPH029948Y2 (en) | ||
| JP3696975B2 (en) | Lead frame alignment transport device | |
| KR970018328A (en) | Lead Frame Feeder | |
| KR200171487Y1 (en) | Cut-off and carrying unit of lead-frame |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| E701 | Decision to grant or registration of patent right | ||
| REGI | Registration of establishment | ||
| FPAY | Annual fee payment |
Payment date: 20030218 Year of fee payment: 11 |
|
| LAPS | Lapse due to unpaid annual fee |