JPS5586679A - Method and apparatus for continuous soldering - Google Patents

Method and apparatus for continuous soldering

Info

Publication number
JPS5586679A
JPS5586679A JP15859878A JP15859878A JPS5586679A JP S5586679 A JPS5586679 A JP S5586679A JP 15859878 A JP15859878 A JP 15859878A JP 15859878 A JP15859878 A JP 15859878A JP S5586679 A JPS5586679 A JP S5586679A
Authority
JP
Japan
Prior art keywords
soldering
heat resistant
solders
resistant plate
spots
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15859878A
Other languages
Japanese (ja)
Inventor
Tsuneo Sawamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NIPPON ALMIT KK
NIPPON ARUMITSUTO KK
Original Assignee
NIPPON ALMIT KK
NIPPON ARUMITSUTO KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NIPPON ALMIT KK, NIPPON ARUMITSUTO KK filed Critical NIPPON ALMIT KK
Priority to JP15859878A priority Critical patent/JPS5586679A/en
Publication of JPS5586679A publication Critical patent/JPS5586679A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
    • B22D41/00—Casting melt-holding vessels, e.g. ladles, tundishes, cups or the like
    • B22D41/14—Closures
    • B22D41/44—Consumable closure means, i.e. closure means being used only once
    • B22D41/46—Refractory plugging masses
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE:To perform soldering of multiple spots in a short time, by laying a heat resistant plate holding solders in corresponding soldering spots on a wiring circuit board having multiple soldering spots, and fusing the solders by heating from the surface of the heat resistant plate. CONSTITUTION:A soldering heat resistant plate 3 is laid over a machine part 1 comprising a wiring circuit having multiple soldering spots 2. The soldering heat resistant plate 3 is a 2-3mm thick plate having heat resistant fiber material and flexibility of resin material, and has pierced parts or recess parts 6 in the corresponding soldering positions of the part 1, which are filled with flux and solders 7. In order that the solders 7 may not drop off the heat resistant plate 3, a film 9 of a lower melting point that the solder is adhered thereto. This plate is laid over the wiring circuit board 8 of the part 1 and pressurized, and heated with heat gas or the like from the surface of the heat resistant plate 3. As a result, the solders in the recess parts 6 melt, so that the soldering spots 2 of the wiring circuit of the part 1 may be soldered simultaneously.
JP15859878A 1978-12-25 1978-12-25 Method and apparatus for continuous soldering Pending JPS5586679A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15859878A JPS5586679A (en) 1978-12-25 1978-12-25 Method and apparatus for continuous soldering

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15859878A JPS5586679A (en) 1978-12-25 1978-12-25 Method and apparatus for continuous soldering

Publications (1)

Publication Number Publication Date
JPS5586679A true JPS5586679A (en) 1980-06-30

Family

ID=15675178

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15859878A Pending JPS5586679A (en) 1978-12-25 1978-12-25 Method and apparatus for continuous soldering

Country Status (1)

Country Link
JP (1) JPS5586679A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4832255A (en) * 1988-07-25 1989-05-23 International Business Machines Corporation Precision solder transfer method and means
US4842184A (en) * 1988-06-23 1989-06-27 Ltv Aerospace & Defense Company Method and apparatus for applying solder preforms
US4871110A (en) * 1987-09-14 1989-10-03 Hitachi, Ltd. Method and apparatus for aligning solder balls
US5492266A (en) * 1994-08-31 1996-02-20 International Business Machines Corporation Fine pitch solder deposits on printed circuit board process and product
WO2022067893A1 (en) * 2020-09-29 2022-04-07 河南龙辉铜业有限公司 Copper water pipe elbow having solder, and manufacturing method and soldering method therefor

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4871110A (en) * 1987-09-14 1989-10-03 Hitachi, Ltd. Method and apparatus for aligning solder balls
US4842184A (en) * 1988-06-23 1989-06-27 Ltv Aerospace & Defense Company Method and apparatus for applying solder preforms
US4832255A (en) * 1988-07-25 1989-05-23 International Business Machines Corporation Precision solder transfer method and means
US5492266A (en) * 1994-08-31 1996-02-20 International Business Machines Corporation Fine pitch solder deposits on printed circuit board process and product
US5825629A (en) * 1994-08-31 1998-10-20 International Business Machines Corporation Print circuit board product with stencil controlled fine pitch solder formation for fine and coarse pitch component attachment
WO2022067893A1 (en) * 2020-09-29 2022-04-07 河南龙辉铜业有限公司 Copper water pipe elbow having solder, and manufacturing method and soldering method therefor

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