JPS61108196A - Element removing apparatus - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] Technical Field> This invention is applicable to flat package type integrated circuits (ICs) and large-scale integrated circuits (LSIs) mounted on circuit boards.
), etc., from the circuit board.

<Prior Art> Currently, electronic industry technology continues to develop rapidly, and the products themselves are becoming lighter, thinner, shorter and smaller. As a result, the packaging density inside products has increased significantly, and in particular, integrated circuits, which are the core of electronic circuit systems, have undergone a transformation from ICs to LSIs and very large-scale integrated circuits (VLSIs). Moreover, the increase in the degree of integration of devices such as ICs has forced an increase in the number of electrodes that are drawn out from the device, and at the same time has caused many problems in mounting.

Therefore, for example, after a 44-bin flat package type IC element is once mounted on a circuit board, the element may be removed from the circuit board for some reason. At this point, when attempting to do this without damaging the circuit board and elements, a conventional removal device as shown in FIG. 2 has been used. In this removal device, the inside of the heater block 1 is hollowed out in a shape that fully takes into account the shape of the element 2 and the mounting tolerance, and a thin hole 3 passes through the center thereof. Furthermore, the upper part of the heater block 1 is connected to a heat source 4. Then, the external lead terminals 8 of the element 2 are heated by heat conduction, and the solder attached to the external lead terminals 8 is melted. Thereafter, the element 2 is attracted to the hole 3 of the heater block 1 by a vacuum system 5, and the element 2 is removed from the circuit board 6.

However, due to the shape of the flat package, even if the device 2 is sucked in the vacuum system 5, the external lead terminals 8 of the device 2 and the circuit board 6
Also, vacuum leaks from the gap with the heater block 1, etc., and it is necessary to have a fairly large-scale vacuum system in order to obtain the force necessary to remove the element.

Furthermore, due to vacuum leakage, the air 7 flowing into the heater block 1 from the outside may solidify the melted solder again and damage the pattern on the circuit board 6 by trying to remove it with excessive force. There was a problem in that removal errors occurred one after another, resulting in extremely large time and economic losses.

<Purpose of the Invention> Therefore, the present invention was made to solve the above-mentioned problems in a device for removing a flat package type device.The purpose is to reduce the size and weight of the device, and to easily remove it with a small force. The object of the present invention is to make it possible to reliably remove the element, thereby shortening the time required for removing the element and improving economical efficiency.

<Structure and operation of the invention> In order to achieve the above object, the structure of the invention is such that, as illustrated in FIG. When fitted, the tip of the suction jig 16 moves in the internal space 14 of the heater block 13.

Then, the element 12 mounted on the circuit board 11 is housed in the inner space 14 of the heater block 13, and the metal part 18 such as the outer lead terminal of the element 12 is heated by the end face of the heater block 13. Melt the attached solder.

At the same time, the suction jig 16 is brought into close contact with the package of the element 12, and negative pressure is introduced into the suction jig 16 from the vacuum system 25, thereby causing the suction jig 16 to hold the element 12 while holding the circuit board. 11, and remove the element 12 from the circuit board 11.

<Example> Hereinafter, the present invention will be explained in detail with reference to illustrated embodiments.

In FIG. 1, 11 is a circuit board, and 12 is a flat package type mounted on the circuit board 11, for example.
The element 13, which is C, is formed by hollowing out the inside of the element 12 in consideration of the shape and mounting tolerance,
The heater block 13 has a concave cross section and has an internal space 14 in which the elements 12 and 2 can be housed with a gap therebetween.
The dimensions are set so that it comes into contact with the

Through hole 1 provided in the center of the earthen wall of the heater block 13
5, a cylindrical suction jig 16 is fitted so as to be movable upwardly and downwardly, so that the lower end of this suction jig 16 can be brought into close contact with the upper surface of the element 12. An outer 7 run section 16a is provided at the lower end of the suction jig 16, and the lower end of the suction jig 16 and the element 1 are connected to each other.
The area of contact with the upper surface of 2 is increased to reduce the surface pressure and improve sealing performance. A pin 17 is passed through the upper end of the suction jig 16 in the horizontal direction so that the pin 17 can be engaged with the heater block 13 to prevent the suction jig 11 from being pulled out from the heater block 13. I'm trying.

The suction jig 1 is mounted on the upper part of the heater block 13.
A chamber 21 that movably stores the upper end of 6 and the pin 17.
and a heat source 23 having a negative pressure passage 22 communicating therewith. A vibrator 25, which is part of a simple vacuum system, is connected to the negative pressure passage 22 of the heat source 23.

In the element removal device having the above configuration, first, the heater block 13 is placed over the element 12 on the circuit board 11, and the element 12 is housed in the internal space 14.
The external lead terminal 18 of the element 12 is connected to the heater block 13.
The solder attached to the external lead terminal 18 is melted by the heat from the heat source 23 by applying pressure with the lower end surface 13a of the terminal.

In this way, the external lead terminal 18 is connected to the heater block 1.
3, the suction jig 16 descends due to its own weight and comes into close contact with two surfaces of the element 12. next,
After the solder is sufficiently melted, the passage 22. The suction jig 1 generates negative pressure through the chamber 21.
6 into the hole 19. Then, since the lower end surface of the suction jig j6 and the upper surface of the element 12 are in close contact with each other, the suction jig 1
6 rises while adsorbing the element 12 by the negative pressure introduced into the hole 19, and removes the element 12 from the circuit board 11.

In this way, the vacuum is guided to the hole 19 of the suction jig 16 that is closed by the top surface of the element 12, so that the vacuum can act 100% effectively on the element 12 without leaking.
The element 12 can be removed from the circuit board 11 with a small force, that is, with a small and lightweight vacuum system 25. Furthermore, since the vacuum is introduced only into the hole 19 of the suction jig 16 and not into the internal space 14 of the heater block 13, the There is no flow of air into the internal space 14 of the heater block 13 through the molten part of the solder, so the solder does not solidify, and the element 12 can be reliably, quickly, and easily removed with a small force. It can be removed from the circuit board 11.

In the above embodiment, the suction jig 16 is lowered by its own weight, but the suction jig 16 may be biased toward the element by a weak spring. Further, the spring may cause the suction jig to operate in a horizontal direction or in a diagonal direction with respect to a horizontal plane.

<Effects of the Invention> As is clear from the above, the element removal device of the present invention includes a cylindrical suction jig that is connected to a vacuum system and is movable in the inner space of the heater block. Since the device is removed from the circuit board by suction, the vacuum can be used 100% effectively.
There are no vacuum leaks, so it is small, lightweight,
By easily, quickly, and reliably removing the element, the economic efficiency of the element removal work can be improved.

[Brief explanation of drawings]

FIG. 1 is a sectional view of an embodiment of the present invention, and FIG. 2 is a sectional view of a conventional example. 11... Circuit board, 12... Element, 13.
... Heater block, 14 ... Internal space,
16... Suction jig, 23... Heat source, 25...
·pipe. Patent applicant: Sharp Corporation Agent
Patent Attorneys: Aohaku, Ao, and 2 others (Figure 2)

Claims (1)

[Claims] (1) A heater block that has an internal space for accommodating an element such as a flat package type integrated circuit or a large-scale integrated circuit mounted on a circuit board, and that heats the metal part of the element at its end surface; and a cylindrical suction jig that is placed in the internal space of the heater block, is slidably fitted into the heater block, and is connected to a vacuum system, and the suction jig is arranged in the inner space of the heater block. The element is closely attached to a package, and then the suction jig attracts the element using negative pressure from the vacuum system and separates it from the circuit board, thereby removing the element from the circuit board. Removal device.