JPS5554265A - Reflow soldering method - Google Patents

Reflow soldering method

Info

Publication number
JPS5554265A
JPS5554265A JP12590778A JP12590778A JPS5554265A JP S5554265 A JPS5554265 A JP S5554265A JP 12590778 A JP12590778 A JP 12590778A JP 12590778 A JP12590778 A JP 12590778A JP S5554265 A JPS5554265 A JP S5554265A
Authority
JP
Japan
Prior art keywords
heating
tip
leads
soldering
reflow soldering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12590778A
Other languages
Japanese (ja)
Inventor
Toshihiro Sakamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP12590778A priority Critical patent/JPS5554265A/en
Publication of JPS5554265A publication Critical patent/JPS5554265A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE: To bond the part leads tightly and perfectly in a simple constitution, by forcing to cool the heating tip end or soldering part, when reflow-soldering by always pressing the heating tip to the part leads.
CONSTITUTION: The temperature at the end of a heating tip 3 of reflow soldering device of continuous heating system is controlled by the thermocouple welded thereto and a control device. The heating tip 3 is positioned to the leads of multi- terminal lead part of Lsi or the like, and the microswitch is operated when reaching the set pressurizing force of the pressurizing device to apply pressurization and heating to the lead part for the set time of the timer, thus performing reflow soldering. Simultaneously with the end time of this, a timer for cooling is operated, and air is forced out from the end 5 of a cooling pipe 9 by means of a solenoid valve 7. By setting the time going below the melting point of the solder, the solder may be perfectly solidified, and the part leads may not be moved when the tip is removed.
COPYRIGHT: (C)1980,JPO&Japio
JP12590778A 1978-10-13 1978-10-13 Reflow soldering method Pending JPS5554265A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12590778A JPS5554265A (en) 1978-10-13 1978-10-13 Reflow soldering method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12590778A JPS5554265A (en) 1978-10-13 1978-10-13 Reflow soldering method

Publications (1)

Publication Number Publication Date
JPS5554265A true JPS5554265A (en) 1980-04-21

Family

ID=14921852

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12590778A Pending JPS5554265A (en) 1978-10-13 1978-10-13 Reflow soldering method

Country Status (1)

Country Link
JP (1) JPS5554265A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61200655U (en) * 1985-06-03 1986-12-16
JPS61200656U (en) * 1985-06-03 1986-12-16
US4735354A (en) * 1986-09-19 1988-04-05 Toyo Electronics Corp. Method of soldering component on printed circuit board
JPS6376364U (en) * 1986-10-31 1988-05-20
JPS6380074U (en) * 1986-11-14 1988-05-26
US5927588A (en) * 1996-02-02 1999-07-27 Kel Corporation Constant-heat type heating device and soldering method and soldering apparatus with heating device
EP1254737A1 (en) * 2001-05-03 2002-11-06 VA TECH Transport- und Montagesysteme GmbH & Co Pressing device and method for welding sheet-like materials

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61200655U (en) * 1985-06-03 1986-12-16
JPS61200656U (en) * 1985-06-03 1986-12-16
JPH0230136Y2 (en) * 1985-06-03 1990-08-14
JPH0239649Y2 (en) * 1985-06-03 1990-10-24
US4735354A (en) * 1986-09-19 1988-04-05 Toyo Electronics Corp. Method of soldering component on printed circuit board
JPS6376364U (en) * 1986-10-31 1988-05-20
JPS6380074U (en) * 1986-11-14 1988-05-26
US5927588A (en) * 1996-02-02 1999-07-27 Kel Corporation Constant-heat type heating device and soldering method and soldering apparatus with heating device
EP1254737A1 (en) * 2001-05-03 2002-11-06 VA TECH Transport- und Montagesysteme GmbH & Co Pressing device and method for welding sheet-like materials

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