JPS5626674A - Method and device for soldering - Google Patents
Method and device for solderingInfo
- Publication number
- JPS5626674A JPS5626674A JP10243479A JP10243479A JPS5626674A JP S5626674 A JPS5626674 A JP S5626674A JP 10243479 A JP10243479 A JP 10243479A JP 10243479 A JP10243479 A JP 10243479A JP S5626674 A JPS5626674 A JP S5626674A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- soldering
- crucible
- flux
- fixed amount
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Molten Solder (AREA)
- Manufacturing Of Electrical Connectors (AREA)
Abstract
PURPOSE: To perform build-up soldering easily with good reliability by heating the specific solvent in a crucible to above the solder melting temp., supplying a fixed amount of solder into this, melting the same and allowing the soldering work having been preheated to contact the molten solder.
CONSTITUTION: The soldering part 2 of the soldering work 1 is immersed in the flux 7 in a flux vessel 6 to coat the flux. The soldering part 2 is then immersed into the solder 9 in a solder vessel 8 which has been heated to melt at a suitable temp. by a heater 10, whereby it is subjected to presoldering and preheating. Next, at the temp. at which the solder melts, a solvent 13 such as silicone oil or glycerol which is liquid and has surface tension lower than that of the molten solder is heated to above the m.p. of the solder in crucible 12 by a heater 11 and a fixed amount of solder 15 is supplied into this by a fixed amount solder supplying device 14, so that the solder is melted and spheroidized in the solvent 13. Next, the preheated soldering work 1 is inserted into the crucible and is contacted with the solder 15, whereby solder build-up 5" is formed on the soldering part 2.
COPYRIGHT: (C)1981,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10243479A JPS5626674A (en) | 1979-08-10 | 1979-08-10 | Method and device for soldering |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10243479A JPS5626674A (en) | 1979-08-10 | 1979-08-10 | Method and device for soldering |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5626674A true JPS5626674A (en) | 1981-03-14 |
Family
ID=14327352
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10243479A Pending JPS5626674A (en) | 1979-08-10 | 1979-08-10 | Method and device for soldering |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5626674A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62107389U (en) * | 1985-12-26 | 1987-07-09 |
-
1979
- 1979-08-10 JP JP10243479A patent/JPS5626674A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62107389U (en) * | 1985-12-26 | 1987-07-09 | ||
JPH0239351Y2 (en) * | 1985-12-26 | 1990-10-22 |
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