JPS5626674A - Method and device for soldering - Google Patents

Method and device for soldering

Info

Publication number
JPS5626674A
JPS5626674A JP10243479A JP10243479A JPS5626674A JP S5626674 A JPS5626674 A JP S5626674A JP 10243479 A JP10243479 A JP 10243479A JP 10243479 A JP10243479 A JP 10243479A JP S5626674 A JPS5626674 A JP S5626674A
Authority
JP
Japan
Prior art keywords
solder
soldering
crucible
flux
fixed amount
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10243479A
Other languages
Japanese (ja)
Inventor
Yuji Uesugi
Shuichi Murakami
Kazuhide Watanabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP10243479A priority Critical patent/JPS5626674A/en
Publication of JPS5626674A publication Critical patent/JPS5626674A/en
Pending legal-status Critical Current

Links

Landscapes

  • Molten Solder (AREA)
  • Manufacturing Of Electrical Connectors (AREA)

Abstract

PURPOSE: To perform build-up soldering easily with good reliability by heating the specific solvent in a crucible to above the solder melting temp., supplying a fixed amount of solder into this, melting the same and allowing the soldering work having been preheated to contact the molten solder.
CONSTITUTION: The soldering part 2 of the soldering work 1 is immersed in the flux 7 in a flux vessel 6 to coat the flux. The soldering part 2 is then immersed into the solder 9 in a solder vessel 8 which has been heated to melt at a suitable temp. by a heater 10, whereby it is subjected to presoldering and preheating. Next, at the temp. at which the solder melts, a solvent 13 such as silicone oil or glycerol which is liquid and has surface tension lower than that of the molten solder is heated to above the m.p. of the solder in crucible 12 by a heater 11 and a fixed amount of solder 15 is supplied into this by a fixed amount solder supplying device 14, so that the solder is melted and spheroidized in the solvent 13. Next, the preheated soldering work 1 is inserted into the crucible and is contacted with the solder 15, whereby solder build-up 5" is formed on the soldering part 2.
COPYRIGHT: (C)1981,JPO&Japio
JP10243479A 1979-08-10 1979-08-10 Method and device for soldering Pending JPS5626674A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10243479A JPS5626674A (en) 1979-08-10 1979-08-10 Method and device for soldering

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10243479A JPS5626674A (en) 1979-08-10 1979-08-10 Method and device for soldering

Publications (1)

Publication Number Publication Date
JPS5626674A true JPS5626674A (en) 1981-03-14

Family

ID=14327352

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10243479A Pending JPS5626674A (en) 1979-08-10 1979-08-10 Method and device for soldering

Country Status (1)

Country Link
JP (1) JPS5626674A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62107389U (en) * 1985-12-26 1987-07-09

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62107389U (en) * 1985-12-26 1987-07-09
JPH0239351Y2 (en) * 1985-12-26 1990-10-22

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