JPS5594777A - Brazing cell device - Google Patents

Brazing cell device

Info

Publication number
JPS5594777A
JPS5594777A JP221479A JP221479A JPS5594777A JP S5594777 A JPS5594777 A JP S5594777A JP 221479 A JP221479 A JP 221479A JP 221479 A JP221479 A JP 221479A JP S5594777 A JPS5594777 A JP S5594777A
Authority
JP
Japan
Prior art keywords
solder
solder liquid
temperature region
soldering
low temperature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP221479A
Other languages
Japanese (ja)
Inventor
Atsushi Ono
Yoshiaki Tatsumi
Yoshiki Shiraiwa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP221479A priority Critical patent/JPS5594777A/en
Publication of JPS5594777A publication Critical patent/JPS5594777A/en
Pending legal-status Critical Current

Links

Landscapes

  • Molten Solder (AREA)
  • Coating With Molten Metal (AREA)

Abstract

PURPOSE: To improve the workability of soldering process and improve the quality of soldering by providing a low temperature part in the molten solder liquid in the solder cell thereby depositing and removing the other metal melted into the solder liquid in the low temperature region.
CONSTITUTION: High temperature region heaters 13a and low temperature region heater 13b are installed to the solder cell 1 containing molten solder liquid 12. The high temperature region solder liquid part 12a suited for soldering of 250W350°C and low temperature region solder liquid part 12c of about 200°C are formed to the solder liquid in the solder cell 1 through heating by these heaters and an intermediate temperature region solder liquid part 12b is formed therebetween. If the immersion soldering work is continued in the high temperature region solder liquid part 12a, the metal to be soldered melts and accumulates in the solder liquid. This metal moves to the low temperature solder liquid part and is deposited and removed, hence there is no need for suspending the work for cleaning the solder liquid. In addition, soldering is done by the always clean liquid and therefore there is no degradation in the appearance and quality of the soldered portions.
COPYRIGHT: (C)1980,JPO&Japio
JP221479A 1979-01-16 1979-01-16 Brazing cell device Pending JPS5594777A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP221479A JPS5594777A (en) 1979-01-16 1979-01-16 Brazing cell device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP221479A JPS5594777A (en) 1979-01-16 1979-01-16 Brazing cell device

Publications (1)

Publication Number Publication Date
JPS5594777A true JPS5594777A (en) 1980-07-18

Family

ID=11523094

Family Applications (1)

Application Number Title Priority Date Filing Date
JP221479A Pending JPS5594777A (en) 1979-01-16 1979-01-16 Brazing cell device

Country Status (1)

Country Link
JP (1) JPS5594777A (en)

Similar Documents

Publication Publication Date Title
ES474830A1 (en) Tinned copper braid for solder removing and method of manufacturing the same.
JPS5594777A (en) Brazing cell device
JPS53148749A (en) Electronic range
JPS54142584A (en) Preparation of compound superconductive wire or coil
SU863710A1 (en) Method of diffusion saturation of metals and alloys
JPS56158270A (en) Soldering method and soldering iron
JPS5410442A (en) Enclosing process of sheathed heater
KR920007930B1 (en) Process for removing copper in the molten solder
JPS58117865A (en) Continuous plating method for metallic wire
JPS5797213A (en) Supporting method of quartz oscillator
JPS5519438A (en) Brazing method
JPS5626674A (en) Method and device for soldering
SU116865A1 (en) The method of tinning and soldering ceramic products, abrasives, ferrites, etc. of materials
JPS55133868A (en) Soldering method to portion to be soldered of electronic parts
JPS5771825A (en) Start-up of vitrification melting furnace
SU571019A1 (en) Device for removal surplus solder from tinned printed circuit boards
JPS5722882A (en) Welding method
JPS5838693A (en) Soldering method
JPS5647563A (en) Soldering depositor
JPS5550619A (en) Manufacturing single crystal
JPS5659598A (en) Spectacle frame
SU583901A1 (en) Low-temperature soldering flux
JPS54103745A (en) Chemical polishing method
JPS56131066A (en) Silver-alloy brazing
JPS5764473A (en) Method for supersonic preliminary soldering