JPS5647563A - Soldering depositor - Google Patents

Soldering depositor

Info

Publication number
JPS5647563A
JPS5647563A JP12410379A JP12410379A JPS5647563A JP S5647563 A JPS5647563 A JP S5647563A JP 12410379 A JP12410379 A JP 12410379A JP 12410379 A JP12410379 A JP 12410379A JP S5647563 A JPS5647563 A JP S5647563A
Authority
JP
Japan
Prior art keywords
solder
melted
chamber
deposition
crucible
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12410379A
Other languages
Japanese (ja)
Other versions
JPS6240427B2 (en
Inventor
Masayuki Sato
Takehisa Nitta
Kensuke Nakada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP12410379A priority Critical patent/JPS5647563A/en
Publication of JPS5647563A publication Critical patent/JPS5647563A/en
Publication of JPS6240427B2 publication Critical patent/JPS6240427B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/246—Replenishment of source material

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

PURPOSE:To raise the speed of deposition of solder by a method a solder is beforehand melted in a vacuum chamber, and then the melted solder is drawn out of the lower part of its liquid surface and supplied into a heating container serving as a deposition source inside a vapor deposition chamber. CONSTITUTION:The solder 5 is melted in the crucible 3 by the heater 4 in the preliminary melting chamber 2 kept under a vacuum, and then the melted solder 5 in the crucible 3 is supplied through the cock 6 and the soaking supply pipe 7 from the lower part of its liquid surface into the deposition source container 8 inside the vapor disposition chamber 1. The solder 5 supplied in the deposition source container is further heated by the heater 9 and then deposited over the wafer 13 attached to the wafer holder 12 by opening or closing the valve 10 and the shutter 11. Thus, since the solder is melted under vacuum in advance, no release of gas occurs in the vapor deposition chamber and the scum 14 stays in the crucible 3 of the preliminary melting chamber, and therefore, the speed of deposition of solder can be raised.
JP12410379A 1979-09-28 1979-09-28 Soldering depositor Granted JPS5647563A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12410379A JPS5647563A (en) 1979-09-28 1979-09-28 Soldering depositor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12410379A JPS5647563A (en) 1979-09-28 1979-09-28 Soldering depositor

Publications (2)

Publication Number Publication Date
JPS5647563A true JPS5647563A (en) 1981-04-30
JPS6240427B2 JPS6240427B2 (en) 1987-08-28

Family

ID=14876992

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12410379A Granted JPS5647563A (en) 1979-09-28 1979-09-28 Soldering depositor

Country Status (1)

Country Link
JP (1) JPS5647563A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2568662A1 (en) * 1984-07-31 1986-02-07 Instruments Sa Device for temporarily isolating an object from a vacuum enclosure
JPS6350472A (en) * 1986-08-19 1988-03-03 Hitachi Maxell Ltd Vacuum deposition device
JP2006309085A (en) * 2005-05-02 2006-11-09 Takuyou:Kk Room name display device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2568662A1 (en) * 1984-07-31 1986-02-07 Instruments Sa Device for temporarily isolating an object from a vacuum enclosure
JPS6350472A (en) * 1986-08-19 1988-03-03 Hitachi Maxell Ltd Vacuum deposition device
JP2006309085A (en) * 2005-05-02 2006-11-09 Takuyou:Kk Room name display device

Also Published As

Publication number Publication date
JPS6240427B2 (en) 1987-08-28

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