JPS56131066A - Silver-alloy brazing - Google Patents

Silver-alloy brazing

Info

Publication number
JPS56131066A
JPS56131066A JP3396680A JP3396680A JPS56131066A JP S56131066 A JPS56131066 A JP S56131066A JP 3396680 A JP3396680 A JP 3396680A JP 3396680 A JP3396680 A JP 3396680A JP S56131066 A JPS56131066 A JP S56131066A
Authority
JP
Japan
Prior art keywords
round bar
solder
piercing hole
silver
silver solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3396680A
Other languages
Japanese (ja)
Inventor
Yokichi Tanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP3396680A priority Critical patent/JPS56131066A/en
Publication of JPS56131066A publication Critical patent/JPS56131066A/en
Pending legal-status Critical Current

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  • Adornments (AREA)

Abstract

PURPOSE: To intercept a piercing hole and make the soldering easy by melting the silver solder at the end of round bar, by heating the round bar on which the silver solder is attached and which is inserted into the piercing hole, from the outside.
CONSTITUTION: Solidified solder 8 is obtained in such way that silver solder bar is heated and the half melted solder is trickled on the end of copper round bar 2 and the hemisphere-shaped solder trickled on the round bar is cooled. Copper round bar 2 on which the solidified silver solder is attached is set to intercepting part 5 of piercing hole 4 having a small diameter in base metal 3. The part of base metal 3 where round bar 2 is inserted, is heated from upper and lower sides with gas burner 6, and solder 8 is melted. Then the molten solder is evenly spread through the space between piercing hole 4 of base metal 3 and round bar 2, and thus piercing hole 4 is intercepted. Any other materials can be applied for copper round bar 2 if the silver solder can be attached on them.
COPYRIGHT: (C)1981,JPO&Japio
JP3396680A 1980-03-19 1980-03-19 Silver-alloy brazing Pending JPS56131066A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3396680A JPS56131066A (en) 1980-03-19 1980-03-19 Silver-alloy brazing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3396680A JPS56131066A (en) 1980-03-19 1980-03-19 Silver-alloy brazing

Publications (1)

Publication Number Publication Date
JPS56131066A true JPS56131066A (en) 1981-10-14

Family

ID=12401226

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3396680A Pending JPS56131066A (en) 1980-03-19 1980-03-19 Silver-alloy brazing

Country Status (1)

Country Link
JP (1) JPS56131066A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59105346A (en) * 1982-12-08 1984-06-18 Tanaka Kikinzoku Kogyo Kk Manufacture of silver brazed lead pin

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59105346A (en) * 1982-12-08 1984-06-18 Tanaka Kikinzoku Kogyo Kk Manufacture of silver brazed lead pin
JPS6351543B2 (en) * 1982-12-08 1988-10-14 Tanaka Precious Metal Ind

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