JPH0239649Y2 - - Google Patents

Description

[Detailed description of the invention] [Field of industrial application] The present invention relates to a device for soldering microcomponents such as flat package ICs (hereinafter referred to as flat ICs) to printed circuit boards. , relates to a heat shielding mechanism in a processing device that prevents minute parts from receiving thermal damage.

[Conventional technology]

When soldering minute parts to a printed circuit board,
Irradiation of heat rays to areas other than the parts to be machined of minute parts must be avoided. For example, JP-A-49-
The device disclosed in No. 47876 has holes for irradiating infrared rays in a metal plate that shields infrared heat rays, and a heat-resistant heat ray transmitting plate is attached to the holes for irradiating infrared rays. This prevents the irradiation of infrared heat rays, and also presses the heat-resistant heat ray transmitting plate directly against the processing area, thereby preventing the formation of gaps in the processing area.

[The problem that the idea attempts to solve]

However, since such a device solders by directly pressing a heat-resistant heat ray transmitting plate against the processed area, there have been problems such as impurities such as flux adhering to the processed area.

The present applicant has developed a non-contact type soldering device that uses hot wires, instead of directly heating the processed parts, and uses heat rays from a pair of heat source units that can move up and down to irradiate the processed parts of micro parts. At the same time, we proposed a device that applies pressure to the lower end opening edge of a vertically movable air rod placed between these heat source units to prevent microcomponents from shifting from the processing position.

This device pressurizes the upper surface of a microcomponent set at a position to be machined with the lower end opening of the air rod, and then lowers the heat source unit close to the machined area to irradiate the machined area with heat rays from opposite directions. After soldering, the heat source unit is raised to the work standby position, and cooling air is supplied to the air rod to blow the cooling air onto the micro parts. After that, the air rod is raised to release the pressure on the micro parts. In this case, the heat rays from the heat source unit that is waiting for the next operation will irradiate and heat the middle part of the air rod, causing a problem of adverse thermal effects on the minute parts being pressurized.

The present invention was developed based on these circumstances, and even if the air rod that pressurizes minute parts is heated by the hot wire of the heat source unit in the standby position for work, the heat will not be conducted to the minute parts. It is an object of the present invention to provide a heat shielding mechanism for a processing device, which can increase the safety of microcomponents against heat by blocking heat, and can uniformly cool the entire surface of microcomponents after soldering.

[Means to solve the problem]

As mentioned above, the problem is that, according to the present invention, in a device that irradiates hot rays from a heat source unit onto the processed parts of microcomponents for soldering, an air rod is attached to the lower end of an air rod that pressurizes microcomponents and supplies cooling air. The pressing plate is made of a base plate formed of a heat shielding material, a mounting tube provided on the upper surface of the base plate to be attached to the air rod, a plurality of protrusions provided on the lower surface of the base plate for pressurizing minute parts, and a base. It is an object of the present invention to provide a heat shielding mechanism for a processing apparatus, characterized in that it is constituted by a hole formed approximately in the center of a plate and communicating with the supply path of the air rod.

〔Example〕

The embodiments shown in the drawings will be described below with reference to the drawings.

In FIG. 1, a fixing plate 1 attached to a suitable fixing member holds a first actuating mechanism 2 consisting of an air cylinder or a hydraulic cylinder. The actuating rod 3 of the first actuating mechanism 2 is connected to a first section 5 that projects upward in FIG. 1, and a second section 6 that projects rightward in FIG. 1 is connected to a cooling air pipe 7 and a connector. The upper end of the air rod 11 is connected to a third section 10 which communicates with the passages 8 and 9 in the air rod 4 and further projects downward in FIG. The air rod 11 is fitted into the holder so as to be movable up and down, and a pressure plate 12 is attached to the lower end of the air rod 11.
is attached. The pressure plate 12 is made of a heat shielding material such as ceramics, and has a square base plate 13, on the top of which a mounting tube 14 for attaching to the air rod 11 is provided. A hole 16 communicating with the supply path 15 of the air rod 11 is formed in the center of the base plate 13, and a plurality of protrusions 17 are provided on the lower surface of the base plate 13.
These protrusions 17 press the upper surface of the microcomponent 19 positioned at a predetermined position on the substrate 18, and a gap is formed between the microcomponent 19 and the base plate 13 for discharging cooling air. However, when cooling air is flowing between the two, a cooling air layer is formed between the press plate 12 and the microcomponent 19. Since the protrusions 17 are provided at the four corners of the base plate 13 in the case of a genuine model, the micro parts 1
9 are pressurized with uniform pressure, and cooling air is also uniformly discharged from the circumferential direction of the microcomponents 19. Terminals 20 to be connected are provided on the substrate 18, and terminals 21 to be connected to the microcomponents 19 are similarly provided. These terminals 20 and 21 are aligned with each other to form a processing region L, and soldering is performed by irradiating the region with hot rays.

The main body 23 of the holder 22 is the vertical movement element 2
4, and the other end is connected to a second actuation mechanism 25 consisting of an air cylinder or a hydraulic cylinder. The second operating mechanism 25 is held by a fixed plate 26, and the air rod 11 is inserted into a through hole 28 of an inner cylinder 27 provided in the main body 23. The stopper tube 31 is screwed to the mounting tube 30 screwed to the opening 29 of the main body 23, and if necessary, the stopper tube 31 can be replaced with a stopper tube with a different outer diameter to adjust the heat ray irradiation width interval "W".
Adjust. If a stopper cylinder 31 with a small outer diameter is used, the interval between "W" can be narrowed, and conversely, if a stopper cylinder 31 with a large outer diameter is used, the interval between "W" can be widened. The holder 22 is the arm 3
2, 32, and heat source units 36, 37 are pivotally connected to the ends of the arms 32, 32 by adjustment shafts 34, 35. When the edges 36a, 37a of the heat source bodies 36, 37 come into contact with the stopper cylinder 31, the interval between them is regulated, so if the stopper cylinder 31 that matches the interval "W" is selected in advance, the processing area can be adjusted. The hot wire width can be easily matched to the spacing width. The heat source units 36 and 37 have reflective surfaces 39 and 40,
In addition, heat source lamps 41 and 42 are provided so as to be replaceable.

As shown in FIG. 6, the circuit of the device includes a cooling water pump for cooling the heat source units 36 and 37 between the power switch S1 and the work switch S2.
Connect compressor 43. Work switch S2
A first timer relay 44 is connected to the next stage, and a first actuation mechanism 2 for pressing minute parts and a cooling air solenoid valve 45 are connected to the relay 44. A second timer relay 46 that operates a second operating mechanism is connected to the next stage of the first timer relay 44, and a transformer 47 of the first heat source lamp 41 and a transformer 48 of the second heat source lamp 42 are connected to this, respectively.

For example, in order to set and solder a square-shaped microcomponent 19 on the board 18, turn on the power switch S.
1 to turn on the cooling water pump/compressor 43.
When the cooling water is activated, the cooling water flows into the heat source unit 36,
It circulates within 37. Next, when the work switch S2 is turned on and the first timer relay 44 and first actuating mechanism 2 are activated, the air rod 11 is lowered.
The protrusion 17 of the pressing plate 12 presses the upper surface of the microcomponent 19. Next, the second actuation mechanism is actuated by the second timer relay 46, and the vertical movement element 24
The holder 24 is lowered and the heat source lamp 4
Heat rays No. 1 and 42 are irradiated onto the processing area L, and the processing area is soldered. After 0 to 30 seconds of soldering has elapsed, the vertical movement element 24 is moved upward by the second timer relay 46, and the heat source units 36 and 37 are moved to the standby position for the next operation. In this case, the heat rays of the heat source lamps 41 and 42 irradiate and heat the air rod 11, but the heat is shielded by the press plate 12, thereby preventing electric heat from being applied to the microcomponent 19 side. At the same time, the solenoid valve 45 of the cooling air source is activated by the first timer relay 44, and the cooling air supplied from the cooling pipe 7 to the air rod 15 via the passages 8 and 9 is supplied to the micro parts 19 from the hole 16 of the pressing plate 12. It is sprayed onto the top surface and flows evenly to each edge of the microcomponent 19, cooling the entire part uniformly. When the solenoid valve 45 is activated by the first timer relay 44, the supply of cooling air is stopped, the first actuation mechanism 2 is activated by the first timer relay 44, the air rod 11 is moved upward, and the pressure plate 12 is activated. is removed from the microcomponent 19, and one cycle of work is completed.

[Effect of idea]

As explained above, in the present invention, the holding plate attached to the lower end of the air rod that supplies cooling air to minute parts consists of a base plate formed from a heat shielding material, and the base plate has a mounting tube on its upper surface. By providing a plurality of protrusions on the lower surface for pressurizing the microcomponents, and forming a hole communicating with the supply path of the air rod in the approximate center of the base plate, various effects listed below can be obtained.

(1) When the heat source unit is in the standby position after soldering, even if the air rod that presses the microcomponents receives heat from the hot wire, the press plate blocks heat transfer to the microcomponents, preventing thermal effects. .

(2) The air rod, which has received heat from the hot wire, is shielded from heat by the press plate and a cooling air layer is formed between the micro parts and the press plate, so heat insulation is double-layered and the micro parts are shielded from heat. The thermal effect is further improved.

(3) The cooling air supplied from the air rod is blown onto the top surface of the micro parts through the holes in the base plate.
Since it flows circumferentially on the surface and is discharged from between the base plate and the microcomponent, the entire microcomponent is cooled uniformly.

[Brief explanation of the drawing]

The drawings show an embodiment of the present invention.
The figure is a front view with a part of the soldering device in section, Figure 2 is an enlarged sectional view of the pressure plate, Figure 3 is a plan view of the processing area after cutting the mounting tube of the pressure plate, and Figure 4 5 is a partially sectional front view of the soldering state, FIG. 5 is a partially sectional front view of the heat source unit raised to the standby position after soldering, and FIG. 6 is a block diagram of the device. , FIG. 7 is a chart of the working process. Explanation of symbols, 11... Air rod, 12...
Pressing plate, 19... Micro parts, 14... Mounting cylinder, 15... Supply path, 16... Hole, 17... Protrusion, 36, 37... Heat source unit.

Claims (1)

[Scope of utility model registration request] In a device that irradiates heat rays from a heat source unit onto the processing area of microcomponents for soldering, a pressure plate attached to the lower end of the air rod that processes microcomponents and supplies cooling air connects the base molded with heat shielding material. a mounting tube provided on the upper surface of the base plate for attaching to the air rod; a plurality of protrusions provided on the lower surface of the base plate for pressurizing minute components; 1. A heat shielding mechanism for a processing device, comprising a hole communicating with a supply path.