JPS6461989A - Method of soldering surface mounted component - Google Patents

Method of soldering surface mounted component

Info

Publication number
JPS6461989A
JPS6461989A JP21987087A JP21987087A JPS6461989A JP S6461989 A JPS6461989 A JP S6461989A JP 21987087 A JP21987087 A JP 21987087A JP 21987087 A JP21987087 A JP 21987087A JP S6461989 A JPS6461989 A JP S6461989A
Authority
JP
Japan
Prior art keywords
solders
soldered
dipsoldering
lands
leads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP21987087A
Other languages
Japanese (ja)
Inventor
Hiroshi Onishi
Toru Yokoyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP21987087A priority Critical patent/JPS6461989A/en
Publication of JPS6461989A publication Critical patent/JPS6461989A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE:To enable a soldering process of lands with solders to be performed as they are by a dipsoldering process by a method wherein a surface mounted part with leads is mounted on the lands with solders by the dipsoldering process; braided copper wirings with solders are put upon the mounted component and solders are heat-melted to be soldered. CONSTITUTION:When a dipsoldable part is soldered by the dipsoldering process, a surface mounted part 2 e.g. an LSI with flat leads 2a is mounted on a soldered printed substrate 1. Then, braided copper wires 4 with solders including flux and solders are put upon the leads 2a; a heater 5 is pressurized in the arrow direction; and solders 3, 3a bonded on lands 1a as well as the other solders 20 or 32 contained in the braided copper wires 4 with solders are heat-melted to be soldered. In such a constitution, the braided copper wires 4 with solders braided like a tape are used in strip form 4a cut in lead line unit or stamped in a frame form 4b conforming to the part form in case multiple wires 4 are used.
JP21987087A 1987-09-01 1987-09-01 Method of soldering surface mounted component Pending JPS6461989A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21987087A JPS6461989A (en) 1987-09-01 1987-09-01 Method of soldering surface mounted component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21987087A JPS6461989A (en) 1987-09-01 1987-09-01 Method of soldering surface mounted component

Publications (1)

Publication Number Publication Date
JPS6461989A true JPS6461989A (en) 1989-03-08

Family

ID=16742347

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21987087A Pending JPS6461989A (en) 1987-09-01 1987-09-01 Method of soldering surface mounted component

Country Status (1)

Country Link
JP (1) JPS6461989A (en)

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