JPS53147263A - Method of soldering wiring substrate of electronic part - Google Patents

Method of soldering wiring substrate of electronic part

Info

Publication number
JPS53147263A
JPS53147263A JP6197677A JP6197677A JPS53147263A JP S53147263 A JPS53147263 A JP S53147263A JP 6197677 A JP6197677 A JP 6197677A JP 6197677 A JP6197677 A JP 6197677A JP S53147263 A JPS53147263 A JP S53147263A
Authority
JP
Japan
Prior art keywords
wiring substrate
electronic part
soldering wiring
soldering
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6197677A
Other languages
Japanese (ja)
Inventor
Teruyo Noguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP6197677A priority Critical patent/JPS53147263A/en
Publication of JPS53147263A publication Critical patent/JPS53147263A/en
Pending legal-status Critical Current

Links

JP6197677A 1977-05-26 1977-05-26 Method of soldering wiring substrate of electronic part Pending JPS53147263A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6197677A JPS53147263A (en) 1977-05-26 1977-05-26 Method of soldering wiring substrate of electronic part

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6197677A JPS53147263A (en) 1977-05-26 1977-05-26 Method of soldering wiring substrate of electronic part

Publications (1)

Publication Number Publication Date
JPS53147263A true JPS53147263A (en) 1978-12-21

Family

ID=13186710

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6197677A Pending JPS53147263A (en) 1977-05-26 1977-05-26 Method of soldering wiring substrate of electronic part

Country Status (1)

Country Link
JP (1) JPS53147263A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55141793A (en) * 1979-04-20 1980-11-05 Matsushita Electric Ind Co Ltd Method of mounting leadless component to bothhside printed circuit board
JPS5948990A (en) * 1982-09-13 1984-03-21 松下電工株式会社 Mounting structure for small size electric part
JPS59201486A (en) * 1983-04-21 1984-11-15 ニツクスドルフコンピユ−タアクチエンゲゼルシヤフト Method of soldering circuit element to circuit board
JPS6114791A (en) * 1984-06-29 1986-01-22 日本電気ホームエレクトロニクス株式会社 Printed board for mounting electronic part
JPH02100392A (en) * 1988-08-09 1990-04-12 Northern Telecom Ltd Circuit board and soldering method
JPH02306692A (en) * 1989-05-22 1990-12-20 Hitachi Ltd Mounting method for component on circuit substrate

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS502167A (en) * 1973-05-16 1975-01-10
JPS5132958A (en) * 1974-09-13 1976-03-19 Sony Corp FURATSUTOBONDODENSHIBUHIN NO KETSUGOHOHO

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS502167A (en) * 1973-05-16 1975-01-10
JPS5132958A (en) * 1974-09-13 1976-03-19 Sony Corp FURATSUTOBONDODENSHIBUHIN NO KETSUGOHOHO

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55141793A (en) * 1979-04-20 1980-11-05 Matsushita Electric Ind Co Ltd Method of mounting leadless component to bothhside printed circuit board
JPS6337516B2 (en) * 1979-04-20 1988-07-26 Matsushita Electric Ind Co Ltd
JPS5948990A (en) * 1982-09-13 1984-03-21 松下電工株式会社 Mounting structure for small size electric part
JPS59201486A (en) * 1983-04-21 1984-11-15 ニツクスドルフコンピユ−タアクチエンゲゼルシヤフト Method of soldering circuit element to circuit board
JPS6114791A (en) * 1984-06-29 1986-01-22 日本電気ホームエレクトロニクス株式会社 Printed board for mounting electronic part
JPH02100392A (en) * 1988-08-09 1990-04-12 Northern Telecom Ltd Circuit board and soldering method
JPH02306692A (en) * 1989-05-22 1990-12-20 Hitachi Ltd Mounting method for component on circuit substrate

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