JPS55141793A - Method of mounting leadless component to bothhside printed circuit board - Google Patents

Method of mounting leadless component to bothhside printed circuit board

Info

Publication number
JPS55141793A
JPS55141793A JP4950779A JP4950779A JPS55141793A JP S55141793 A JPS55141793 A JP S55141793A JP 4950779 A JP4950779 A JP 4950779A JP 4950779 A JP4950779 A JP 4950779A JP S55141793 A JPS55141793 A JP S55141793A
Authority
JP
Japan
Prior art keywords
bothhside
circuit board
printed circuit
leadless component
mounting leadless
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4950779A
Other languages
Japanese (ja)
Other versions
JPS6337516B2 (en
Inventor
Eiichi Tsunashima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP4950779A priority Critical patent/JPS55141793A/en
Publication of JPS55141793A publication Critical patent/JPS55141793A/en
Publication of JPS6337516B2 publication Critical patent/JPS6337516B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP4950779A 1979-04-20 1979-04-20 Method of mounting leadless component to bothhside printed circuit board Granted JPS55141793A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4950779A JPS55141793A (en) 1979-04-20 1979-04-20 Method of mounting leadless component to bothhside printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4950779A JPS55141793A (en) 1979-04-20 1979-04-20 Method of mounting leadless component to bothhside printed circuit board

Publications (2)

Publication Number Publication Date
JPS55141793A true JPS55141793A (en) 1980-11-05
JPS6337516B2 JPS6337516B2 (en) 1988-07-26

Family

ID=12833040

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4950779A Granted JPS55141793A (en) 1979-04-20 1979-04-20 Method of mounting leadless component to bothhside printed circuit board

Country Status (1)

Country Link
JP (1) JPS55141793A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH068201U (en) * 1992-07-02 1994-02-01 株式会社四国製作所 Sorted grain bagging device for grain sorter

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4917681A (en) * 1972-06-05 1974-02-16
JPS53147263A (en) * 1977-05-26 1978-12-21 Matsushita Electric Ind Co Ltd Method of soldering wiring substrate of electronic part
JPS5438562A (en) * 1977-09-01 1979-03-23 Sharp Kk Method of providing conduction between both surfaces of bilateral printed wiring board

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4917681A (en) * 1972-06-05 1974-02-16
JPS53147263A (en) * 1977-05-26 1978-12-21 Matsushita Electric Ind Co Ltd Method of soldering wiring substrate of electronic part
JPS5438562A (en) * 1977-09-01 1979-03-23 Sharp Kk Method of providing conduction between both surfaces of bilateral printed wiring board

Also Published As

Publication number Publication date
JPS6337516B2 (en) 1988-07-26

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