JPS54108273A - Method of mounting components on circuit board - Google Patents
Method of mounting components on circuit boardInfo
- Publication number
- JPS54108273A JPS54108273A JP1617278A JP1617278A JPS54108273A JP S54108273 A JPS54108273 A JP S54108273A JP 1617278 A JP1617278 A JP 1617278A JP 1617278 A JP1617278 A JP 1617278A JP S54108273 A JPS54108273 A JP S54108273A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- mounting components
- mounting
- components
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1617278A JPS54108273A (en) | 1978-02-14 | 1978-02-14 | Method of mounting components on circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1617278A JPS54108273A (en) | 1978-02-14 | 1978-02-14 | Method of mounting components on circuit board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS54108273A true JPS54108273A (en) | 1979-08-24 |
Family
ID=11909080
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1617278A Pending JPS54108273A (en) | 1978-02-14 | 1978-02-14 | Method of mounting components on circuit board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS54108273A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0476990A (en) * | 1990-07-19 | 1992-03-11 | Matsushita Electric Ind Co Ltd | Bonding method for electric component |
US8709197B2 (en) | 2005-12-08 | 2014-04-29 | Fujitsu Limited | Method of making electronic component and heat conductive member and method of mounting heat conductive member for electronic component |
-
1978
- 1978-02-14 JP JP1617278A patent/JPS54108273A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0476990A (en) * | 1990-07-19 | 1992-03-11 | Matsushita Electric Ind Co Ltd | Bonding method for electric component |
US8709197B2 (en) | 2005-12-08 | 2014-04-29 | Fujitsu Limited | Method of making electronic component and heat conductive member and method of mounting heat conductive member for electronic component |
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