JPS55166995A - Method of mounting semiconductor package to printed circuit board - Google Patents

Method of mounting semiconductor package to printed circuit board

Info

Publication number
JPS55166995A
JPS55166995A JP7487879A JP7487879A JPS55166995A JP S55166995 A JPS55166995 A JP S55166995A JP 7487879 A JP7487879 A JP 7487879A JP 7487879 A JP7487879 A JP 7487879A JP S55166995 A JPS55166995 A JP S55166995A
Authority
JP
Japan
Prior art keywords
circuit board
printed circuit
semiconductor package
mounting semiconductor
mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7487879A
Other languages
Japanese (ja)
Inventor
Ikuo Ariga
Takeshi Yoshioka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP7487879A priority Critical patent/JPS55166995A/en
Publication of JPS55166995A publication Critical patent/JPS55166995A/en
Pending legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP7487879A 1979-06-14 1979-06-14 Method of mounting semiconductor package to printed circuit board Pending JPS55166995A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7487879A JPS55166995A (en) 1979-06-14 1979-06-14 Method of mounting semiconductor package to printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7487879A JPS55166995A (en) 1979-06-14 1979-06-14 Method of mounting semiconductor package to printed circuit board

Publications (1)

Publication Number Publication Date
JPS55166995A true JPS55166995A (en) 1980-12-26

Family

ID=13560035

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7487879A Pending JPS55166995A (en) 1979-06-14 1979-06-14 Method of mounting semiconductor package to printed circuit board

Country Status (1)

Country Link
JP (1) JPS55166995A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6090870U (en) * 1983-11-25 1985-06-21 関西日本電気株式会社 Hybrid IC
JPH02241084A (en) * 1989-03-15 1990-09-25 Matsushita Electric Ind Co Ltd Electronic part mounting process and electronic part
WO2002085082A1 (en) * 2001-04-09 2002-10-24 Matsushita Electric Industrial Co., Ltd. Surface mounting type electronic component

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6090870U (en) * 1983-11-25 1985-06-21 関西日本電気株式会社 Hybrid IC
JPH02241084A (en) * 1989-03-15 1990-09-25 Matsushita Electric Ind Co Ltd Electronic part mounting process and electronic part
WO2002085082A1 (en) * 2001-04-09 2002-10-24 Matsushita Electric Industrial Co., Ltd. Surface mounting type electronic component
US6828667B2 (en) 2001-04-09 2004-12-07 Matsushita Electric Industrial Co., Ltd. Surface mounting type electronic component

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