JPS5533052A - Method of manufacturing multiilayer printed circuit board - Google Patents

Method of manufacturing multiilayer printed circuit board

Info

Publication number
JPS5533052A
JPS5533052A JP10521778A JP10521778A JPS5533052A JP S5533052 A JPS5533052 A JP S5533052A JP 10521778 A JP10521778 A JP 10521778A JP 10521778 A JP10521778 A JP 10521778A JP S5533052 A JPS5533052 A JP S5533052A
Authority
JP
Japan
Prior art keywords
manufacturing
circuit board
printed circuit
multiilayer
multiilayer printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10521778A
Other languages
Japanese (ja)
Inventor
Kazuhiko Yanagihara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP10521778A priority Critical patent/JPS5533052A/en
Publication of JPS5533052A publication Critical patent/JPS5533052A/en
Pending legal-status Critical Current

Links

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
JP10521778A 1978-08-29 1978-08-29 Method of manufacturing multiilayer printed circuit board Pending JPS5533052A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10521778A JPS5533052A (en) 1978-08-29 1978-08-29 Method of manufacturing multiilayer printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10521778A JPS5533052A (en) 1978-08-29 1978-08-29 Method of manufacturing multiilayer printed circuit board

Publications (1)

Publication Number Publication Date
JPS5533052A true JPS5533052A (en) 1980-03-08

Family

ID=14401494

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10521778A Pending JPS5533052A (en) 1978-08-29 1978-08-29 Method of manufacturing multiilayer printed circuit board

Country Status (1)

Country Link
JP (1) JPS5533052A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6153792A (en) * 1984-08-23 1986-03-17 株式会社東芝 Multilayer circuit board
JPH03225899A (en) * 1990-01-31 1991-10-04 Nippon Avionics Co Ltd Multi-layered printed wiring board
JP2006222330A (en) * 2005-02-14 2006-08-24 Nippon Mektron Ltd Multilayer flexible wiring circuit board and its manufacturing method

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6153792A (en) * 1984-08-23 1986-03-17 株式会社東芝 Multilayer circuit board
JPH03225899A (en) * 1990-01-31 1991-10-04 Nippon Avionics Co Ltd Multi-layered printed wiring board
JP2006222330A (en) * 2005-02-14 2006-08-24 Nippon Mektron Ltd Multilayer flexible wiring circuit board and its manufacturing method
JP4522282B2 (en) * 2005-02-14 2010-08-11 日本メクトロン株式会社 Manufacturing method of multilayer flexible circuit wiring board

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