JPS5533052A - Method of manufacturing multiilayer printed circuit board - Google Patents
Method of manufacturing multiilayer printed circuit boardInfo
- Publication number
- JPS5533052A JPS5533052A JP10521778A JP10521778A JPS5533052A JP S5533052 A JPS5533052 A JP S5533052A JP 10521778 A JP10521778 A JP 10521778A JP 10521778 A JP10521778 A JP 10521778A JP S5533052 A JPS5533052 A JP S5533052A
- Authority
- JP
- Japan
- Prior art keywords
- manufacturing
- circuit board
- printed circuit
- multiilayer
- multiilayer printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10521778A JPS5533052A (en) | 1978-08-29 | 1978-08-29 | Method of manufacturing multiilayer printed circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10521778A JPS5533052A (en) | 1978-08-29 | 1978-08-29 | Method of manufacturing multiilayer printed circuit board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5533052A true JPS5533052A (en) | 1980-03-08 |
Family
ID=14401494
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10521778A Pending JPS5533052A (en) | 1978-08-29 | 1978-08-29 | Method of manufacturing multiilayer printed circuit board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5533052A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6153792A (en) * | 1984-08-23 | 1986-03-17 | 株式会社東芝 | Multilayer circuit board |
JPH03225899A (en) * | 1990-01-31 | 1991-10-04 | Nippon Avionics Co Ltd | Multi-layered printed wiring board |
JP2006222330A (en) * | 2005-02-14 | 2006-08-24 | Nippon Mektron Ltd | Multilayer flexible wiring circuit board and its manufacturing method |
-
1978
- 1978-08-29 JP JP10521778A patent/JPS5533052A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6153792A (en) * | 1984-08-23 | 1986-03-17 | 株式会社東芝 | Multilayer circuit board |
JPH03225899A (en) * | 1990-01-31 | 1991-10-04 | Nippon Avionics Co Ltd | Multi-layered printed wiring board |
JP2006222330A (en) * | 2005-02-14 | 2006-08-24 | Nippon Mektron Ltd | Multilayer flexible wiring circuit board and its manufacturing method |
JP4522282B2 (en) * | 2005-02-14 | 2010-08-11 | 日本メクトロン株式会社 | Manufacturing method of multilayer flexible circuit wiring board |
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