JPS5438562A - Method of providing conduction between both surfaces of bilateral printed wiring board - Google Patents

Method of providing conduction between both surfaces of bilateral printed wiring board

Info

Publication number
JPS5438562A
JPS5438562A JP10570577A JP10570577A JPS5438562A JP S5438562 A JPS5438562 A JP S5438562A JP 10570577 A JP10570577 A JP 10570577A JP 10570577 A JP10570577 A JP 10570577A JP S5438562 A JPS5438562 A JP S5438562A
Authority
JP
Japan
Prior art keywords
wiring board
printed wiring
providing conduction
bilateral
bilateral printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10570577A
Other languages
Japanese (ja)
Inventor
Masao Hayakawa
Takamichi Maeda
Mitsuo Oda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP10570577A priority Critical patent/JPS5438562A/en
Publication of JPS5438562A publication Critical patent/JPS5438562A/en
Pending legal-status Critical Current

Links

Landscapes

  • Manufacturing Of Printed Wiring (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
JP10570577A 1977-09-01 1977-09-01 Method of providing conduction between both surfaces of bilateral printed wiring board Pending JPS5438562A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10570577A JPS5438562A (en) 1977-09-01 1977-09-01 Method of providing conduction between both surfaces of bilateral printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10570577A JPS5438562A (en) 1977-09-01 1977-09-01 Method of providing conduction between both surfaces of bilateral printed wiring board

Publications (1)

Publication Number Publication Date
JPS5438562A true JPS5438562A (en) 1979-03-23

Family

ID=14414762

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10570577A Pending JPS5438562A (en) 1977-09-01 1977-09-01 Method of providing conduction between both surfaces of bilateral printed wiring board

Country Status (1)

Country Link
JP (1) JPS5438562A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55141793A (en) * 1979-04-20 1980-11-05 Matsushita Electric Ind Co Ltd Method of mounting leadless component to bothhside printed circuit board
JPS57176797A (en) * 1981-04-23 1982-10-30 Shin Kobe Electric Machinery Method of producing printed circuit board
US5346750A (en) * 1992-05-06 1994-09-13 Matsushita Electric Industrial Co., Ltd. Porous substrate and conductive ink filled vias for printed circuits
JPH07170046A (en) * 1993-09-22 1995-07-04 Matsushita Electric Ind Co Ltd Printed-wiring board and manufacture thereof
US5440075A (en) * 1992-09-22 1995-08-08 Matsushita Electric Industrial Co., Ltd. Two-sided printed circuit board a multi-layered printed circuit board
US6096411A (en) * 1997-03-14 2000-08-01 Matsushita Electric Industrial Co., Ltd. Conductive paste composition for via hole filling and printed circuit board using the same

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5219263A (en) * 1975-08-06 1977-02-14 Hitachi Ltd Method of manufacturing multilayered printed circuit board

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5219263A (en) * 1975-08-06 1977-02-14 Hitachi Ltd Method of manufacturing multilayered printed circuit board

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55141793A (en) * 1979-04-20 1980-11-05 Matsushita Electric Ind Co Ltd Method of mounting leadless component to bothhside printed circuit board
JPS6337516B2 (en) * 1979-04-20 1988-07-26 Matsushita Electric Ind Co Ltd
JPS57176797A (en) * 1981-04-23 1982-10-30 Shin Kobe Electric Machinery Method of producing printed circuit board
US5346750A (en) * 1992-05-06 1994-09-13 Matsushita Electric Industrial Co., Ltd. Porous substrate and conductive ink filled vias for printed circuits
JPH06268345A (en) * 1992-05-06 1994-09-22 Matsushita Electric Ind Co Ltd Circuit forming board and production thereof
US5481795A (en) * 1992-05-06 1996-01-09 Matsushita Electric Industrial Co., Ltd. Method of manufacturing organic substrate used for printed circuits
US5440075A (en) * 1992-09-22 1995-08-08 Matsushita Electric Industrial Co., Ltd. Two-sided printed circuit board a multi-layered printed circuit board
JPH07170046A (en) * 1993-09-22 1995-07-04 Matsushita Electric Ind Co Ltd Printed-wiring board and manufacture thereof
US6096411A (en) * 1997-03-14 2000-08-01 Matsushita Electric Industrial Co., Ltd. Conductive paste composition for via hole filling and printed circuit board using the same

Similar Documents

Publication Publication Date Title
JPS5453264A (en) Bilateral printed board
JPS5438562A (en) Method of providing conduction between both surfaces of bilateral printed wiring board
JPS5437264A (en) Method of making print wiring board
JPS548872A (en) Print wiring board and method of making same
JPS5422579A (en) Method of making print wiring board
JPS5480559A (en) Method of producing printed wiring board
JPS5413969A (en) Method of manufacturing bilateral printed board
JPS5412461A (en) Method of making print wiring board
JPS547171A (en) Method of making print wiring board
JPS5443572A (en) Method of manufacturing multilayer printed board
JPS5596696A (en) Method of wiring printed board
JPS5426472A (en) Method of manufacturing multiilayer printed wiring board
JPS5416673A (en) Method of manufacturing multiilayer printed wiring board
JPS5454276A (en) Method of manufacturing printed wiring board
JPS5479472A (en) Lamination method of multiilayer printed board
JPS5434061A (en) Multiilayer printed wiring board and method of manufacturing same
JPS5423969A (en) Print wiring board and method of making same
JPS547170A (en) Method of making print wiring board
JPS5444764A (en) Method of manufacturing multilayer printed board
JPS5426471A (en) Method of manufacturing multiilayer printed wiring board
JPS5412457A (en) Multiilayer printed wiring board and method of manufacturing same
JPS541877A (en) Method of making print wiring board
JPS53127675A (en) Method of conducting bothhside conductive laminate board
JPS5443571A (en) Method of manufacturing multilayer printed board
JPS5444765A (en) Method of manufacturing multilayer printed board