JPS54148137A - Plating apparatus - Google Patents

Plating apparatus

Info

Publication number
JPS54148137A
JPS54148137A JP5668578A JP5668578A JPS54148137A JP S54148137 A JPS54148137 A JP S54148137A JP 5668578 A JP5668578 A JP 5668578A JP 5668578 A JP5668578 A JP 5668578A JP S54148137 A JPS54148137 A JP S54148137A
Authority
JP
Japan
Prior art keywords
solder
lead
jet stream
molten solder
guide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5668578A
Other languages
Japanese (ja)
Inventor
Yukio Yanagisawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP5668578A priority Critical patent/JPS54148137A/en
Publication of JPS54148137A publication Critical patent/JPS54148137A/en
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C23C2/32—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor using vibratory energy applied to the bath or substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Molten Solder (AREA)
  • Coating Apparatus (AREA)
  • Coating With Molten Metal (AREA)

Abstract

PURPOSE:To permit better plating without the use of flux of applying a supersonic vibration to a jet stream of plating liquor for activating the interface between an object to be plated and plating liquor. CONSTITUTION:The molten solder(plating liquor) 20 is jetted from the inside of the guide 19 by means of the impeller rotator 21, and a jet stream of the molten solder in the guide 19 is put through a supersonic vibration from the oscillator 23 of the supersonic wave oscillating mechanism 22 provided obliquely above the guide 19. The lead 33 of the diode 31 transported by the feeder 24 is instantaneously dipped into the jet stream of molten solder to coat the lead 33 portion with solder, where the surface of the solder jet stream always flows toward both sides and thus no convection of oxide takes place and no oxides on the lead 33 occur. And, the application of supersonic vibration activates the interface between the object and the molten solder 20, permitting the adhesion of solder to the lead 33 to a great extent without flux.
JP5668578A 1978-05-15 1978-05-15 Plating apparatus Pending JPS54148137A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5668578A JPS54148137A (en) 1978-05-15 1978-05-15 Plating apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5668578A JPS54148137A (en) 1978-05-15 1978-05-15 Plating apparatus

Publications (1)

Publication Number Publication Date
JPS54148137A true JPS54148137A (en) 1979-11-20

Family

ID=13034283

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5668578A Pending JPS54148137A (en) 1978-05-15 1978-05-15 Plating apparatus

Country Status (1)

Country Link
JP (1) JPS54148137A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100854350B1 (en) * 2002-06-14 2008-08-26 주식회사 케이아트텍 A ultra sonic dyeing machine for button
DE102013100473A1 (en) * 2013-01-17 2014-07-17 Seho Systemtechnik Gmbh Method and device for cleaning a soldering nozzle

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100854350B1 (en) * 2002-06-14 2008-08-26 주식회사 케이아트텍 A ultra sonic dyeing machine for button
DE102013100473A1 (en) * 2013-01-17 2014-07-17 Seho Systemtechnik Gmbh Method and device for cleaning a soldering nozzle
WO2014111213A2 (en) 2013-01-17 2014-07-24 Seho Systemtechnik Gmbh Method and device for cleaning a soldering nozzle

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