JPS55153670A - Flow type soldering method - Google Patents

Flow type soldering method

Info

Publication number
JPS55153670A
JPS55153670A JP6072479A JP6072479A JPS55153670A JP S55153670 A JPS55153670 A JP S55153670A JP 6072479 A JP6072479 A JP 6072479A JP 6072479 A JP6072479 A JP 6072479A JP S55153670 A JPS55153670 A JP S55153670A
Authority
JP
Japan
Prior art keywords
soldering
feed speed
printed
inside tank
soldered
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6072479A
Other languages
Japanese (ja)
Other versions
JPS5739077B2 (en
Inventor
Kohei Sunaba
Takashi Hamamoto
Shinichi Mizuno
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Original Assignee
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co Ltd filed Critical Sanyo Electric Co Ltd
Priority to JP6072479A priority Critical patent/JPS55153670A/en
Publication of JPS55153670A publication Critical patent/JPS55153670A/en
Publication of JPS5739077B2 publication Critical patent/JPS5739077B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE:To let the captioned soldering of high reliability in strength be accomplished by blowing molten solder onto the top surface to form the soldering part built up from the solder tank and horizontally moving a printed circuit at a high feed speed while letting the same contact the top surface thereof. CONSTITUTION:The molten solder 11 within an inside tank 2 is blow upward at all times toward the top edge 21 of the inside tank by a jet device 3 such as propeller provided in the lower part of the inside tank, whereby a soldering part 22 is formed. A printed substrate 4 is horizontally moved at a feed speed of 3-6m/min. while its printed surface 42 to be soldered is being contacted with said soldering part 22. Then, the lead wire 43 of the part 41 is soldered to the terminal part 44 on the printed surface 42. Within the above-mentioned feed speed range, the fillet height (h) is proportional to the feed speed and terminal part diameter (a) and therefore the required soldering strength, namely, the fillet height (h) may be accurately realized.
JP6072479A 1979-05-16 1979-05-16 Flow type soldering method Granted JPS55153670A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6072479A JPS55153670A (en) 1979-05-16 1979-05-16 Flow type soldering method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6072479A JPS55153670A (en) 1979-05-16 1979-05-16 Flow type soldering method

Publications (2)

Publication Number Publication Date
JPS55153670A true JPS55153670A (en) 1980-11-29
JPS5739077B2 JPS5739077B2 (en) 1982-08-19

Family

ID=13150503

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6072479A Granted JPS55153670A (en) 1979-05-16 1979-05-16 Flow type soldering method

Country Status (1)

Country Link
JP (1) JPS55153670A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11027362B2 (en) 2017-12-19 2021-06-08 Lincoln Global, Inc. Systems and methods providing location feedback for additive manufacturing

Also Published As

Publication number Publication date
JPS5739077B2 (en) 1982-08-19

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