JPS57121266A - Manufacture of hybrid integrated circuit - Google Patents

Manufacture of hybrid integrated circuit

Info

Publication number
JPS57121266A
JPS57121266A JP56006673A JP667381A JPS57121266A JP S57121266 A JPS57121266 A JP S57121266A JP 56006673 A JP56006673 A JP 56006673A JP 667381 A JP667381 A JP 667381A JP S57121266 A JPS57121266 A JP S57121266A
Authority
JP
Japan
Prior art keywords
lead
piece
soldered
integrated circuit
hybrid integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56006673A
Other languages
Japanese (ja)
Other versions
JPS6259461B2 (en
Inventor
Haruo Yamanaka
Kiyoshi Goto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP56006673A priority Critical patent/JPS57121266A/en
Publication of JPS57121266A publication Critical patent/JPS57121266A/en
Publication of JPS6259461B2 publication Critical patent/JPS6259461B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3405—Edge mounted components, e.g. terminals

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To improve the productivity of a hybrid integrated circuit by soldering in advance a metallic piece when mounting a lead, welding a lead to the piece, therby temoving the lead, and enabling an automatic mounting of all the parts including the piece. CONSTITUTION:A circuit board is formed by thick film paste printing on one main surface of a ceramic substrate 31, solder paste is printed on the part mounted with electronic parts, and semiconductor elements 32 such as an IC, transistors, and a capacitor 33 are then soldered. A metallic piece 35 made of Ni is soldered to an electrode 34. Subsequently, it is achieved through a cleaning step, a function trimming characteristic checking step, and a lead 37 or a lead frame 38 having a head 36 is automatically welded, for example, by a welding machine to the piece 35. This lead 37 and the lead frame 38 are made of copper wires to be soldered.
JP56006673A 1981-01-20 1981-01-20 Manufacture of hybrid integrated circuit Granted JPS57121266A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56006673A JPS57121266A (en) 1981-01-20 1981-01-20 Manufacture of hybrid integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56006673A JPS57121266A (en) 1981-01-20 1981-01-20 Manufacture of hybrid integrated circuit

Publications (2)

Publication Number Publication Date
JPS57121266A true JPS57121266A (en) 1982-07-28
JPS6259461B2 JPS6259461B2 (en) 1987-12-11

Family

ID=11644883

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56006673A Granted JPS57121266A (en) 1981-01-20 1981-01-20 Manufacture of hybrid integrated circuit

Country Status (1)

Country Link
JP (1) JPS57121266A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59114849A (en) * 1982-12-22 1984-07-03 Toshiba Corp Manufacture of hybrid integrated circuit
JPS63115234U (en) * 1987-01-21 1988-07-25

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59114849A (en) * 1982-12-22 1984-07-03 Toshiba Corp Manufacture of hybrid integrated circuit
JPH0550141B2 (en) * 1982-12-22 1993-07-28 Tokyo Shibaura Electric Co
JPS63115234U (en) * 1987-01-21 1988-07-25

Also Published As

Publication number Publication date
JPS6259461B2 (en) 1987-12-11

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