JPS5530360A - Jet type solder bath - Google Patents
Jet type solder bathInfo
- Publication number
- JPS5530360A JPS5530360A JP10355078A JP10355078A JPS5530360A JP S5530360 A JPS5530360 A JP S5530360A JP 10355078 A JP10355078 A JP 10355078A JP 10355078 A JP10355078 A JP 10355078A JP S5530360 A JPS5530360 A JP S5530360A
- Authority
- JP
- Japan
- Prior art keywords
- vessel
- solder
- soldering
- pool
- molten solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0646—Solder baths
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Molten Solder (AREA)
Abstract
PURPOSE:To let soldering of good quality to be performed without formation of oxide films and decrease in solder liquid level by an independently providing a soldering vessel within a pool vessel of molten solder and providing a jet device which supplies molten solder in the pool vessel to the opening part at the top end thereof. CONSTITUTION:A soldering vessel 4 which has a top end opening 4a above the liquid level 2a of the molten solder in a pool vessel 1 and a jet device 7 which supplies the molten solder 2 in the pool vessel to the soldering vessel 4 through the top opening 4a are provided in the pool vessel 1 of molten solder. Thereby, the solder 2 supplied to the soldering vessel 4 from the jet device 7 overflows and returns into the pool vessel 1 and is circulated like the arrow a. As a result, the level 2b of the solder 2 in the vessel 4 is always overfloating and since the contact with air is short, no oxide films are formed and the solder remains always fresh.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10355078A JPS5530360A (en) | 1978-08-24 | 1978-08-24 | Jet type solder bath |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10355078A JPS5530360A (en) | 1978-08-24 | 1978-08-24 | Jet type solder bath |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5530360A true JPS5530360A (en) | 1980-03-04 |
Family
ID=14356923
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10355078A Pending JPS5530360A (en) | 1978-08-24 | 1978-08-24 | Jet type solder bath |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5530360A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63157494A (en) * | 1986-12-22 | 1988-06-30 | ムネカタ株式会社 | Soldering apparatus |
JPH01113169A (en) * | 1987-10-23 | 1989-05-01 | Tokin Corp | Method for soldering pin terminal of electronic part |
-
1978
- 1978-08-24 JP JP10355078A patent/JPS5530360A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63157494A (en) * | 1986-12-22 | 1988-06-30 | ムネカタ株式会社 | Soldering apparatus |
JPH01113169A (en) * | 1987-10-23 | 1989-05-01 | Tokin Corp | Method for soldering pin terminal of electronic part |
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