JPS554919A - Method of form solder film on perforrated base material - Google Patents

Method of form solder film on perforrated base material

Info

Publication number
JPS554919A
JPS554919A JP7647478A JP7647478A JPS554919A JP S554919 A JPS554919 A JP S554919A JP 7647478 A JP7647478 A JP 7647478A JP 7647478 A JP7647478 A JP 7647478A JP S554919 A JPS554919 A JP S554919A
Authority
JP
Japan
Prior art keywords
slit
base material
hole
solder
solder film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7647478A
Other languages
Japanese (ja)
Other versions
JPS6227546B2 (en
Inventor
Masao Sekihashi
Masakatsu Ishida
Kanji Otsuka
Isao Sugitani
Tamotsu Usami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP7647478A priority Critical patent/JPS554919A/en
Publication of JPS554919A publication Critical patent/JPS554919A/en
Publication of JPS6227546B2 publication Critical patent/JPS6227546B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE: To prevent solder from forming film inside a hole by providing a perforated base material, prior to being dipped in a soldering tank, with a slit so that it becomes an open structure.
CONSTITUTION: A hole 2 is provided with a slit 3 so that it becomes an open structure. A width D of the slit 3 may well be 0.5 mm or more. As a lead frame 1 having been cleaned is dipped into a soldering tank and pulled out, solder film is not formed inside the hole due to unblanced concentration of surface tension of solder owing to the slit, and the solder film is formed on other part than the inside of the hole.
COPYRIGHT: (C)1980,JPO&Japio
JP7647478A 1978-06-26 1978-06-26 Method of form solder film on perforrated base material Granted JPS554919A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7647478A JPS554919A (en) 1978-06-26 1978-06-26 Method of form solder film on perforrated base material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7647478A JPS554919A (en) 1978-06-26 1978-06-26 Method of form solder film on perforrated base material

Publications (2)

Publication Number Publication Date
JPS554919A true JPS554919A (en) 1980-01-14
JPS6227546B2 JPS6227546B2 (en) 1987-06-15

Family

ID=13606169

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7647478A Granted JPS554919A (en) 1978-06-26 1978-06-26 Method of form solder film on perforrated base material

Country Status (1)

Country Link
JP (1) JPS554919A (en)

Also Published As

Publication number Publication date
JPS6227546B2 (en) 1987-06-15

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