JPS566778A - Soldering device - Google Patents

Soldering device

Info

Publication number
JPS566778A
JPS566778A JP8019279A JP8019279A JPS566778A JP S566778 A JPS566778 A JP S566778A JP 8019279 A JP8019279 A JP 8019279A JP 8019279 A JP8019279 A JP 8019279A JP S566778 A JPS566778 A JP S566778A
Authority
JP
Japan
Prior art keywords
soldering
substrate
solder
along
becomes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8019279A
Other languages
Japanese (ja)
Inventor
Tsutomu Yoshiya
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP8019279A priority Critical patent/JPS566778A/en
Publication of JPS566778A publication Critical patent/JPS566778A/en
Pending legal-status Critical Current

Links

Landscapes

  • Molten Solder (AREA)

Abstract

PURPOSE: To prevent substrate cracking from occuring and considerably decrease wetting defects by moving the substrates along the soldering surface of a soldering cell provided with a flow dip type soldering region and a jet flow type soldering region by a conveying means thereby soldering the substrates.
CONSTITUTION: A substrate 7 made of ceramics or glass which is conveyed by a conveyor 4 is approached to a soldering surface in such a manner that the angle between the surface of molten solder 2 and the substrate 7 becomes gradually gentle in the front part of a soldering cell 1, and that when said angle becomes, for example, about ≤5° the substrate 7 is contacted with the solder 2. After this, the substrate 7 is conveyed by the conveyor 4 along the soldering surface and is pulled up along the flowing surface of the jet solder from just before a jet nozzle 10. If arrangement is so made that the pulling-up angle becomes about 8°W10° when the solder of an eutectic composition is used, the wettability of the solder becomes good. With this method, the soldering may be done without preheating the substrate 7.
COPYRIGHT: (C)1981,JPO&Japio
JP8019279A 1979-06-27 1979-06-27 Soldering device Pending JPS566778A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8019279A JPS566778A (en) 1979-06-27 1979-06-27 Soldering device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8019279A JPS566778A (en) 1979-06-27 1979-06-27 Soldering device

Publications (1)

Publication Number Publication Date
JPS566778A true JPS566778A (en) 1981-01-23

Family

ID=13711509

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8019279A Pending JPS566778A (en) 1979-06-27 1979-06-27 Soldering device

Country Status (1)

Country Link
JP (1) JPS566778A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6148363A (en) * 1984-08-15 1986-03-10 林原　健 Pulsated electromagnetic force vibrator
JPS6381677U (en) * 1986-11-17 1988-05-30

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6148363A (en) * 1984-08-15 1986-03-10 林原　健 Pulsated electromagnetic force vibrator
JPH0250745B2 (en) * 1984-08-15 1990-11-05 Hayashibara Takeshi
JPS6381677U (en) * 1986-11-17 1988-05-30

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