JPS54149332A - Plating apparatus - Google Patents

Plating apparatus

Info

Publication number
JPS54149332A
JPS54149332A JP5762978A JP5762978A JPS54149332A JP S54149332 A JPS54149332 A JP S54149332A JP 5762978 A JP5762978 A JP 5762978A JP 5762978 A JP5762978 A JP 5762978A JP S54149332 A JPS54149332 A JP S54149332A
Authority
JP
Japan
Prior art keywords
molten solder
solder
spouting
cover
hot dipping
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5762978A
Other languages
Japanese (ja)
Inventor
Yukio Yanagisawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP5762978A priority Critical patent/JPS54149332A/en
Publication of JPS54149332A publication Critical patent/JPS54149332A/en
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C23C2/32—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor using vibratory energy applied to the bath or substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Coating With Molten Metal (AREA)
  • Molten Solder (AREA)
  • Coating Apparatus (AREA)

Abstract

PURPOSE:To enable solder hot dipping of high quality to be performed without using a flux in a hot dipping apparatus by applying ultrasonic vibration to spouting molten solder and by covering the molten solder surface with an inert gas. CONSTITUTION:Diode 51 is attracted by magnetism to each storage channel 30 of holding block 27 fixed to chain 25, and lead 50 is continuously dipped in molten solder spouting through inlet 52 of cover 47 to coat the lead part with molten solder. At this time, nitrogen gas is always supplied into cover 47 through inert gas supply pipe 54 to cover the molten solder surface with the gas. Molten solder rises from the lower part of guide 44 and overflows from the upper edge of guide 44. Accordingly, there is no oxide on the surface of the spouting molten solder and in the interior thereof, so bright solder hot dipping of high quality is performed.
JP5762978A 1978-05-17 1978-05-17 Plating apparatus Pending JPS54149332A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5762978A JPS54149332A (en) 1978-05-17 1978-05-17 Plating apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5762978A JPS54149332A (en) 1978-05-17 1978-05-17 Plating apparatus

Publications (1)

Publication Number Publication Date
JPS54149332A true JPS54149332A (en) 1979-11-22

Family

ID=13061172

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5762978A Pending JPS54149332A (en) 1978-05-17 1978-05-17 Plating apparatus

Country Status (1)

Country Link
JP (1) JPS54149332A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61286058A (en) * 1985-06-11 1986-12-16 Meisho Kk Jet type solder tank
JP2001319999A (en) * 2000-05-12 2001-11-16 Tokyo Daiichi Shoko:Kk Manufacturing method of radiator
CN111761157A (en) * 2020-07-09 2020-10-13 湖南鑫铮科技有限公司 Automatic feed mechanism of wicking machine

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61286058A (en) * 1985-06-11 1986-12-16 Meisho Kk Jet type solder tank
JP2001319999A (en) * 2000-05-12 2001-11-16 Tokyo Daiichi Shoko:Kk Manufacturing method of radiator
CN111761157A (en) * 2020-07-09 2020-10-13 湖南鑫铮科技有限公司 Automatic feed mechanism of wicking machine

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