JPS5747579A - Solder dipping method - Google Patents
Solder dipping methodInfo
- Publication number
- JPS5747579A JPS5747579A JP12205180A JP12205180A JPS5747579A JP S5747579 A JPS5747579 A JP S5747579A JP 12205180 A JP12205180 A JP 12205180A JP 12205180 A JP12205180 A JP 12205180A JP S5747579 A JPS5747579 A JP S5747579A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- parts
- flux
- reducing gas
- high temp
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE: To realize uniform solder dipping without immersion into soldering vessels by supplying flux and solder then ejecting a high temp. reducing gas thereby melting the solder.
CONSTITUTION: While transistor lead soldering parts 2 are preheated in the atmosphere of the high temp. reducing gas 12 ejected from gas diffusion ports 11, presolder 9 and flux 10 are dropped at suitable rates respectively from a solder vessel 7 and a flux vessel 8 and are allowed to stick on the centers of the parts 2. Next, the high temp. reducing gas 12 of a temp. slightly higher than that at the preheating is ijected from the circumference of the parts 2 to spread the presolder 9 over the entire part of the parts 2, wherby so-called solder dipping is carried out. Thereby, the surface ruggedness by solder waste, solder drips, etc. is eliminated, and the neat solder dipping is made possible.
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12205180A JPS5747579A (en) | 1980-09-02 | 1980-09-02 | Solder dipping method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12205180A JPS5747579A (en) | 1980-09-02 | 1980-09-02 | Solder dipping method |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5747579A true JPS5747579A (en) | 1982-03-18 |
Family
ID=14826389
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12205180A Pending JPS5747579A (en) | 1980-09-02 | 1980-09-02 | Solder dipping method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5747579A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5994568A (en) * | 1982-11-19 | 1984-05-31 | エツセジ−エツセ−アテイイ−エツセ・コンポネンテイ・エレツトロニ−チ・ソチエタ・ペル・アノニマ | Method of welding and fitting semiconductor chip onto non-precious metal substrate |
-
1980
- 1980-09-02 JP JP12205180A patent/JPS5747579A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5994568A (en) * | 1982-11-19 | 1984-05-31 | エツセジ−エツセ−アテイイ−エツセ・コンポネンテイ・エレツトロニ−チ・ソチエタ・ペル・アノニマ | Method of welding and fitting semiconductor chip onto non-precious metal substrate |
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