JPS5585663A - Manufacturing apparatus for hot dipped wire of uniform section - Google Patents
Manufacturing apparatus for hot dipped wire of uniform sectionInfo
- Publication number
- JPS5585663A JPS5585663A JP14871978A JP14871978A JPS5585663A JP S5585663 A JPS5585663 A JP S5585663A JP 14871978 A JP14871978 A JP 14871978A JP 14871978 A JP14871978 A JP 14871978A JP S5585663 A JPS5585663 A JP S5585663A
- Authority
- JP
- Japan
- Prior art keywords
- rod
- uniform
- dies
- hot dipped
- uniform section
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/34—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor characterised by the shape of the material to be treated
- C23C2/36—Elongated material
- C23C2/38—Wires; Tubes
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Coating With Molten Metal (AREA)
Abstract
PURPOSE:To form a uniform hot dipped layer of a uniform section round a wire rod with an apparatus composed of drawing dies, centering dies for setting the rod at the center of the hole of the drawing dies, and a forced cooler. CONSTITUTION:Wire rod 17 is pretreated in flux vessel 14, shifted to molten metal vessel 16, and set at the center of the through hole of drawing dies 11 and forced cooler 13 with centering dies 12. Molten metal 19 is introduced from inlet 20 to hot dip the outside of rod 17, and by drawing at drawing section 18a of dies 11 a uniform hot dipped layer of a uniform section is formed round rod 17. Rod 17 is then passed through hole 22 of cooler 13 to cool the layer. Thus, continuously hot dipped layer 24 of a uniform section and a uniform thickness is formed round rod 17, resulting in hot dipped wire 17' of the uniform section.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14871978A JPS5585663A (en) | 1978-12-01 | 1978-12-01 | Manufacturing apparatus for hot dipped wire of uniform section |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14871978A JPS5585663A (en) | 1978-12-01 | 1978-12-01 | Manufacturing apparatus for hot dipped wire of uniform section |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5585663A true JPS5585663A (en) | 1980-06-27 |
Family
ID=15459061
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14871978A Pending JPS5585663A (en) | 1978-12-01 | 1978-12-01 | Manufacturing apparatus for hot dipped wire of uniform section |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5585663A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61127855A (en) * | 1984-11-27 | 1986-06-16 | Hitachi Cable Ltd | Hot dip plating method and multistage die for this method |
-
1978
- 1978-12-01 JP JP14871978A patent/JPS5585663A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61127855A (en) * | 1984-11-27 | 1986-06-16 | Hitachi Cable Ltd | Hot dip plating method and multistage die for this method |
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