JPS5573862A - Hot dipping method for wire rod - Google Patents
Hot dipping method for wire rodInfo
- Publication number
- JPS5573862A JPS5573862A JP14516778A JP14516778A JPS5573862A JP S5573862 A JPS5573862 A JP S5573862A JP 14516778 A JP14516778 A JP 14516778A JP 14516778 A JP14516778 A JP 14516778A JP S5573862 A JPS5573862 A JP S5573862A
- Authority
- JP
- Japan
- Prior art keywords
- wire rod
- molten metal
- metal
- thickness
- wires
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/14—Removing excess of molten coatings; Controlling or regulating the coating thickness
- C23C2/22—Removing excess of molten coatings; Controlling or regulating the coating thickness by rubbing, e.g. using knives, e.g. rubbing solids
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Coating With Molten Metal (AREA)
Abstract
PURPOSE:To control the thickness of plated layer at demand, by arranging plural tubular dies, to which are attached very fine wires at equal intervals, in the section between a molten metal bath surface and the solidification initating point, and by bringing the passing metal wire rod into contact with the metal wires. CONSTITUTION:In the cooling and solidifying section 4 between the bath surface and the solidification-initiating point are arranged plural tubular dies 5 each having a hole of a diameter larger than the cross-section of the plated wire rod 7 at the center of the body 6, and to the inlet of the hole are attached at equal intervals very fine metal wires 8. The quantity of molten metal adhered to the wire rod 2 to be plated, which is running out of the plating bath, is controlled by a drawing die 3. While the wire rod 2 passes through tubular dies 5, the deviation of the adhered molten metal thickness is regulated because of the wetting property between the very fine wires 8 and the molten metal, keeping the thickness of the plated layer constant until the time just before the molten metal begins to solidify.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14516778A JPS5573862A (en) | 1978-11-24 | 1978-11-24 | Hot dipping method for wire rod |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14516778A JPS5573862A (en) | 1978-11-24 | 1978-11-24 | Hot dipping method for wire rod |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5573862A true JPS5573862A (en) | 1980-06-03 |
Family
ID=15378970
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14516778A Pending JPS5573862A (en) | 1978-11-24 | 1978-11-24 | Hot dipping method for wire rod |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5573862A (en) |
-
1978
- 1978-11-24 JP JP14516778A patent/JPS5573862A/en active Pending
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