IT1069952B - PROCEDURE FOR FORMING A BRAZED DO ELECTRO AND RELATED PRODUCT - Google Patents

PROCEDURE FOR FORMING A BRAZED DO ELECTRO AND RELATED PRODUCT

Info

Publication number
IT1069952B
IT1069952B IT52625/76A IT5262576A IT1069952B IT 1069952 B IT1069952 B IT 1069952B IT 52625/76 A IT52625/76 A IT 52625/76A IT 5262576 A IT5262576 A IT 5262576A IT 1069952 B IT1069952 B IT 1069952B
Authority
IT
Italy
Prior art keywords
brazing alloy
terminating
members
formed substantially
member formed
Prior art date
Application number
IT52625/76A
Other languages
Italian (it)
Original Assignee
Gen Instrument Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US05/642,588 external-priority patent/US4017266A/en
Application filed by Gen Instrument Corp filed Critical Gen Instrument Corp
Application granted granted Critical
Publication of IT1069952B publication Critical patent/IT1069952B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157—Partial encapsulation or coating
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    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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    • H01L2924/01082—Lead [Pb]
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    • H01L2924/1306—Field-effect transistor [FET]
    • H01L2924/13062—Junction field-effect transistor [JFET]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Ceramic Products (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacture Of Switches (AREA)
  • Fuses (AREA)

Abstract

This relates to a process for making a brazed lead electrode workpiece, and such workpiece. The process for attaching a lead member to a contact member comprises initially providing a lead member formed substantially of a thermally and electrically conductive metal and terminating at one end in a joining surface, and an axially extending contact member formed substantially of a refractory metal and terminating in a joining surface of such refractory metal. The joining surfaces of the members are placed in contact with a silver/copper-based brazing alloy having a wetting point of at least 450 C. The brazing alloy is then heated (preferably in an inert atmosphere at atmospheric pressure) at least to its wetting point for a period of time sufficient to melt the brazing alloy. Thereafter the molten brazing alloy is allowed to cool and solidify in contact with the joining surfaces of the members, thereby to join the contact member and the lead member into a unitary structure. The workpiece comprises an axially extending contact member formed substantially of a refractory metal and terminating at one end in a joining surface, a lead member formed substantially of a thermally and electrically conductive metal and terminating at one end in a joining surface, and a brazing alloy disposed between and securing together the joining surfaces of the members, thereby to join the members into a unitary structure.
IT52625/76A 1975-12-19 1976-12-15 PROCEDURE FOR FORMING A BRAZED DO ELECTRO AND RELATED PRODUCT IT1069952B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/642,588 US4017266A (en) 1974-04-24 1975-12-19 Process for making a brazed lead electrode, and product thereof

Publications (1)

Publication Number Publication Date
IT1069952B true IT1069952B (en) 1985-03-25

Family

ID=24577211

Family Applications (1)

Application Number Title Priority Date Filing Date
IT52625/76A IT1069952B (en) 1975-12-19 1976-12-15 PROCEDURE FOR FORMING A BRAZED DO ELECTRO AND RELATED PRODUCT

Country Status (6)

Country Link
AU (1) AU505174B2 (en)
CA (1) CA1057421A (en)
DE (1) DE2619869A1 (en)
FR (1) FR2335954A2 (en)
IT (1) IT1069952B (en)
MX (1) MX3349E (en)

Also Published As

Publication number Publication date
CA1057421A (en) 1979-06-26
AU505174B2 (en) 1979-11-08
DE2619869A1 (en) 1977-06-30
FR2335954A2 (en) 1977-07-15
AU1377576A (en) 1977-11-17
MX3349E (en) 1980-10-06

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