MX3349E - IMPROVEMENTS IN PROCESS FOR THE ELABORATION OF A WELDED LEAD ELECTRODE AND RESULTING PRODUCT - Google Patents

IMPROVEMENTS IN PROCESS FOR THE ELABORATION OF A WELDED LEAD ELECTRODE AND RESULTING PRODUCT

Info

Publication number
MX3349E
MX3349E MX100346U MX10034676U MX3349E MX 3349 E MX3349 E MX 3349E MX 100346 U MX100346 U MX 100346U MX 10034676 U MX10034676 U MX 10034676U MX 3349 E MX3349 E MX 3349E
Authority
MX
Mexico
Prior art keywords
elaboration
alloy
bonding surface
lead electrode
contact
Prior art date
Application number
MX100346U
Other languages
Spanish (es)
Inventor
Monroe B Goldberg
William B Voorhis
Original Assignee
Gen Instrument Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US05/642,588 external-priority patent/US4017266A/en
Application filed by Gen Instrument Corp filed Critical Gen Instrument Corp
Publication of MX3349E publication Critical patent/MX3349E/en

Links

Classifications

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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
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    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157—Partial encapsulation or coating
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    • H01L2924/13062—Junction field-effect transistor [JFET]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Fuses (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Ceramic Products (AREA)
  • Manufacture Of Switches (AREA)

Abstract

La presente invención se refiere a mejoras en proceso para la elaboración de un electrodo de plomo soldado, caracterizadas las majoras porque consta de los siguientes pasos: proporcionar un miembro de plomo formado virtualmente por un material conductor térmica y eléctricamente y que termina en uno de sua extremos en una superficie de unión y por un miembro de contacto que se extiende axialmente, formado virtualmente de un metal refractario y que termina en una superficie de unión de dicho metal refractario; colocar dichas superficies de unión en los miembros de contacto con una aleación soldada a base de plata y cobre que tiene un punto de fundición de por lo menos 450°C; calentar la aleación soldada por lo menos hasta su punto de fundición durante un período de tiempo suficiente como para fundir la aleación soldada; y permitir que se enfríe y solidifique la aleación soldada fundida en contacto con la superficie de unión de los miembros mencionados, para unir así el miembro de contacto y el miembro de plomo en una estructura unitaria.The present invention refers to improvements in the process for the elaboration of a soldered lead electrode, characterized by improvements because it consists of the following steps: providing a lead member formed virtually by a thermally and electrically conductive material and ending in one of its own ends on a bonding surface and by an axially extending contact member formed virtually of a refractory metal and terminating on a bonding surface of said refractory metal; Placing said bonding surfaces on the contact members with a silver and copper based brazed alloy having a melting point of at least 450 ° C; heat the brazed alloy at least to its melting point for a period of time sufficient to melt the brazed alloy; and allowing the molten soldered alloy to cool and solidify in contact with the bonding surface of the aforementioned members, thereby joining the contact member and the lead member in a unitary structure.

MX100346U 1975-12-19 1976-06-04 IMPROVEMENTS IN PROCESS FOR THE ELABORATION OF A WELDED LEAD ELECTRODE AND RESULTING PRODUCT MX3349E (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/642,588 US4017266A (en) 1974-04-24 1975-12-19 Process for making a brazed lead electrode, and product thereof

Publications (1)

Publication Number Publication Date
MX3349E true MX3349E (en) 1980-10-06

Family

ID=24577211

Family Applications (1)

Application Number Title Priority Date Filing Date
MX100346U MX3349E (en) 1975-12-19 1976-06-04 IMPROVEMENTS IN PROCESS FOR THE ELABORATION OF A WELDED LEAD ELECTRODE AND RESULTING PRODUCT

Country Status (6)

Country Link
AU (1) AU505174B2 (en)
CA (1) CA1057421A (en)
DE (1) DE2619869A1 (en)
FR (1) FR2335954A2 (en)
IT (1) IT1069952B (en)
MX (1) MX3349E (en)

Also Published As

Publication number Publication date
AU1377576A (en) 1977-11-17
AU505174B2 (en) 1979-11-08
DE2619869A1 (en) 1977-06-30
CA1057421A (en) 1979-06-26
FR2335954A2 (en) 1977-07-15
IT1069952B (en) 1985-03-25

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