JPS5472740A - Connecting method for metallic body - Google Patents
Connecting method for metallic bodyInfo
- Publication number
- JPS5472740A JPS5472740A JP13992877A JP13992877A JPS5472740A JP S5472740 A JPS5472740 A JP S5472740A JP 13992877 A JP13992877 A JP 13992877A JP 13992877 A JP13992877 A JP 13992877A JP S5472740 A JPS5472740 A JP S5472740A
- Authority
- JP
- Japan
- Prior art keywords
- soldering
- soldering material
- sides
- joining
- metallic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces
Abstract
PURPOSE:To connect hermetically the electroconductive body or water piping etc. with a high reliability, by driving metal plate covered soldering material between joining tip part of metal body and metal combined body, letting adhered the above soldering material by melting it. CONSTITUTION:The conductors 1, 2 are inserted in the middle combining body 3 and the preset solder is placed on the neighboring sides of the gap between them. The metallic body to be soldered 17 covered the soldering material 19 in a body on both sides of the metal plate 18, is driven in the gaps of the other two sides. Preset solder and the soldering material 19 of the metallic the body 17, are melted by heating joining part of the above structure from outside and the body 3 and the conductor 1, 2 are joined and are let adhered. By the above method, and adequate soldering gap is always obtained and highly reliable soldering joining structure having a high solder adhesion rate and no leakage of water, is able to obtain.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13992877A JPS5472740A (en) | 1977-11-24 | 1977-11-24 | Connecting method for metallic body |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13992877A JPS5472740A (en) | 1977-11-24 | 1977-11-24 | Connecting method for metallic body |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5472740A true JPS5472740A (en) | 1979-06-11 |
JPS6114912B2 JPS6114912B2 (en) | 1986-04-21 |
Family
ID=15256919
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13992877A Granted JPS5472740A (en) | 1977-11-24 | 1977-11-24 | Connecting method for metallic body |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5472740A (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63163706U (en) * | 1987-04-15 | 1988-10-25 | ||
JPS63179908U (en) * | 1987-05-12 | 1988-11-21 |
-
1977
- 1977-11-24 JP JP13992877A patent/JPS5472740A/en active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS6114912B2 (en) | 1986-04-21 |
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