JPS562660A - Manufacture of airtight bonding substance - Google Patents

Manufacture of airtight bonding substance

Info

Publication number
JPS562660A
JPS562660A JP7854379A JP7854379A JPS562660A JP S562660 A JPS562660 A JP S562660A JP 7854379 A JP7854379 A JP 7854379A JP 7854379 A JP7854379 A JP 7854379A JP S562660 A JPS562660 A JP S562660A
Authority
JP
Japan
Prior art keywords
eyelet
glass
soldering
flange
nonelectrolytic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7854379A
Other languages
Japanese (ja)
Other versions
JPS606542B2 (en
Inventor
Koichi Komoda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Home Electronics Ltd
NEC Corp
Original Assignee
NEC Home Electronics Ltd
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Home Electronics Ltd, Nippon Electric Co Ltd filed Critical NEC Home Electronics Ltd
Priority to JP54078543A priority Critical patent/JPS606542B2/en
Publication of JPS562660A publication Critical patent/JPS562660A/en
Publication of JPS606542B2 publication Critical patent/JPS606542B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/045—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads having an insulating passage through the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Joining Of Glass To Other Materials (AREA)
  • Chemically Coating (AREA)

Abstract

PURPOSE:To improve adhesive strength and shock resisting property by using an eyelet having a noneleltrolytic Ni plated layer on the surface, hermetically adhering glass on the inside of the eyelet and soldering a metallic material on the outside. CONSTITUTION:A nonelectrolytic Ni plating is given to an iron flange 11 and an eyelet 16, a heat radiation plate 14 is inserted to a flange hole 13, the eyelet 16 is inserted to the hole 15 of a copper radiation plate and a calking is performed for them. Then a glass tablet is inserted to the eyelet, a lead 18 is passed through the eyelet, the lead is bonded with melted glass to the eyelet by heating and the flange and the eyelet are bonded with Ni soldering flux with an intermediate of the nonelectrolytic Ni plated layer. The melted soldering flux is condensed by the stepped section 51 provided on the inside surface of the eyelet and helps to give an efficient soldering. Under this constitution, the adhesive property of the eyelet and the glass is increased and the adhesive strength as well as the shock resisting property can be improved at the same time.
JP54078543A 1979-06-21 1979-06-21 Manufacturing method of hermetically sealed body Expired JPS606542B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP54078543A JPS606542B2 (en) 1979-06-21 1979-06-21 Manufacturing method of hermetically sealed body

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP54078543A JPS606542B2 (en) 1979-06-21 1979-06-21 Manufacturing method of hermetically sealed body

Publications (2)

Publication Number Publication Date
JPS562660A true JPS562660A (en) 1981-01-12
JPS606542B2 JPS606542B2 (en) 1985-02-19

Family

ID=13664821

Family Applications (1)

Application Number Title Priority Date Filing Date
JP54078543A Expired JPS606542B2 (en) 1979-06-21 1979-06-21 Manufacturing method of hermetically sealed body

Country Status (1)

Country Link
JP (1) JPS606542B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59117156U (en) * 1983-01-26 1984-08-07 サンケン電気株式会社 Insulator-encapsulated semiconductor device
CN108129037A (en) * 2017-12-25 2018-06-08 西安赛尔电子材料科技有限公司 A kind of molybdenum-glass capsulation insulator method for sealing

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS614653U (en) * 1984-06-16 1986-01-11 弘憲 松吉 bathtub

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59117156U (en) * 1983-01-26 1984-08-07 サンケン電気株式会社 Insulator-encapsulated semiconductor device
JPS6320121Y2 (en) * 1983-01-26 1988-06-03
CN108129037A (en) * 2017-12-25 2018-06-08 西安赛尔电子材料科技有限公司 A kind of molybdenum-glass capsulation insulator method for sealing
CN108129037B (en) * 2017-12-25 2021-05-07 西安赛尔电子材料科技有限公司 Molybdenum-glass sealing insulator sealing method

Also Published As

Publication number Publication date
JPS606542B2 (en) 1985-02-19

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