JPS5598846A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5598846A
JPS5598846A JP478179A JP478179A JPS5598846A JP S5598846 A JPS5598846 A JP S5598846A JP 478179 A JP478179 A JP 478179A JP 478179 A JP478179 A JP 478179A JP S5598846 A JPS5598846 A JP S5598846A
Authority
JP
Japan
Prior art keywords
metallic
container
semiconductor device
plate
thin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP478179A
Other languages
Japanese (ja)
Other versions
JPS5718344B2 (en
Inventor
Yoshihiko Mizushima
Akio Tamama
Masahiro Sakagami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Telegraph and Telephone Corp
Original Assignee
Nippon Telegraph and Telephone Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Telegraph and Telephone Corp filed Critical Nippon Telegraph and Telephone Corp
Priority to JP478179A priority Critical patent/JPS5598846A/en
Publication of JPS5598846A publication Critical patent/JPS5598846A/en
Publication of JPS5718344B2 publication Critical patent/JPS5718344B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Abstract

PURPOSE: To prevent occurrence of a defect in the function of a semiconductor IC or the like by interposing a radiation shield made of a metallic thin film or a thin film between a container made of plastic, ceramic or the like for containing a semiconductor device and the semiconductor device.
CONSTITUTION: A thin metallic plate 7 is adhered with an adhesive on the inner portion except for the peripheral portion mounting a lead frame 5 of the inner surface of a container 2 of nonmetallic material such as plastic, ceramic or the like for containing a semiconductor device 4. A metallic plate 8 is also adhered on the inner portion except for the peripheral portion making contact with the container 2 of the inner surface of the container cover 3. At this time the metallic plates 7 and 8 select heavy metal having large atomic number from aluminum, nickel, pure iron, copper, brass, etc., and has 20W50μm of thickness. Then, the device 4 is brazed onto the plate 7, and lead frames 5 with bonding wires 6 are fixed to the plate 7. The device 4 is then coated with a cover 3, and sealed airtightly. A thin metallic film such as plating may also be used instead of the metallic plates 7, 8.
COPYRIGHT: (C)1980,JPO&Japio
JP478179A 1979-01-22 1979-01-22 Semiconductor device Granted JPS5598846A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP478179A JPS5598846A (en) 1979-01-22 1979-01-22 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP478179A JPS5598846A (en) 1979-01-22 1979-01-22 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS5598846A true JPS5598846A (en) 1980-07-28
JPS5718344B2 JPS5718344B2 (en) 1982-04-16

Family

ID=11593350

Family Applications (1)

Application Number Title Priority Date Filing Date
JP478179A Granted JPS5598846A (en) 1979-01-22 1979-01-22 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5598846A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5928362A (en) * 1982-07-22 1984-02-15 インタ−ナシヨナル　ビジネス　マシ−ンズ　コ−ポレ−シヨン Ceramic structure
US4519050A (en) * 1982-06-17 1985-05-21 Intel Corporation Radiation shield for an integrated circuit memory with redundant elements
US6455864B1 (en) 1994-04-01 2002-09-24 Maxwell Electronic Components Group, Inc. Methods and compositions for ionizing radiation shielding
US7382043B2 (en) 2002-09-25 2008-06-03 Maxwell Technologies, Inc. Method and apparatus for shielding an integrated circuit from radiation
US7696610B2 (en) 2003-07-16 2010-04-13 Maxwell Technologies, Inc. Apparatus for shielding integrated circuit devices

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5818459U (en) * 1981-07-31 1983-02-04 岸本　伊久男 lawn shears

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5591145A (en) * 1978-12-28 1980-07-10 Narumi China Corp Production of ceramic package
JPS5593239A (en) * 1979-01-04 1980-07-15 Nec Corp Semiconductor device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5591145A (en) * 1978-12-28 1980-07-10 Narumi China Corp Production of ceramic package
JPS5593239A (en) * 1979-01-04 1980-07-15 Nec Corp Semiconductor device

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4519050A (en) * 1982-06-17 1985-05-21 Intel Corporation Radiation shield for an integrated circuit memory with redundant elements
JPS5928362A (en) * 1982-07-22 1984-02-15 インタ−ナシヨナル　ビジネス　マシ−ンズ　コ−ポレ−シヨン Ceramic structure
JPS6354221B2 (en) * 1982-07-22 1988-10-27 Intaanashonaru Bijinesu Mashiinzu Corp
US6455864B1 (en) 1994-04-01 2002-09-24 Maxwell Electronic Components Group, Inc. Methods and compositions for ionizing radiation shielding
US7382043B2 (en) 2002-09-25 2008-06-03 Maxwell Technologies, Inc. Method and apparatus for shielding an integrated circuit from radiation
US7696610B2 (en) 2003-07-16 2010-04-13 Maxwell Technologies, Inc. Apparatus for shielding integrated circuit devices

Also Published As

Publication number Publication date
JPS5718344B2 (en) 1982-04-16

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