JPS54150078A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS54150078A
JPS54150078A JP5939578A JP5939578A JPS54150078A JP S54150078 A JPS54150078 A JP S54150078A JP 5939578 A JP5939578 A JP 5939578A JP 5939578 A JP5939578 A JP 5939578A JP S54150078 A JPS54150078 A JP S54150078A
Authority
JP
Japan
Prior art keywords
adhered
epoxy resin
size
flexible film
core component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5939578A
Other languages
Japanese (ja)
Inventor
Isao Fukuda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Instruments Inc
Original Assignee
Seiko Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Instruments Inc filed Critical Seiko Instruments Inc
Priority to JP5939578A priority Critical patent/JPS54150078A/en
Publication of JPS54150078A publication Critical patent/JPS54150078A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Abstract

PURPOSE: To minimize the size of the device by resin-sealing in opposition the two units of elements adhered to the flexible film containing the hole to store the semiconductor element.
CONSTITUTION: Semiconductor element 10 and 11 are adhered to lead 14 of flexible film 15 containing storing hole 13 via alloy layer 12. Element 10 and 11 are made to opposite to each other at the semiconductor side and then adhered 16 to core component 17 made of the metal, glass, epoxy resin or the like. Then the epoxy resin 18 is dropped down to give sealing. In such way, the size of the device is minimized, and at the same time the warp of the core component can be reduced greatly.
COPYRIGHT: (C)1979,JPO&Japio
JP5939578A 1978-05-18 1978-05-18 Semiconductor device Pending JPS54150078A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5939578A JPS54150078A (en) 1978-05-18 1978-05-18 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5939578A JPS54150078A (en) 1978-05-18 1978-05-18 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS54150078A true JPS54150078A (en) 1979-11-24

Family

ID=13112046

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5939578A Pending JPS54150078A (en) 1978-05-18 1978-05-18 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS54150078A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0439946A (en) * 1990-06-05 1992-02-10 Mitsubishi Electric Corp Semiconductor device
US5530292A (en) * 1990-03-15 1996-06-25 Fujitsu Limited Semiconductor device having a plurality of chips
US6472736B1 (en) * 2002-03-13 2002-10-29 Kingpak Technology Inc. Stacked structure for memory chips
SG121705A1 (en) * 2002-02-21 2006-05-26 United Test & Assembly Ct Ltd Semiconductor package

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5530292A (en) * 1990-03-15 1996-06-25 Fujitsu Limited Semiconductor device having a plurality of chips
JPH0439946A (en) * 1990-06-05 1992-02-10 Mitsubishi Electric Corp Semiconductor device
SG121705A1 (en) * 2002-02-21 2006-05-26 United Test & Assembly Ct Ltd Semiconductor package
US8288862B2 (en) 2002-02-21 2012-10-16 United Test & Assembly Center Limited Multiple die stack package
US6472736B1 (en) * 2002-03-13 2002-10-29 Kingpak Technology Inc. Stacked structure for memory chips

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