GB1258870A - - Google Patents

Info

Publication number
GB1258870A
GB1258870A GB1258870DA GB1258870A GB 1258870 A GB1258870 A GB 1258870A GB 1258870D A GB1258870D A GB 1258870DA GB 1258870 A GB1258870 A GB 1258870A
Authority
GB
United Kingdom
Prior art keywords
frame
substrate
sept
cooled
heated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of GB1258870A publication Critical patent/GB1258870A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Casings For Electric Apparatus (AREA)
  • Packaging Frangible Articles (AREA)

Abstract

1,258,870. Lead frames for semi-conductor devices. ITT INDUSTRIES Inc. 24 Sept., 1970 [29 Sept., 1969], No. 45504/70. Headings H1K and H1R. In a lead frame for a ceramic substrate supporting an integrated circuit chip 16, tabs 6 inclined to the plane of the frame are provided to align the frame with the substrate and hold them together during manufacture. The frame of nickel-iron-cobalt alloys can be made by standard deposition, photolithographic and etching techniques being deposited on a suitable substrate by evaporation or sputtering, or by punching or stamping out the desired pattern. The substrate is initially coated on one surface with glaze then heated and the frame and chip 16 positioned and then cooled. Connections are made by ultrasonic bonding techniques. A cover made of the same material as the substrate may be used and aligned with use of up-ended tabs 8. The package is heated and then cooled to form a strong mechanical and hermetic seal.
GB1258870D 1969-09-29 1970-09-24 Expired GB1258870A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US86196669A 1969-09-29 1969-09-29

Publications (1)

Publication Number Publication Date
GB1258870A true GB1258870A (en) 1971-12-30

Family

ID=25337244

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1258870D Expired GB1258870A (en) 1969-09-29 1970-09-24

Country Status (3)

Country Link
DE (1) DE2047458A1 (en)
FR (1) FR2062766A5 (en)
GB (1) GB1258870A (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3999955A (en) * 1975-07-15 1976-12-28 Allegheny Ludlum Industries, Inc. Strip for lead frames
GB2079534A (en) * 1980-07-02 1982-01-20 Fairchild Camera Instr Co Package for semiconductor devices
JPS5954249A (en) * 1982-09-22 1984-03-29 Fujitsu Ltd Semiconductor device

Also Published As

Publication number Publication date
FR2062766A5 (en) 1971-06-25
DE2047458A1 (en) 1971-04-08

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Legal Events

Date Code Title Description
PS Patent sealed
PLNP Patent lapsed through nonpayment of renewal fees