JPS56152243A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS56152243A
JPS56152243A JP5606580A JP5606580A JPS56152243A JP S56152243 A JPS56152243 A JP S56152243A JP 5606580 A JP5606580 A JP 5606580A JP 5606580 A JP5606580 A JP 5606580A JP S56152243 A JPS56152243 A JP S56152243A
Authority
JP
Japan
Prior art keywords
conveyed
semiconductor device
pellet
attracted
eliminated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5606580A
Other languages
Japanese (ja)
Inventor
Shigeo Iki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP5606580A priority Critical patent/JPS56152243A/en
Publication of JPS56152243A publication Critical patent/JPS56152243A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/291—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor

Abstract

PURPOSE:To eliminate a defect of a semiconductor device when a semiconductor substrate is conveyed by forming a magnetic metallic film on the substrate, holding it with holding means having magnetic force and conveying it to a die bonding unit. CONSTITUTION:A film of iron-base transformation metal is plated or vapor-deposited on the back surface of a die to improve the wettability with solder, is attracted by an electromagnet 11 or a permanent magnet 12 provided at a collet 4, is conveyed to a die bonding unit, is then bonded, is released from the magnet, and returned to the original position. Thus, a defect caused by solder chips when the pellet is attracted by vacuum can be eliminated, and a trouble such as electrodes shortcircuit on the pellet can be also eliminated, and the metal can be securely conveyed.
JP5606580A 1980-04-26 1980-04-26 Manufacture of semiconductor device Pending JPS56152243A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5606580A JPS56152243A (en) 1980-04-26 1980-04-26 Manufacture of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5606580A JPS56152243A (en) 1980-04-26 1980-04-26 Manufacture of semiconductor device

Publications (1)

Publication Number Publication Date
JPS56152243A true JPS56152243A (en) 1981-11-25

Family

ID=13016673

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5606580A Pending JPS56152243A (en) 1980-04-26 1980-04-26 Manufacture of semiconductor device

Country Status (1)

Country Link
JP (1) JPS56152243A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8347494B2 (en) 2008-10-02 2013-01-08 Fujitsu Limited Electronic component mounting method
FR3016474A1 (en) * 2014-01-14 2015-07-17 Commissariat Energie Atomique METHOD FOR PLACING AND BONDING CHIPS ON A RECEIVER SUBSTRATE

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8347494B2 (en) 2008-10-02 2013-01-08 Fujitsu Limited Electronic component mounting method
FR3016474A1 (en) * 2014-01-14 2015-07-17 Commissariat Energie Atomique METHOD FOR PLACING AND BONDING CHIPS ON A RECEIVER SUBSTRATE
WO2015107290A3 (en) * 2014-01-14 2015-09-11 Commissariat à l'énergie atomique et aux énergies alternatives Process for placing and bonding chips on a receiving substrate using a pad, by means of a magnetic, electrostatic or electromagnetic force

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