JPS556862A - Mounting structure of ic for electronic timepiece - Google Patents
Mounting structure of ic for electronic timepieceInfo
- Publication number
- JPS556862A JPS556862A JP7934378A JP7934378A JPS556862A JP S556862 A JPS556862 A JP S556862A JP 7934378 A JP7934378 A JP 7934378A JP 7934378 A JP7934378 A JP 7934378A JP S556862 A JPS556862 A JP S556862A
- Authority
- JP
- Japan
- Prior art keywords
- tin
- gold
- inner lead
- mounting structure
- electronic timepiece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
PURPOSE: To improve reliability as mounting for a timepiece, by plating only an inner lead portion and its vicinity of a film substrate with tin, and by gilding other portions with gold.
CONSTITUTION: An inner lead 12a or a conductive pattern 12b on a film substrate 11 in 0.4W1.0mm toward the outside from a device hole 26 and an IC 16 plated with tin with thickness optimum for gold-tin bonding are gold-tin bonded by a gold valve 15 and the inner lead 12a. This structure is sealed with resin 17 so as to cover a range of tin plating 13 after bonding.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7934378A JPS556862A (en) | 1978-06-29 | 1978-06-29 | Mounting structure of ic for electronic timepiece |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7934378A JPS556862A (en) | 1978-06-29 | 1978-06-29 | Mounting structure of ic for electronic timepiece |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS556862A true JPS556862A (en) | 1980-01-18 |
Family
ID=13687248
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7934378A Pending JPS556862A (en) | 1978-06-29 | 1978-06-29 | Mounting structure of ic for electronic timepiece |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS556862A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62196840A (en) * | 1986-02-24 | 1987-08-31 | Oki Electric Ind Co Ltd | Film carrier tape |
JPH02209742A (en) * | 1988-09-16 | 1990-08-21 | Natl Semiconductor Corp <Ns> | Gold/tin entectic bonding for tape automaization bonding process |
JPH05267546A (en) * | 1992-05-11 | 1993-10-15 | Kyushu Hitachi Maxell Ltd | Semiconductor device |
-
1978
- 1978-06-29 JP JP7934378A patent/JPS556862A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62196840A (en) * | 1986-02-24 | 1987-08-31 | Oki Electric Ind Co Ltd | Film carrier tape |
JPH06101492B2 (en) * | 1986-02-24 | 1994-12-12 | 沖電気工業株式会社 | Semiconductor device and manufacturing method thereof |
JPH02209742A (en) * | 1988-09-16 | 1990-08-21 | Natl Semiconductor Corp <Ns> | Gold/tin entectic bonding for tape automaization bonding process |
JPH05267546A (en) * | 1992-05-11 | 1993-10-15 | Kyushu Hitachi Maxell Ltd | Semiconductor device |
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