GB1088785A - Improvements in or relating to methods for joining a surface to an adjacent copper surface - Google Patents
Improvements in or relating to methods for joining a surface to an adjacent copper surfaceInfo
- Publication number
- GB1088785A GB1088785A GB27454/66A GB2745466A GB1088785A GB 1088785 A GB1088785 A GB 1088785A GB 27454/66 A GB27454/66 A GB 27454/66A GB 2745466 A GB2745466 A GB 2745466A GB 1088785 A GB1088785 A GB 1088785A
- Authority
- GB
- United Kingdom
- Prior art keywords
- heating
- temperature
- joining
- relating
- methods
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
Abstract
1,088,785. Soldering. PHILIPS ELECTRONIC & ASSOCIATED INDUSTRIES Ltd. June 20, 1966 [June 23, 1965], No. 27454/66. Heading B3R. In a method of bonding a surface to an adjacent copper surface indium is placed between the surfaces and heat applied to melt the indium and slowly to raise its temperature in a reducing atmosphere to above 350‹ C., heating being continued until an alloy is produced the melting point of which is equal to the temperature to which heating is carried out so that the alloy solidifies at this temperature to form the bond. In an example a copper plated aluminium surface is joined to a copper surface, heating being carried out up to 500‹ C. The method is applicable to the formation of suitable joints in vacuum equipment such as a waveguide or an image intensifier.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| NL6508010A NL6508010A (en) | 1965-06-23 | 1965-06-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1088785A true GB1088785A (en) | 1967-10-25 |
Family
ID=19793454
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB27454/66A Expired GB1088785A (en) | 1965-06-23 | 1966-06-20 | Improvements in or relating to methods for joining a surface to an adjacent copper surface |
Country Status (4)
| Country | Link |
|---|---|
| BE (1) | BE682882A (en) |
| ES (1) | ES328189A1 (en) |
| GB (1) | GB1088785A (en) |
| NL (1) | NL6508010A (en) |
-
1965
- 1965-06-23 NL NL6508010A patent/NL6508010A/xx unknown
-
1966
- 1966-06-20 GB GB27454/66A patent/GB1088785A/en not_active Expired
- 1966-06-21 BE BE682882D patent/BE682882A/xx unknown
- 1966-06-21 ES ES0328189A patent/ES328189A1/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| ES328189A1 (en) | 1967-04-01 |
| BE682882A (en) | 1966-12-21 |
| NL6508010A (en) | 1966-12-27 |
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