GB592733A - Improvements in or relating to methods of soldering metal details - Google Patents
Improvements in or relating to methods of soldering metal detailsInfo
- Publication number
- GB592733A GB592733A GB1362245A GB1362245A GB592733A GB 592733 A GB592733 A GB 592733A GB 1362245 A GB1362245 A GB 1362245A GB 1362245 A GB1362245 A GB 1362245A GB 592733 A GB592733 A GB 592733A
- Authority
- GB
- United Kingdom
- Prior art keywords
- gold
- disc
- copper
- soldering
- wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000005476 soldering Methods 0.000 title abstract 3
- 239000002184 metal Substances 0.000 title abstract 2
- 229910052751 metal Inorganic materials 0.000 title abstract 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract 5
- 239000010931 gold Substances 0.000 abstract 5
- 229910052737 gold Inorganic materials 0.000 abstract 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 3
- 229910052802 copper Inorganic materials 0.000 abstract 3
- 239000010949 copper Substances 0.000 abstract 3
- 239000011248 coating agent Substances 0.000 abstract 2
- 238000000576 coating method Methods 0.000 abstract 2
- 239000011888 foil Substances 0.000 abstract 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 abstract 2
- 229910001128 Sn alloy Inorganic materials 0.000 abstract 1
- 238000009713 electroplating Methods 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 abstract 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 abstract 1
- 239000001257 hydrogen Substances 0.000 abstract 1
- 229910052739 hydrogen Inorganic materials 0.000 abstract 1
- 239000000155 melt Substances 0.000 abstract 1
- 229910052759 nickel Inorganic materials 0.000 abstract 1
- 229910052757 nitrogen Inorganic materials 0.000 abstract 1
- 230000001590 oxidative Effects 0.000 abstract 1
- 229910052718 tin Inorganic materials 0.000 abstract 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N tin hydride Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J19/00—Details of vacuum tubes of the types covered by group H01J21/00
- H01J19/42—Mounting, supporting, spacing, or insulating of electrodes or of electrode assemblies
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2893/00—Discharge tubes and lamps
- H01J2893/0001—Electrodes and electrode systems suitable for discharge tubes or lamps
- H01J2893/0002—Construction arrangements of electrode systems
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Ceramic Products (AREA)
Abstract
592,733. Making electric discharge devices. STANDARD TELEPHONES & CABLES, Ltd., and SMYTH, C. N. May 30, 1945, No. 13622. [Classes 83 (ii) and 83 (iv)] Soldering.-Two metal parts of an electric discharge device are united by coating at least one of them with gold and then soldering by placing tin and tin alloy wire or foil in proximity to the joint so that it melts and flows during subsequent heat treatment. The gold may be applied by electroplating. The parts may be a tube seam or copper discs 1, 2 of electron discharge devices. The upper surface of the disc 1 and the lower surface of the disc 2 are provided with a coating or gold of 0.00001 to 0.00004 inches thickness and are soldered by a ring 5 of thin wire or foil placed round the circumference of the disc 2 and melted preferably in a vacuum, nitrogen, hydrogen or other non-oxidizing atmosphere. When joining in air the wire may also be coated with gold. In joining copper to nickel only one part, preferably the copper, need be gold coated.
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB592733A true GB592733A (en) | 1947-09-26 |
Family
ID=1729519
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB1362245A Expired GB592733A (en) | 1945-05-30 | Improvements in or relating to methods of soldering metal details |
Country Status (1)
| Country | Link |
|---|---|
| GB (1) | GB592733A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2828390A (en) * | 1953-09-24 | 1958-03-25 | Mc Graw Edison Co | Protectors for electric circuits |
| US2834101A (en) * | 1955-02-23 | 1958-05-13 | Curtiss Wright Corp | Method of brazing titanium |
| US2867899A (en) * | 1953-06-26 | 1959-01-13 | Itt | Method of soldering germanium diodes |
| US3209450A (en) * | 1962-07-03 | 1965-10-05 | Bell Telephone Labor Inc | Method of fabricating semiconductor contacts |
| US3225438A (en) * | 1957-12-23 | 1965-12-28 | Hughes Aircraft Co | Method of making alloy connections to semiconductor bodies |
| US3393446A (en) * | 1966-05-23 | 1968-07-23 | Philips Corp | Method for joining aluminum to metals |
-
1945
- 1945-05-30 GB GB1362245A patent/GB592733A/en not_active Expired
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2867899A (en) * | 1953-06-26 | 1959-01-13 | Itt | Method of soldering germanium diodes |
| US2828390A (en) * | 1953-09-24 | 1958-03-25 | Mc Graw Edison Co | Protectors for electric circuits |
| US2834101A (en) * | 1955-02-23 | 1958-05-13 | Curtiss Wright Corp | Method of brazing titanium |
| US3225438A (en) * | 1957-12-23 | 1965-12-28 | Hughes Aircraft Co | Method of making alloy connections to semiconductor bodies |
| US3209450A (en) * | 1962-07-03 | 1965-10-05 | Bell Telephone Labor Inc | Method of fabricating semiconductor contacts |
| US3393446A (en) * | 1966-05-23 | 1968-07-23 | Philips Corp | Method for joining aluminum to metals |
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