GB1397026A - Circuit board and method for manufacturing same - Google Patents

Circuit board and method for manufacturing same

Info

Publication number
GB1397026A
GB1397026A GB1362873A GB1362873A GB1397026A GB 1397026 A GB1397026 A GB 1397026A GB 1362873 A GB1362873 A GB 1362873A GB 1362873 A GB1362873 A GB 1362873A GB 1397026 A GB1397026 A GB 1397026A
Authority
GB
United Kingdom
Prior art keywords
wires
pad
bonded
electrode
pads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB1362873A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bendix Corp
Original Assignee
Bendix Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bendix Corp filed Critical Bendix Corp
Publication of GB1397026A publication Critical patent/GB1397026A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/222—Completing of printed circuits by adding non-printed jumper connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0286—Programmable, customizable or modifiable circuits
    • H05K1/0287—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10287—Metal wires as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Multi-Conductor Connections (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

1397026 Welding by pressure; soldering BENDIX CORP 21 March 1973 [27 March 1972] 13628/73 Heading B3R [Also in Division H1] A circuit board 2 carrying terminal pads 18, 20 interconnected by a plated-through hole 10 includes impulse bonded hard wires 24 on selected pads. The wires 24, e.g. of nickel, may be bonded electrically using a hollow electrode 26, and contacting the pad 20 with the other electrode 28. Alternatively, as shown, the other electrode may be situated on pad 18 during bonding, in electrical contact with pad 20 via plated hole 10. Electronic components may be mounted on one side of the board and have leads wave soldered in the holes 10, the wires being bonded on the other side. The pads 18, 20 may be of copper or stainless steel. The wire is termed "hard" to distinguish it from flexible, stranded wires.
GB1362873A 1972-03-27 1973-03-21 Circuit board and method for manufacturing same Expired GB1397026A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US23803072A 1972-03-27 1972-03-27

Publications (1)

Publication Number Publication Date
GB1397026A true GB1397026A (en) 1975-06-11

Family

ID=22896206

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1362873A Expired GB1397026A (en) 1972-03-27 1973-03-21 Circuit board and method for manufacturing same

Country Status (4)

Country Link
JP (1) JPS497760A (en)
DE (1) DE2314566A1 (en)
FR (1) FR2178014B1 (en)
GB (1) GB1397026A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6081996A (en) * 1998-10-23 2000-07-04 Delco Electronics Corporation Through hole circuit board interconnect

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5115485A (en) * 1974-07-30 1976-02-06 Nippon Steel Corp Ondobunpusokuteisochi
US5001657A (en) * 1986-06-24 1991-03-19 Minolta Camera Kabushiki Kaisha Radiation thermometer

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1073197B (en) * 1955-06-28 1960-01-14
US2985709A (en) * 1957-08-06 1961-05-23 Joseph P Mammola Means and method of mounting electronic components
US3202755A (en) * 1961-08-30 1965-08-24 Gen Precision Inc Welded circuit assembly and method of assembly

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6081996A (en) * 1998-10-23 2000-07-04 Delco Electronics Corporation Through hole circuit board interconnect

Also Published As

Publication number Publication date
FR2178014B1 (en) 1976-05-21
DE2314566A1 (en) 1973-10-11
JPS497760A (en) 1974-01-23
FR2178014A1 (en) 1973-11-09

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Legal Events

Date Code Title Description
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee